Patents by Inventor Heesuk WANG

Heesuk WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230148721
    Abstract: According to an embodiment of the present invention, an electronic device cover includes: a first plate that can be attached/detached to/from one surface of the electronic device; a second plate overlappingly coupled to the first plate; and a third plate which is connected to the second plate by a hinge and of which the angle formed with the first plate changes according to rotation with respect to the second plate, wherein the second plate and/or the third plate includes a composite material sheet, and at least a portion of the hinge can be positioned inside the composite material sheet. Other various embodiments are possible.
    Type: Application
    Filed: January 23, 2023
    Publication date: May 18, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wonseuk LEE, Heesuk WANG, Namhyun KANG, Minah KOH, Hakdo KIM, Sol LEE
  • Publication number: 20220142315
    Abstract: A cover and electronic device are disclosed herein. The cover is attachable to the electronic device, and includes: a first region covering a first portion of a first surface of the electronic device, when the cover is attached to the electronic device, a second region covering a second portion of the first surface of the electronic device, the second region adjacent to the first region, and a receiving part protruding from a surface of the first region of the cover and including a hollow for receiving an electronic pen, wherein the first region of the cover is pivotable relative to the second region of the cover, such that the first region of the cover is spaced away from the first surface of the electronic device while the second region of the cover contacts the first surface of the electronic device.
    Type: Application
    Filed: January 27, 2022
    Publication date: May 12, 2022
    Inventors: Heesuk WANG, Sunghan PARK, Wonseuk LEE