Patents by Inventor Heeyoub KANG

Heeyoub KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200395256
    Abstract: A semiconductor package includes a semiconductor chip and a polydimethylsiloxane (PDMS) layer that is provided on the semiconductor chip and of which upper surface is exposed to the outside. Since the semiconductor package may include the PDMS layer, heat emitting performance of the semiconductor package in a vacuum state may improve.
    Type: Application
    Filed: January 20, 2020
    Publication date: December 17, 2020
    Applicant: Korea Advanced Institute of Science and Technology
    Inventors: Eung chang LEE, Heeyoub KANG, Haejung YANG, Youngrok OH, Kitaek LEE, Bong jae LEE
  • Patent number: 10840221
    Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: November 17, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ilsoo Kim, Heeyoub Kang, Young-Rok Oh, Kitaek Lee, Hwi-Jong Yoo
  • Patent number: 10713105
    Abstract: An operating method of a memory controller to control a nonvolatile memory device includes receiving information about operation failure from the nonvolatile memory device, receiving lock-out status information from the nonvolatile memory device, determining whether a lock-out signal is output based on the lock-out status information, and determining a failure block corresponding to the information about the operation failure as a normal block or a bad block depending on the determination result.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: July 14, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwangkyu Bang, Young-Seop Shim, Heeyoub Kang, Kyungduk Lee
  • Publication number: 20200176423
    Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
    Type: Application
    Filed: February 6, 2020
    Publication date: June 4, 2020
    Inventors: ILSOO KIM, HEEYOUB KANG, YOUNG-ROK OH, KITAEK LEE, HWI-JONG YOO
  • Patent number: 10593648
    Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: March 17, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ilsoo Kim, Heeyoub Kang, Young-Rok Oh, Kitaek Lee, Hwi-Jong Yoo
  • Patent number: 10529692
    Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: January 7, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ilsoo Kim, Heeyoub Kang, Young-Rok Oh, Kitaek Lee, Hwi-Jong Yoo
  • Patent number: 10317922
    Abstract: A power supply management circuit manages transfer of power that is supplied to a peripheral device from a power supply device. The power supply management circuit includes a current limiter and one or more capacitors. The current limiter limits intensity of first current received from the power supply device through an input terminal to be smaller than or equal to limitation intensity, and outputs second current having intensity limited to be smaller than or equal to the limitation intensity through an output terminal connected to the peripheral device. When the intensity of the first current exceeds the limitation intensity, the capacitors output third current through the output terminal.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: June 11, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Iksung Park, Heeyoub Kang, Kyoungeun Lee
  • Publication number: 20190079816
    Abstract: An operating method of a memory controller to control a nonvolatile memory device includes receiving information about operation failure from the nonvolatile memory device, receiving lock-out status information from the nonvolatile memory device, determining whether a lock-out signal is output based on the lock-out status information, and determining a failure block corresponding to the information about the operation failure as a normal block or a bad block depending on the determination result.
    Type: Application
    Filed: April 25, 2018
    Publication date: March 14, 2019
    Inventors: KWANGKYU BANG, YOUNG-SEOP SHIM, HEEYOUB KANG, KYUNGDUK LEE
  • Patent number: 10212808
    Abstract: Disclosed is a printed circuit hoard. The printed circuit board includes a plurality of insulation layers and a plurality of pattern layers alternately stacked. The printed circuit board includes a plurality of device areas on which semiconductor packages are mounted and a peripheral area adjacent the device areas. An electrostatic discharge pattern is in a respective pattern layer among the plurality of pattern layers and is disposed at a boundary region between a respective device area of the plurality of device areas and the peripheral area.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: February 19, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Iksung Park, Heeyoub Kang, Young-Min Kim, Eunji You, Hwi-jong Yoo
  • Patent number: 10175667
    Abstract: A storage device may include a nonvolatile memory including a plurality of memory blocks and a memory controller configured to determine a comparison between an idle current value of the nonvolatile memory and a reference current value and to adjust, based on the comparison, a start temperature at which the storage device begins operating speed control of the storage device.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: January 8, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwangkyu Bang, Heeyoub Kang, HyoJae Bang, Kitaek Lee
  • Publication number: 20180323175
    Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
    Type: Application
    Filed: July 2, 2018
    Publication date: November 8, 2018
    Inventors: ILSOO KIM, HEEYOUB KANG, YOUNG-ROK OH, KITAEK LEE, HWI-JONG YOO
  • Publication number: 20180158492
    Abstract: A storage device includes memories and a controller. The controller controls first and second program operations on the memory. When a temperature of the memory is lower than a reference value, the controller controls execution of the first program operation. When the temperature of the memory is equal to or higher than the reference value, the controller controls execution of the second program operation which consumes a smaller amount of power than the first program operation. The controller adjusts an operational condition of the memory such that bandwidth on the memory remains equivalent during the first and second program operations.
    Type: Application
    Filed: June 19, 2017
    Publication date: June 7, 2018
    Inventors: Sangsu LEE, Yusuf CINAR, Nam-Hoon KIM, Heeyoub KANG, Young-Rok OH
  • Patent number: 9990964
    Abstract: A storage device includes memories and a controller. The controller controls first and second program operations on the memory. When a temperature of the memory is lower than a reference value, the controller controls execution of the first program operation. When the temperature of the memory is equal to or higher than the reference value, the controller controls execution of the second program operation which consumes a smaller amount of power than the first program operation. The controller adjusts an operational condition of the memory such that bandwidth on the memory remains equivalent during the first and second program operations.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: June 5, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sangsu Lee, Yusuf Cinar, Nam-Hoon Kim, Heeyoub Kang, Young-Rok Oh
  • Publication number: 20180138154
    Abstract: A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
    Type: Application
    Filed: November 14, 2017
    Publication date: May 17, 2018
    Inventors: ILSOO KIM, HEEYOUB KANG, YOUNG-ROK OH, KITAEK LEE, HWI-JONG YOO
  • Publication number: 20170060158
    Abstract: A power supply management circuit manages transfer of power that is supplied to a peripheral device from a power supply device. The power supply management circuit includes a current limiter and one or more capacitors. The current limiter limits intensity of first current received from the power supply device through an input terminal to be smaller than or equal to limitation intensity, and outputs second current having intensity limited to be smaller than or equal to the limitation intensity through an output terminal connected to the peripheral device. When the intensity of the first current exceeds the limitation intensity, the capacitors output third current through the output terminal.
    Type: Application
    Filed: July 29, 2016
    Publication date: March 2, 2017
    Inventors: IKSUNG PARK, Heeyoub Kang, Kyoungeun Lee
  • Publication number: 20170052551
    Abstract: A storage device may include a nonvolatile memory including a plurality of memory blocks and a memory controller configured to determine a comparison between an idle current value of the nonvolatile memory and a reference current value and to adjust, based on the comparison, a start temperature at which the storage device begins operating speed control of the storage device.
    Type: Application
    Filed: April 14, 2016
    Publication date: February 23, 2017
    Inventors: Kwangkyu BANG, Heeyoub KANG, HyoJae BANG, Kitaek LEE
  • Publication number: 20170048970
    Abstract: Disclosed is a printed circuit hoard. The printed circuit board includes a plurality of insulation layers and a plurality of pattern layers alternately stacked, The printed circuit board includes a plurality of device areas on which semiconductor packages are mounted and a peripheral area adjacent the device areas. An electrostatic discharge pattern is in a respective pattern layer among the plurality of pattern layers and is disposed at a boundary region between a respective device area of the plurality of device areas and the peripheral area.
    Type: Application
    Filed: April 7, 2016
    Publication date: February 16, 2017
    Inventors: Iksung Park, Heeyoub KANG, Young-Min KIM, Eunji YOU, Hwi-jong YOO
  • Patent number: 9437518
    Abstract: A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: September 6, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaebum Byun, Heeyoub Kang, Dongok Kwak, Junghoon Kim, Joonyoung Oh, Won-Hwa Lee, Jae-Woo Jeong, Jinyoung Choi
  • Publication number: 20140117528
    Abstract: A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.
    Type: Application
    Filed: October 29, 2013
    Publication date: May 1, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaebum BYUN, Heeyoub KANG, Dongok KWAK, Junghoon KIM, Joonyoung OH, Won-Hwa LEE, Jae-Woo JEONG, Jinyoung CHOI