Patents by Inventor Heewon MIN

Heewon MIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136363
    Abstract: A pixel can include a light emitting diode; a driving transistor including a gate electrode connected to a first node between a high potential voltage line and a second node, the driving transistor being configured to drive the light emitting diode; a storage capacitor connected between the first node and a third node; a first transistor connected between the third node and a data line, the first transistor including a gate electrode connected to a scan signal line; a second transistor connected between the first node and the second node, and including a gate electrode connected to the scan signal line; a third transistor connected between the third node and a fourth node, the third transistor including a gate electrode connected to an emission signal line. Also, the pixel can include a voltage divider configured to internally generate a reference voltage and output the reference voltage to the fourth node.
    Type: Application
    Filed: September 8, 2023
    Publication date: April 25, 2024
    Applicant: LG Display Co., Ltd.
    Inventors: MyungSub LIM, SungJoon MIN, HaeYoon JUNG, Sujin HAM, YuRa JEONG, Heewon KIM
  • Publication number: 20240128279
    Abstract: A display device according to an exemplary embodiment of the present disclosure may include a lower substrate that is stretchable; a first adhesive layer disposed on the lower substrate; a pattern layer disposed on the first adhesive layer and including a plurality of first line patterns; a plurality of connection lines disposed on each of the plurality of first line patterns; and a filling layer covering the pattern layer and the plurality of connection lines, wherein the plurality of first line patterns include grooves disposed in lower portions thereof, so that the plurality of first line patterns and the plurality of connection lines are separated from the first adhesive layer and easily stretched.
    Type: Application
    Filed: September 12, 2023
    Publication date: April 18, 2024
    Inventors: YuRa JEONG, SungJoon MIN, HaeYoon JUNG, Sujin HAM, MyungSub LIM, Heewon KIM
  • Publication number: 20240100639
    Abstract: An electrostatic chuck includes a cooling plate having a cooling flow path, an insulating plate disposed on the cooling plate, an upper plate disposed on the insulating plate and fixed to the cooling plate, and a fastening member coupling the cooling plate to the upper plate. The fastening member passes through the cooling plate and is coupled to a fastening portion provided on a lower surface of the upper plate. Movement of the fastening member is constrained only in a first direction intersecting an upper surface of the upper plate.
    Type: Application
    Filed: August 14, 2023
    Publication date: March 28, 2024
    Inventors: INSEOK SEO, MINSUNG KIM, DASOM LEE, HEEWON MIN, DONGYUN YEO
  • Publication number: 20240087358
    Abstract: A processor-implemented method includes generating a preprocessed infrared (IR) image by performing first preprocessing based on an IR image including an object; generating a preprocessed depth image by performing second preprocessing based on a depth image including the object; and determining whether the object is a genuine object based on the preprocessed IR image and the preprocessed depth image
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youngjun KWAK, Minsu KO, Youngsung KIM, Heewon KIM, Ju Hwan SONG, Byung In YOO, Seon Min RHEE, Yong-il LEE, Jiho CHOI, Seungju HAN
  • Patent number: 11404252
    Abstract: An electrostatic chuck includes a chuck plate configured to mount a substrate, an insulation pillar provided outside the chuck plate, the insulation pillar having a pin hole formed therein, a first movable ring provided on the insulation pillar, surrounding a side of the chuck plate, a second movable ring configured to cover at least a part of an upper portion of the first movable ring, and a driving pin configured to move in the pin hole of the insulation pillar in a vertical direction, the driving pin overlapped by at least a part of the first movable ring and at least a part of the second movable ring in the vertical direction. The driving pin is configured to drive the first movable ring and the second movable ring in the vertical direction or to drive the second movable ring in the vertical direction.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: August 2, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byeongsang Kim, Keonwoo Kim, Eungsu Kim, Hakyoung Kim, Heewon Min, Kyeongtea Bang, Seungwon Shin, Dongyun Yeo, Hyanjung Lee, Kyeongseok Jeong
  • Publication number: 20210159112
    Abstract: A lift apparatus for moving an object up and down in a substrate processing apparatus, the lift apparatus including a body configured to support the object while a lift hole, included in the body, is overlapped by the object in a vertical direction; a lift pin configured to move the object up and down by moving up and down in the lift hole; a bellows including an upper flange, a lower flange, and a flexible pipe; a connector combined with a lower portion of the lift pin in the flexible pipe and configured to interfere with downward movement of the lift pin and to allow at least one from among rotation, sliding, and tilting of the lift pin; a load sensor configured to measure vertical load generated in accordance with movement of the lift pin; and an actuator configured to move the lift pin up and down.
    Type: Application
    Filed: June 8, 2020
    Publication date: May 27, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byeongsang Kim, Keonwoo Kim, Wooram Kim, Eungsu Kim, Heewon Min, Sangwook Park, Seungwon Shin, Dongyun Yeo, Geunsik Oh, Hyanjung Lee
  • Publication number: 20210111007
    Abstract: An electrostatic chuck includes a chuck plate configured to mount a substrate, an insulation pillar provided outside the chuck plate, the insulation pillar having a pin hole formed therein, a first movable ring provided on the insulation pillar, surrounding a side of the chuck plate, a second movable ring configured to cover at least a part of an upper portion of the first movable ring, and a driving pin configured to move in the pin hole of the insulation pillar in a vertical direction, the driving pin overlapped by at least a part of the first movable ring and at least a part of the second movable ring in the vertical direction. The driving pin is configured to drive the first movable ring and the second movable ring in the vertical direction or to drive the second movable ring in the vertical direction.
    Type: Application
    Filed: May 4, 2020
    Publication date: April 15, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byeongsang KIM, Keonwoo KIM, Eungsu KIM, Hakyoung KIM, Heewon MIN, Kyeongtea BANG, Seungwon SHIN, Dongyun YEO, Hyanjung LEE, Kyeongseok JEONG