Patents by Inventor Hee-Suk Kim
Hee-Suk Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250214120Abstract: The present invention provides a substrate treatment method. The substrate treatment method may include washing a drying chamber including: wetting a dummy substrate with a chemical in a liquid treatment chamber; washing a treatment space of the drying chamber by loading the dummy substrate wet with the chemical into the drying chamber and then supplying supercritical fluid to the drying chamber; and performing bake treatment to reuse the dummy substrate used to wash the drying chamber.Type: ApplicationFiled: December 10, 2024Publication date: July 3, 2025Applicant: SEMES CO., LTD.Inventors: Hyung Seok KANG, Joon Ho WON, Anton KORIAKIN, Min Woo KIM, Geun Su LEE, Seung Un OH, Hee Suk KIM
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Publication number: 20240155842Abstract: A semiconductor memory device includes a lower stacked structure with lower metal lines on a substrate, an upper stacked structure with an upper metal line on the lower stacked structure, a vertical structure penetrating the upper and lower stacked structures and including a channel layer, a first cutting line through the upper and lower stacked structures, an upper supporter in a recess on the first cutting line, a second cutting line through the upper and lower stacked structures and spaced apart from the first cutting line, a sub-cutting line through the upper stacked structure while at least partially overlapping the vertical structure in the vertical direction, the sub-cutting line being between the first and second cutting lines, top surfaces of the upper supporter and sub-cutting line being coplanar, and a first interlayer insulating layer surrounding a sidewall of each of the upper supporter and the sub-cutting line.Type: ApplicationFiled: November 16, 2023Publication date: May 9, 2024Inventors: Hyo Joon RYU, Seo-Goo KANG, Hee Suk KIM, Jong Seon AHN, Kohji KANAMORI, Jee Hoon HAN
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Publication number: 20240084171Abstract: The present disclosure relates to an organic film polishing composition in which a high polishing speed is maintained not only for polymers, an SOC, and an SOH, but also for organic films strongly bonded by covalent bonds such as an amorphous carbon layer (ACL) or a diamond-like carbon (DLC) by including a polishing accelerator containing both a hydrophilic group and a hydrophobic group, and a polishing method using the same.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: Hee Suk KIM, Goo Hwa LEE, Jae Hong YOO, Jong Dai PARK, Jae Hyun KIM
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Patent number: 11910613Abstract: A semiconductor memory device includes a mold structure including a plurality of wordlines on a front side of a first substrate, and a string selection line and a stopper line on the plurality of wordlines. A channel structure extends in a vertical direction to penetrate the mold structure. A block separation area extends in a first direction to cut the mold structure. A protective structure is interposed between the block separation area and the stopper line and not between the block separation area and the string selection line and not between the block separation area and the plurality of wordlines. A string separation structure extends in the first direction to cut the string selection line and the stopper line. A bitline extends in a second direction on the mold structure. A bitline contact connects the channel structure and the bitline.Type: GrantFiled: November 18, 2021Date of Patent: February 20, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Hyo Joon Ryu, Hee Suk Kim, Jeong Yong Sung, Jee Hoon Han
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Publication number: 20220359557Abstract: A semiconductor memory device includes a mold structure including a plurality of wordlines on a front side of a first substrate, and a string selection line and a stopper line on the plurality of wordlines. A channel structure extends in a vertical direction to penetrate the mold structure. A block separation area extends in a first direction to cut the mold structure. A protective structure is interposed between the block separation area and the stopper line and not between the block separation area and the string selection line and not between the block separation area and the plurality of wordlines. A string separation structure extends in the first direction to cut the string selection line and the stopper line. A bitline extends in a second direction on the mold structure. A bitline contact connects the channel structure and the bitline.Type: ApplicationFiled: November 18, 2021Publication date: November 10, 2022Inventors: HYO JOON RYU, HEE SUK KIM, JEONG YONG SUNG, JEE HOON HAN
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Patent number: 11286713Abstract: A door having a finger pinch prevention function is provided that can prevent a finger jamming accident between a door frame and a door by making sure that there is no gap between the door frame and the door coupled to one side of the door frame, in the process of opening and closing the door. The door has an effect of preventing a finger from being caught because a gap does not occur in a corner portion where the door and a coupling frame abut, even when the door is opened or closed, by combining the coupling frame coupled to one side of the door frame and the door through a hinge. Furthermore, by configuring a cover in the corner portion where the coupling frame and the door abut, the hinge is not exposed to the outside, so that the appearance can be seen appealing.Type: GrantFiled: July 31, 2020Date of Patent: March 29, 2022Assignee: WOODS AIR CO., LTD.Inventors: Seo Yeon Kim, Hee Suk Kim, Gang Suk An, Dae Ii Kim, Ji Won Kim
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Publication number: 20220045096Abstract: A semiconductor memory device includes a lower stacked structure with lower metal lines on a substrate, an upper stacked structure with an upper metal line on the lower stacked structure, a vertical structure penetrating the upper and lower stacked structures and including a channel layer, a first cutting line through the upper and lower stacked structures, an upper supporter in a recess on the first cutting line, a second cutting line through the upper and lower stacked structures and spaced apart from the first cutting line, a sub-cutting line through the upper stacked structure while at least partially overlapping the vertical structure in the vertical direction, the sub-cutting line being between the first and second cutting lines, top surfaces of the upper supporter and sub-cutting line being coplanar, and a first interlayer insulating layer surrounding a sidewall of each of the upper supporter and the sub-cutting line.Type: ApplicationFiled: March 11, 2021Publication date: February 10, 2022Inventors: Hyo Joon RYU, Seo-Goo KANG, Hee Suk KIM, Jong Seon AHN, Kohji KANAMORI, Jee Hoon HAN
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Publication number: 20210277709Abstract: A door having a finger pinch prevention function is provided that can prevent a finger jamming accident between a door frame and a door by making sure that there is no gap between the door frame and the door coupled to one side of the door frame, in the process of opening and closing the door. The door has an effect of preventing a finger from being caught because a gap does not occur in a corner portion where the door and a coupling frame abut, even when the door is opened or closed, by combining the coupling frame coupled to one side of the door frame and the door through a hinge. Furthermore, by configuring a cover in the corner portion where the coupling frame and the door abut, the hinge is not exposed to the outside, so that the appearance can be seen appealing.Type: ApplicationFiled: July 31, 2020Publication date: September 9, 2021Applicant: WOODS AIR CO., LTD.Inventors: Seo Yeon Kim, Hee Suk Kim, Gang Suk An, Dae Il Kim, Ji Won Kim
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Patent number: 10604604Abstract: Multimodal polyolefin resins for manufacturing films, pipes, hollow molded articles having high melt strength and excellent formability, mechanical strength, processability and appearance are described. The resins have: density is 0.930-0.960 g/cm3; melt flow index is 0.01-10.0 g/10 minutes; ratio Mw/Mn is 10-60; and two or more peaks appear when molecular weight is measured by GPC. In molded pipe, the Mw of polymer collected at position B is 0.1% greater than Mw of polymer collected at position A; polymer having Mw of 10,000 or less among polymers collected at position A is 0.1% greater than the amount of polymer having Mw of 10,000 or less among polymers collected at position B; and the amount of polymer having Mw of 1,000,000 or more among polymers collected at position B is 0.1% greater than the amount of polymer having Mw of 1,000,000 or more among polymers collected at position A.Type: GrantFiled: October 27, 2016Date of Patent: March 31, 2020Assignee: DAELIM INDUSTRIAL CO., LTD.Inventors: Seung Tack Yu, Byung Keel Sohn, Yong Jae Jun, Young Shin Jo, Ki Soon Park, Jin Sook Oh, Sang Won Yu, Man Jung Kim, Dug Hoon Sung, Hee Suk Kim, Hae Guen Jeong
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Publication number: 20180305481Abstract: Multimodal polyolefin resins for manufacturing films, pipes, hollow molded articles having high melt strength and excellent formability, mechanical strength, processability and appearance are described. The resins have: density is 0.930-0.960 g/cm3; melt flow index is 0.01-10.0 g/10 minutes; ratio Mw/Mn is 10-60; and two or more peaks appear when molecular weight is measured by GPC. In molded pipe, the Mw of polymer collected at position B is 0.1% greater than Mw of polymer collected at position A; polymer having Mw of 10,000 or less among polymers collected at position A is 0.1% greater than the amount of polymer having Mw of 10,000 or less among polymers collected at position B; and the amount of polymer having Mw of 1,000,000 or more among polymers collected at position B is 0.1% greater than the amount of polymer having Mw of 1,000,000 or more among polymers collected at position A.Type: ApplicationFiled: October 27, 2016Publication date: October 25, 2018Inventors: Seung Tack YU, Byung Keel SOHN, Yong Jae JUN, Young Shin JO, Ki Soon PARK, Jin Sook OH, Sang Won YU, Man Jung KIM, Dug Hoon SUNG, Hee Suk KIM, Hae Guen JEONG
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Patent number: 9331283Abstract: The method of manufacturing nanoparticles of a target material includes mixing graphene oxide with an aqueous solvent to prepare an aqueous solution, mixing the target material with an organic solvent to prepare an organic solution, mixing the aqueous solution with the organic solution, and preparing nanoparticles of the target material by the graphene oxide.Type: GrantFiled: July 22, 2013Date of Patent: May 3, 2016Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Jung Ah Lim, Yong-Won Song, Jae-Min Hong, Dong Youn Yoo, Hee-Suk Kim
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Publication number: 20140061546Abstract: A method of manufacturing nanoparticles, nanoparticles, and an organic light emitting diode, a solar cell, a printing ink, a bioimaging device, and a sensor including the same are provided. The method of manufacturing nanoparticles of a target material includes mixing graphene oxide with an aqueous solvent to prepare an aqueous solution, mixing the target material with an organic solvent to prepare an organic solution, mixing the aqueous solution with the organic solution, and preparing nanoparticles of the target material by the graphene oxide.Type: ApplicationFiled: July 22, 2013Publication date: March 6, 2014Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Jung Ah Lim, Yong-Won Song, Jea-Min Hong, Dong Youn Yoo, Hee-Suk Kim
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Patent number: 7944363Abstract: An apparatus and method of sensing leakage of chemical liquid is provided. The apparatus for sensing leakage of chemical liquid, includes a sensing unit measuring a flow rate of chemical liquid being supplied to a process chamber, a process control unit judging whether leakage of the chemical liquid has occurred using the measured flow rate of the chemical liquid and generating a control signal, and an equipment control unit receiving an input of the control signal and controlling an operation of equipment.Type: GrantFiled: September 16, 2008Date of Patent: May 17, 2011Assignee: Semes Co., Ltd.Inventors: Hee-Suk Kim, Tai-Kweon Lim
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Publication number: 20100263908Abstract: Disclosed are a method for fabricating a conductive film, and a conductive film fabricated by the same. The method comprises: forming a mixed solution consisting of at least one of a metallic precursor and a conductive polymer; spraying atomized droplets of the mixed solution on a surface of a substrate so as to form conductive frames; and coupling carbon nanotubes to the conductive frames so as to enhance electric conductivity. Accordingly, the conductive film can have enhanced electric conductivity, and can be easily fabricated.Type: ApplicationFiled: October 8, 2009Publication date: October 21, 2010Inventors: Hyun-Jung LEE, Hee-Suk KIM, Sun-Young NOH, Sun-Na Hwang, Soon-Ho LIM, Min PARK, Jun-Kyung KIM
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Publication number: 20100266838Abstract: A method for fabricating a conductive film, and a conductive film fabricated by the same. The method comprises: preprocessing carbon nanotubes by at least one of a cutting step using ultrasonic wave, and a chemical reaction step with acid; dispersing the carbon nanotubes in a solvent; mixing metal wires with the carbon nanotubes dispersion solution; and forming an electrode layer by coating the mixed resultant on a substrate. Accordingly, can be easily fabricated the conductive film having high transmittance and high electric conductivity.Type: ApplicationFiled: October 8, 2009Publication date: October 21, 2010Inventors: Hyun-Jung LEE, Hee-Suk KIM, Jun-Kyung KIM, Kyoung-Ah OH, Seung-Woong NAM, Soon-Ho LIM
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Publication number: 20090091461Abstract: An apparatus and method of sensing leakage of chemical liquid is provided. The apparatus for sensing leakage of chemical liquid, includes a sensing unit measuring a flow rate of chemical liquid being supplied to a process chamber, a process control unit judging whether leakage of the chemical liquid has occurred using the measured flow rate of the chemical liquid and generating a control signal, and an equipment control unit receiving an input of the control signal and controlling an operation of equipment.Type: ApplicationFiled: September 16, 2008Publication date: April 9, 2009Inventors: Hee-Suk Kim, Tai-Kweon Lim
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Patent number: 7437836Abstract: An insole assembly for increasing the weight of footwear and a heavy footwear having an outsole and/or a midsole made of a high specific gravity compressed resin to enhance exercise effect. The insole assembly includes a lower insole made of a compressed resin having a high specific gravity; an upper insole laid on the lower insole and a shock-absorbing member attached to a heel of the lower insole. The insole assembly is made of a compressed resin to increase the weight of the footwear to which the insole assembly is applied.Type: GrantFiled: July 2, 2007Date of Patent: October 21, 2008Assignee: Aison Co., Ltd.Inventor: Hee Suk Kim
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Publication number: 20080203144Abstract: The present invention relates, in general, to shoes for measuring the quantity of motion and a method of measuring the quantity of motion using the shoes and, more particularly, to artificial intelligence shoes, in which various numerical values (calorie consumption, body fat, and a pulse), measured by a walking sensor (23), a body fat measurement unit, and a pulse sensor (21) mounted in a shoe body, are displayed in real time on a display unit (32), so that a user can periodically check his or her quantity of motion, and in which calorie consumption and body fat are calculated on the basis of the user's body conditions, so that the precision thereof is high, and such quantity of motion numerical values can be transmitted to various types of external devices, thus enabling the user to periodically manage the quantity of motion thereof.Type: ApplicationFiled: September 26, 2006Publication date: August 28, 2008Applicant: AISON CO., LTD.Inventor: Hee-Suk Kim
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Patent number: 7337562Abstract: A footwear insole that is put into a footwear when used includes an insole body put in the footwear, and a load-applying part installed on a rear portion of the insole body to apply load to a user wearing the footwear with the insole body. When the user uses the footwear insole of the present invention, since the weight of the footwear is increased, the user can obtain an effect similar to a case that he/she wears a sandbag or a lead jacket, thereby increasing the burning of calories and exercise effect.Type: GrantFiled: August 7, 2003Date of Patent: March 4, 2008Assignees: Aison Co., Ltd.Inventor: Hee-Suk Kim
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Patent number: D976878Type: GrantFiled: June 18, 2020Date of Patent: January 31, 2023Assignee: Tescom Company LimitedInventors: Hee Suk Kim, Ji Ho Lee