Patents by Inventor Hegen ZHANG

Hegen ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12114436
    Abstract: A composite circuit board includes a flexible board, rigid boards, adhesive layers, and protection glue; the adhesive layers are sandwiched between the rigid boards and the flexible board and used for bonding the rigid boards and the flexible board; the rigid boards are provided with step slots passing through the rigid boards; the adhesive layers are provided with through slots passing through the adhesive layers; the step slots and the through slots are communicated with each other to form a thinning recess; the thinning recess exposes the flexible board; and the protection glue covers steps of the thinning recess and at least a portion of the exposed area of the flexible board.
    Type: Grant
    Filed: November 10, 2022
    Date of Patent: October 8, 2024
    Assignee: SHENNAN CIRCUITS CO., LTD.
    Inventors: Zhicheng Yang, Xianyou Deng, Jinfeng Liu, Hegen Zhang, Tao Luo, Zhishen Wang
  • Patent number: 11641719
    Abstract: The present disclosure provides a printed circuit board and a manufacturing method of the printed circuit board. The manufacturing method may include: at least two core plates may be provided; a composite anti-glue film assembly may be arranged at a preset position of one of the at least two core plates, the composite anti-glue film assembly may include a first anti-glue film layer, a second anti-glue film layer and a bonding layer. The first anti-glue film layer may contact the preset position. The first anti-glue film layer may be a polyimide layer. The bonding layer may be configured to bond the first anti-glue film layer and the second anti-glue film layer together to produce the composite anti-glue film assembly. Two adjacent core plates may be connected through a medium layer. The core plates may be cut-out and form the printed circuit board.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: May 2, 2023
    Assignee: SHENNAN CIRCUITS CO., LTD.
    Inventors: Hegen Zhang, Xianyou Deng, Jinfeng Liu, Fuyu Xiang, Bo Wang, Zhicheng Yang
  • Publication number: 20230072239
    Abstract: A composite circuit board includes a flexible board, rigid boards, adhesive layers, and protection glue; the adhesive layers are sandwiched between the rigid boards and the flexible board and used for bonding the rigid boards and the flexible board; the rigid boards are provided with step slots passing through the rigid boards; the adhesive layers are provided with through slots passing through the adhesive layers; the step slots and the through slots are communicated with each other to form a thinning recess; the thinning recess exposes the flexible board; and the protection glue covers steps of the thinning recess and at least a portion of the exposed area of the flexible board.
    Type: Application
    Filed: November 10, 2022
    Publication date: March 9, 2023
    Inventors: ZHICHENG YANG, XIANYOU DENG, JINFENG LIU, HEGEN ZHANG, TAO LUO, ZHISHEN WANG
  • Publication number: 20210204413
    Abstract: The present disclosure provides a printed circuit board and a manufacturing method of the printed circuit board. The manufacturing method may include: at least two core plates may be provided; a composite anti-glue film assembly may be arranged at a preset position of one of the at least two core plates, the composite anti-glue film assembly may include a first anti-glue film layer, a second anti-glue film layer and a bonding layer. The first anti-glue film layer may contact the preset position. The first anti-glue film layer may be a polyimide layer. The bonding layer may be configured to bond the first anti-glue film layer and the second anti-glue film layer together to produce the composite anti-glue film assembly. Two adjacent core plates may be connected through a media layer. The core plates may be cut-out and form the printed circuit board.
    Type: Application
    Filed: November 20, 2020
    Publication date: July 1, 2021
    Inventors: Hegen ZHANG, Xianyou DENG, Jinfeng LIU, Fuyu XIANG, Bo WANG, Zhicheng YANG