Abstract: A camera module is manufactured by attaching a lens module to an image sensor. The lens module includes at least one lens element which has a plurality of centers of curvature. A tilt angle of an imaging axis of the image sensor is determined, and a tilt angle of an optical axis of the lens module is also determined by using an optical device to identify locations of multiple centers of curvature of the at least one lens element included in the lens module. At least one of the lens module and the image sensor are then adjusted accordingly so that the imaging axis and the optical axis are aligned, and thereafter, the lens module is fixedly attached with respect to the image sensor to form the camera module.

Abstract: An alignment apparatus for aligning a lens module with respect to an image sensor includes a holographic film including a test chart pattern from which a virtual image of the test chart pattern may be generated, and a light source for illuminating the holographic film. An image sensor holder is provided for mounting the image sensor and a lens module holder is configured and positioned for mounting the lens module between the holographic film and the image sensor such that the virtual image of the test chart pattern is viewable by the image sensor through the lens module. The virtual image thus viewable by the image sensor through the lens module is located at a virtual distance from the image sensor that is different from a physical position of the holographic film for aligning the lens module with respect to the image sensor.

Abstract: An imaging device testing system has a light receiver for receiving light from an imaging device under test, a light emitter for returning the light back to the imaging device under test, and first and second transceiver tables movable relative to each other. The first transceiver table has a first light redirecting module for receiving the light from the light receiver and the second transceiver table comprising a second light redirecting module for transmitting the light to the light emitter. The first and second light redirecting modules are positionable to simulate a distance travelled by the light from the light receiver, through the first and second light redirecting modules and a gap between the first and second light redirecting modules, to the light emitter.

Abstract: An imaging device testing system has a light receiver for receiving light from an imaging device under test, a light emitter for returning the light back to the imaging device under test, and first and second transceiver tables movable relative to each other. The first transceiver table has a first light redirecting module for receiving the light from the light receiver and the second transceiver table comprising a second light redirecting module for transmitting the light to the light emitter. The first and second light redirecting modules are positionable to simulate a distance travelled by the light from the light receiver, through the first and second light redirecting modules and a gap between the first and second light redirecting modules, to the light emitter.

Abstract: A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired operational position of the bonding tool is superimposed onto the display screen and the position of the bonding tool is adjusted with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool.

Abstract: A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired operational position of the bonding tool is superimposed onto the display screen and the position of the bonding tool is adjusted with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool.

Abstract: A wire is bonded to a target surface using a rotary bond head by positioning a wedge bonding tool of the bond head over the target surface. A camera system is tilted at an oblique angle relative to an arrangement of the bond head to conduct pattern recognition of bonding points on the target surface for determining actual positions of the bonding points and an orientation between the actual positions of first and second bonding points. The bond head is moved to the actual position of the first bonding point and rotated to the determined orientation. Thereafter, the wire is bonded to the target surface at the first bonding point with the bond head.