Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.

Abstract: A storage device includes a first nonvolatile memory device, a second nonvolatile memory device, and a data line. The second nonvolatile memory device is of a different type from the first nonvolatile memory device. The data line is shared by the first nonvolatile memory device and the second nonvolatile memory device. First data is simultaneously provided to the first nonvolatile memory device and the second nonvolatile memory device through the data line, the first data is written to the second nonvolatile memory device, and the first data is reprogrammed into the first nonvolatile memory device by reading the first data from the second nonvolatile memory device and providing the read first data to the first nonvolatile memory device.

Abstract: A storage device includes a first nonvolatile memory device, a second nonvolatile memory device, and a data line. The second nonvolatile memory device is of a different type from the first nonvolatile memory device. The data line is shared by the first nonvolatile memory device and the second nonvolatile memory device. First data is simultaneously provided to the first nonvolatile memory device and the second nonvolatile memory device through the data line, the first data is written to the second nonvolatile memory device, and the first data is reprogrammed into the first nonvolatile memory device by reading the first data from the second nonvolatile memory device and providing the read first data to the first nonvolatile memory device.

Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.

Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.

Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.

Abstract: A method of operating a haptic-enabled electronic device includes detecting an input interaction between the haptic-enabled electronic device and a touchscreen-enabled electronic device selecting a vibration command in associated with the input, and vibrating the haptic-enabled electronic device in response to the vibration command.

Abstract: An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.

Abstract: A cover device having an input unit and a portable terminal having the cover device are provided. The cover device includes a cover unit divided into a plurality of areas, each area having an electrode. A connection surface is provided in the cover unit and configured to be detachably engaged with a terminal to which the cover unit is mounted. The input unit including an electrode line is configured to transmit a touch input signal to a touch panel of the terminal through an electrode of a touched area among the plurality of areas.

Abstract: A cover device having an input unit and a portable terminal having the cover device are provided. The cover device includes a cover unit divided into a plurality of areas, each area having an electrode. A connection surface is provided in the cover unit and configured to be detachably engaged with a terminal to which the cover unit is mounted. The input unit including an electrode line is configured to transmit a touch input signal to a touch panel of the terminal through an electrode of a touched area among the plurality of areas.

Abstract: A method of operating a haptic-enabled electronic device includes detecting an input interaction between the haptic-enabled electronic device and a touchscreen-enabled electronic device selecting a vibration command in associated with the input, and vibrating the haptic-enabled electronic device in response to the vibration command.

Abstract: An apparatus and a method for controlling touch sensitivity according to hydroplaning of a touch screen in an electronic device are provided. The method includes estimating whether a water film is generated on a surface of a touch screen in consideration of at least one of position information, humidity, and a temperature change of the electronic device and adjusting touch detection sensitivity of the touch screen when it is estimated that the water film is generated on the surface of the touch screen.

Abstract: Disclosed are a display apparatus and a control method thereof preventing boring and a trouble misunderstanding due to a mute screen supplied in changing an image signal, the display apparatus, including: a display unit which displays an image; an image processing unit which processes an input image signal to be displayed in the display unit, and displays a mute image in the display unit during a mute time when changing the input image signal; and a control unit which controls the image processing unit to gradually convert the total screen of the display unit displaying the input image signal to the mute image before displaying the mute image if a change signal for changing the input image signal is input.

Abstract: An apparatus for providing a photoresist material onto a substrate includes a lid housing at least one nozzle. A solvent supplying port inputs the solvent into the apparatus. A first solvent trap is provided below the nozzle and coupled to the solvent supplying port to hold a given amount of the solvent being input from the solvent supplying port. The first solvent trap is configured to prevent photoresist residues on the nozzle from being converted to powders. A second solvent trap is provided below the first solvent trap to receive the solvent from the first solvent trap. A solvent path is provided between the solvent trap and the solvent container to guide the solvent from the first solvent trap to the second solvent trap.

Abstract: Disclosed are a display apparatus and a control method thereof preventing boring and a trouble misunderstanding due to a mute screen supplied in changing an image signal, the display apparatus, including: a display unit which displays an image; an image processing unit which processes an input image signal to be displayed in the display unit, and displays a mute image in the display unit during a mute time when changing the input image signal; and a control unit which controls the image processing unit to gradually convert the total screen of the display unit displaying the input image signal to the mute image before displaying the mute image if a change signal for changing the input image signal is input.

Abstract: A mobile communication terminal having two keypads is provided. A mobile communication terminal comprises a first body having a left keypad installed at the left side of a front surface, and a second body having a display window installed at its left side and a right key installed at its right side, that is movably assembled with the front surface of the first body in the left or right direction. The mobile communication terminal may be used as a bar type communication terminal when the second body is not moved by sliding. If the left keypad of the first body is exposed by sliding down the second body, the two keypads are located at different sides of the display window, and thereby characters may be easily input with both hands. The two keypads arranged at different sides can each be or can both, be provided with a size large enough for individual character input.

Abstract: Provided are a semiconductor device, and a method of forming the same. In one embodiment, the semiconductor device includes a semiconductor layer, first and second semiconductor fins, an insulating layer, and an inter-fin connection member. The first and second semiconductor fins are placed on the semiconductor layer, and have different crystal directions. The first semiconductor fin is connected to the semiconductor layer, and has the equivalent crystal direction as that of the semiconductor layer. The insulating layer is interposed between the second semiconductor fin and the semiconductor layer, and has an opening in which the first semiconductor fin is inserted. The inter-fin connection member connects the first semiconductor fin and the second semiconductor fin together on the insulating layer.

Abstract: A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer on which the material is seated and fixed; a holder located above the indexer such that it can be raised and lowered; an attachment plate installed on a lower surface of the holder, having projections at positions corresponding to the mold caps of the material, and defined with grooves at positions corresponding to the ball lands of the material, in which the solder balls are placed; and eject pins arranged in the respective grooves of the attachment plate for conveying and dropping the solder balls through introduction and removal of vacuum.

Abstract: A nonvolatile memory device includes a semiconductor substrate, a charge-trap structure disposed on the semiconductor substrate, which includes an insulating film and a plurality of carbon nanocrystals embedded in the insulating film, and a gate disposed on the charge-trap structure. The nonvolatile memory device may exhibit memory hysteresis characteristics with improved reliability.