Patents by Inventor Heico J. Frima

Heico J. Frima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4606490
    Abstract: Apparatus and method for determining if a lead bond created by an ultrasonic transducer has the characteristics of a good bond. The current supplied to the transducer is monitored and the envelope of the supplied current is sampled periodically and supplied to a computing means. The computing compares selected characteristics of the sampled signal with characteristics previously determined to create good lead bonding. The results of this comparison are stored in a bond quality control data processing system and supplied to a host data processing system. The host data processing system can take appropriate action. The bond quality control data processing system can control the power supplied to the ultrasonic transducer to provide better characteristics.
    Type: Grant
    Filed: August 24, 1982
    Date of Patent: August 19, 1986
    Assignee: ASM Assembly Automation Limited
    Inventors: Lo Kwan Chan, Heico J. Frima
  • Patent number: 4419561
    Abstract: An electron beam source including a longitudinally-displaceable cathode wire having one side disposed nearby an apertured anode for emitting electrons through the aperture during heating of the wire by an energy beam. The emitting side is flattened to limit divergence of the emitted electrons.
    Type: Grant
    Filed: December 18, 1981
    Date of Patent: December 6, 1983
    Assignee: U.S. Philips Corporation
    Inventors: Heico J. Frima, Jan B. Le Poole