Patents by Inventor Hee-Suk Kim

Hee-Suk Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250214120
    Abstract: The present invention provides a substrate treatment method. The substrate treatment method may include washing a drying chamber including: wetting a dummy substrate with a chemical in a liquid treatment chamber; washing a treatment space of the drying chamber by loading the dummy substrate wet with the chemical into the drying chamber and then supplying supercritical fluid to the drying chamber; and performing bake treatment to reuse the dummy substrate used to wash the drying chamber.
    Type: Application
    Filed: December 10, 2024
    Publication date: July 3, 2025
    Applicant: SEMES CO., LTD.
    Inventors: Hyung Seok KANG, Joon Ho WON, Anton KORIAKIN, Min Woo KIM, Geun Su LEE, Seung Un OH, Hee Suk KIM
  • Publication number: 20240155842
    Abstract: A semiconductor memory device includes a lower stacked structure with lower metal lines on a substrate, an upper stacked structure with an upper metal line on the lower stacked structure, a vertical structure penetrating the upper and lower stacked structures and including a channel layer, a first cutting line through the upper and lower stacked structures, an upper supporter in a recess on the first cutting line, a second cutting line through the upper and lower stacked structures and spaced apart from the first cutting line, a sub-cutting line through the upper stacked structure while at least partially overlapping the vertical structure in the vertical direction, the sub-cutting line being between the first and second cutting lines, top surfaces of the upper supporter and sub-cutting line being coplanar, and a first interlayer insulating layer surrounding a sidewall of each of the upper supporter and the sub-cutting line.
    Type: Application
    Filed: November 16, 2023
    Publication date: May 9, 2024
    Inventors: Hyo Joon RYU, Seo-Goo KANG, Hee Suk KIM, Jong Seon AHN, Kohji KANAMORI, Jee Hoon HAN
  • Publication number: 20240084171
    Abstract: The present disclosure relates to an organic film polishing composition in which a high polishing speed is maintained not only for polymers, an SOC, and an SOH, but also for organic films strongly bonded by covalent bonds such as an amorphous carbon layer (ACL) or a diamond-like carbon (DLC) by including a polishing accelerator containing both a hydrophilic group and a hydrophobic group, and a polishing method using the same.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Hee Suk KIM, Goo Hwa LEE, Jae Hong YOO, Jong Dai PARK, Jae Hyun KIM
  • Patent number: 11910613
    Abstract: A semiconductor memory device includes a mold structure including a plurality of wordlines on a front side of a first substrate, and a string selection line and a stopper line on the plurality of wordlines. A channel structure extends in a vertical direction to penetrate the mold structure. A block separation area extends in a first direction to cut the mold structure. A protective structure is interposed between the block separation area and the stopper line and not between the block separation area and the string selection line and not between the block separation area and the plurality of wordlines. A string separation structure extends in the first direction to cut the string selection line and the stopper line. A bitline extends in a second direction on the mold structure. A bitline contact connects the channel structure and the bitline.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: February 20, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyo Joon Ryu, Hee Suk Kim, Jeong Yong Sung, Jee Hoon Han
  • Publication number: 20220359557
    Abstract: A semiconductor memory device includes a mold structure including a plurality of wordlines on a front side of a first substrate, and a string selection line and a stopper line on the plurality of wordlines. A channel structure extends in a vertical direction to penetrate the mold structure. A block separation area extends in a first direction to cut the mold structure. A protective structure is interposed between the block separation area and the stopper line and not between the block separation area and the string selection line and not between the block separation area and the plurality of wordlines. A string separation structure extends in the first direction to cut the string selection line and the stopper line. A bitline extends in a second direction on the mold structure. A bitline contact connects the channel structure and the bitline.
    Type: Application
    Filed: November 18, 2021
    Publication date: November 10, 2022
    Inventors: HYO JOON RYU, HEE SUK KIM, JEONG YONG SUNG, JEE HOON HAN
  • Patent number: 11286713
    Abstract: A door having a finger pinch prevention function is provided that can prevent a finger jamming accident between a door frame and a door by making sure that there is no gap between the door frame and the door coupled to one side of the door frame, in the process of opening and closing the door. The door has an effect of preventing a finger from being caught because a gap does not occur in a corner portion where the door and a coupling frame abut, even when the door is opened or closed, by combining the coupling frame coupled to one side of the door frame and the door through a hinge. Furthermore, by configuring a cover in the corner portion where the coupling frame and the door abut, the hinge is not exposed to the outside, so that the appearance can be seen appealing.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: March 29, 2022
    Assignee: WOODS AIR CO., LTD.
    Inventors: Seo Yeon Kim, Hee Suk Kim, Gang Suk An, Dae Ii Kim, Ji Won Kim
  • Publication number: 20220045096
    Abstract: A semiconductor memory device includes a lower stacked structure with lower metal lines on a substrate, an upper stacked structure with an upper metal line on the lower stacked structure, a vertical structure penetrating the upper and lower stacked structures and including a channel layer, a first cutting line through the upper and lower stacked structures, an upper supporter in a recess on the first cutting line, a second cutting line through the upper and lower stacked structures and spaced apart from the first cutting line, a sub-cutting line through the upper stacked structure while at least partially overlapping the vertical structure in the vertical direction, the sub-cutting line being between the first and second cutting lines, top surfaces of the upper supporter and sub-cutting line being coplanar, and a first interlayer insulating layer surrounding a sidewall of each of the upper supporter and the sub-cutting line.
    Type: Application
    Filed: March 11, 2021
    Publication date: February 10, 2022
    Inventors: Hyo Joon RYU, Seo-Goo KANG, Hee Suk KIM, Jong Seon AHN, Kohji KANAMORI, Jee Hoon HAN
  • Publication number: 20210277709
    Abstract: A door having a finger pinch prevention function is provided that can prevent a finger jamming accident between a door frame and a door by making sure that there is no gap between the door frame and the door coupled to one side of the door frame, in the process of opening and closing the door. The door has an effect of preventing a finger from being caught because a gap does not occur in a corner portion where the door and a coupling frame abut, even when the door is opened or closed, by combining the coupling frame coupled to one side of the door frame and the door through a hinge. Furthermore, by configuring a cover in the corner portion where the coupling frame and the door abut, the hinge is not exposed to the outside, so that the appearance can be seen appealing.
    Type: Application
    Filed: July 31, 2020
    Publication date: September 9, 2021
    Applicant: WOODS AIR CO., LTD.
    Inventors: Seo Yeon Kim, Hee Suk Kim, Gang Suk An, Dae Il Kim, Ji Won Kim
  • Patent number: 10604604
    Abstract: Multimodal polyolefin resins for manufacturing films, pipes, hollow molded articles having high melt strength and excellent formability, mechanical strength, processability and appearance are described. The resins have: density is 0.930-0.960 g/cm3; melt flow index is 0.01-10.0 g/10 minutes; ratio Mw/Mn is 10-60; and two or more peaks appear when molecular weight is measured by GPC. In molded pipe, the Mw of polymer collected at position B is 0.1% greater than Mw of polymer collected at position A; polymer having Mw of 10,000 or less among polymers collected at position A is 0.1% greater than the amount of polymer having Mw of 10,000 or less among polymers collected at position B; and the amount of polymer having Mw of 1,000,000 or more among polymers collected at position B is 0.1% greater than the amount of polymer having Mw of 1,000,000 or more among polymers collected at position A.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: March 31, 2020
    Assignee: DAELIM INDUSTRIAL CO., LTD.
    Inventors: Seung Tack Yu, Byung Keel Sohn, Yong Jae Jun, Young Shin Jo, Ki Soon Park, Jin Sook Oh, Sang Won Yu, Man Jung Kim, Dug Hoon Sung, Hee Suk Kim, Hae Guen Jeong
  • Publication number: 20180305481
    Abstract: Multimodal polyolefin resins for manufacturing films, pipes, hollow molded articles having high melt strength and excellent formability, mechanical strength, processability and appearance are described. The resins have: density is 0.930-0.960 g/cm3; melt flow index is 0.01-10.0 g/10 minutes; ratio Mw/Mn is 10-60; and two or more peaks appear when molecular weight is measured by GPC. In molded pipe, the Mw of polymer collected at position B is 0.1% greater than Mw of polymer collected at position A; polymer having Mw of 10,000 or less among polymers collected at position A is 0.1% greater than the amount of polymer having Mw of 10,000 or less among polymers collected at position B; and the amount of polymer having Mw of 1,000,000 or more among polymers collected at position B is 0.1% greater than the amount of polymer having Mw of 1,000,000 or more among polymers collected at position A.
    Type: Application
    Filed: October 27, 2016
    Publication date: October 25, 2018
    Inventors: Seung Tack YU, Byung Keel SOHN, Yong Jae JUN, Young Shin JO, Ki Soon PARK, Jin Sook OH, Sang Won YU, Man Jung KIM, Dug Hoon SUNG, Hee Suk KIM, Hae Guen JEONG
  • Patent number: 9331283
    Abstract: The method of manufacturing nanoparticles of a target material includes mixing graphene oxide with an aqueous solvent to prepare an aqueous solution, mixing the target material with an organic solvent to prepare an organic solution, mixing the aqueous solution with the organic solution, and preparing nanoparticles of the target material by the graphene oxide.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: May 3, 2016
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jung Ah Lim, Yong-Won Song, Jae-Min Hong, Dong Youn Yoo, Hee-Suk Kim
  • Publication number: 20140061546
    Abstract: A method of manufacturing nanoparticles, nanoparticles, and an organic light emitting diode, a solar cell, a printing ink, a bioimaging device, and a sensor including the same are provided. The method of manufacturing nanoparticles of a target material includes mixing graphene oxide with an aqueous solvent to prepare an aqueous solution, mixing the target material with an organic solvent to prepare an organic solution, mixing the aqueous solution with the organic solution, and preparing nanoparticles of the target material by the graphene oxide.
    Type: Application
    Filed: July 22, 2013
    Publication date: March 6, 2014
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jung Ah Lim, Yong-Won Song, Jea-Min Hong, Dong Youn Yoo, Hee-Suk Kim
  • Patent number: 7944363
    Abstract: An apparatus and method of sensing leakage of chemical liquid is provided. The apparatus for sensing leakage of chemical liquid, includes a sensing unit measuring a flow rate of chemical liquid being supplied to a process chamber, a process control unit judging whether leakage of the chemical liquid has occurred using the measured flow rate of the chemical liquid and generating a control signal, and an equipment control unit receiving an input of the control signal and controlling an operation of equipment.
    Type: Grant
    Filed: September 16, 2008
    Date of Patent: May 17, 2011
    Assignee: Semes Co., Ltd.
    Inventors: Hee-Suk Kim, Tai-Kweon Lim
  • Publication number: 20100263908
    Abstract: Disclosed are a method for fabricating a conductive film, and a conductive film fabricated by the same. The method comprises: forming a mixed solution consisting of at least one of a metallic precursor and a conductive polymer; spraying atomized droplets of the mixed solution on a surface of a substrate so as to form conductive frames; and coupling carbon nanotubes to the conductive frames so as to enhance electric conductivity. Accordingly, the conductive film can have enhanced electric conductivity, and can be easily fabricated.
    Type: Application
    Filed: October 8, 2009
    Publication date: October 21, 2010
    Inventors: Hyun-Jung LEE, Hee-Suk KIM, Sun-Young NOH, Sun-Na Hwang, Soon-Ho LIM, Min PARK, Jun-Kyung KIM
  • Publication number: 20100266838
    Abstract: A method for fabricating a conductive film, and a conductive film fabricated by the same. The method comprises: preprocessing carbon nanotubes by at least one of a cutting step using ultrasonic wave, and a chemical reaction step with acid; dispersing the carbon nanotubes in a solvent; mixing metal wires with the carbon nanotubes dispersion solution; and forming an electrode layer by coating the mixed resultant on a substrate. Accordingly, can be easily fabricated the conductive film having high transmittance and high electric conductivity.
    Type: Application
    Filed: October 8, 2009
    Publication date: October 21, 2010
    Inventors: Hyun-Jung LEE, Hee-Suk KIM, Jun-Kyung KIM, Kyoung-Ah OH, Seung-Woong NAM, Soon-Ho LIM
  • Publication number: 20090091461
    Abstract: An apparatus and method of sensing leakage of chemical liquid is provided. The apparatus for sensing leakage of chemical liquid, includes a sensing unit measuring a flow rate of chemical liquid being supplied to a process chamber, a process control unit judging whether leakage of the chemical liquid has occurred using the measured flow rate of the chemical liquid and generating a control signal, and an equipment control unit receiving an input of the control signal and controlling an operation of equipment.
    Type: Application
    Filed: September 16, 2008
    Publication date: April 9, 2009
    Inventors: Hee-Suk Kim, Tai-Kweon Lim
  • Patent number: 7437836
    Abstract: An insole assembly for increasing the weight of footwear and a heavy footwear having an outsole and/or a midsole made of a high specific gravity compressed resin to enhance exercise effect. The insole assembly includes a lower insole made of a compressed resin having a high specific gravity; an upper insole laid on the lower insole and a shock-absorbing member attached to a heel of the lower insole. The insole assembly is made of a compressed resin to increase the weight of the footwear to which the insole assembly is applied.
    Type: Grant
    Filed: July 2, 2007
    Date of Patent: October 21, 2008
    Assignee: Aison Co., Ltd.
    Inventor: Hee Suk Kim
  • Publication number: 20080203144
    Abstract: The present invention relates, in general, to shoes for measuring the quantity of motion and a method of measuring the quantity of motion using the shoes and, more particularly, to artificial intelligence shoes, in which various numerical values (calorie consumption, body fat, and a pulse), measured by a walking sensor (23), a body fat measurement unit, and a pulse sensor (21) mounted in a shoe body, are displayed in real time on a display unit (32), so that a user can periodically check his or her quantity of motion, and in which calorie consumption and body fat are calculated on the basis of the user's body conditions, so that the precision thereof is high, and such quantity of motion numerical values can be transmitted to various types of external devices, thus enabling the user to periodically manage the quantity of motion thereof.
    Type: Application
    Filed: September 26, 2006
    Publication date: August 28, 2008
    Applicant: AISON CO., LTD.
    Inventor: Hee-Suk Kim
  • Patent number: 7337562
    Abstract: A footwear insole that is put into a footwear when used includes an insole body put in the footwear, and a load-applying part installed on a rear portion of the insole body to apply load to a user wearing the footwear with the insole body. When the user uses the footwear insole of the present invention, since the weight of the footwear is increased, the user can obtain an effect similar to a case that he/she wears a sandbag or a lead jacket, thereby increasing the burning of calories and exercise effect.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: March 4, 2008
    Assignees: Aison Co., Ltd.
    Inventor: Hee-Suk Kim
  • Patent number: D976878
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: January 31, 2023
    Assignee: Tescom Company Limited
    Inventors: Hee Suk Kim, Ji Ho Lee