Patents by Inventor Hei Leng LIM

Hei Leng LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190033007
    Abstract: In one example, a heat pipe. The heat pipe includes a sealed, hollow, thermally conductive casing. A wick is disposed on interior walls of the casing. The wick includes an aerogel of carbon nanotubes and graphene. A working fluid is disposed in a cavity defined by the casing and the wick.
    Type: Application
    Filed: April 21, 2016
    Publication date: January 31, 2019
    Inventors: Kuan-Ting WU, Chi-Hao CHANG, Kuo-Chih HUANG, Hei Leng LIM, Kevin VOSS