Patents by Inventor Hee-Sung AHN

Hee-Sung AHN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160247607
    Abstract: Disclosed herein are an apparatus for joining second-generation ReBCO high temperature superconducting wires and a joining method using the same which are capable of fabricating sufficiently long superconducting wires of a persistent current mode having almost zero resistance at the joint of the wires compared to the conventional non-superconducting joint by press-joining the ReBCO high temperature superconductor layers placed to make a direct surface contact with each other through melting diffusion or solid-state diffusion of a tiny portion of a material of the superconductor layers without a medium such as solder or a filler.
    Type: Application
    Filed: August 13, 2014
    Publication date: August 25, 2016
    Inventors: Young-Kun OH, Myung-Whon LEE, Hee-Sung AHN