Patents by Inventor Hei Wong

Hei Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5893587
    Abstract: A tamper indicating label including an upper sheet having an adhesive lower surface detachably attached to a backing sheet and divided into separable sections by a weakened line such that indicia such as the user's signature can be inscribed on the face of the sheet and across the weakened line such that one of the sections can be separated from the backing sheet and applied to the opening seam of an article such as a suitcase and the remaining section utilized as a receipt.
    Type: Grant
    Filed: August 12, 1997
    Date of Patent: April 13, 1999
    Inventor: Ka Hei Wong
  • Patent number: D385901
    Type: Grant
    Filed: October 17, 1996
    Date of Patent: November 4, 1997
    Inventor: Ka Hei Wong