Patents by Inventor Heidi L. Reynolds

Heidi L. Reynolds has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compliant and hermetic solder seal
    Patent number: 6958446
    Abstract: A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 ?m and preferably about 5 ?m) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.
    Type: Grant
    Filed: April 17, 2002
    Date of Patent: October 25, 2005
    Assignee: Agilent Technologies, Inc.
    Inventors: Giles Humpston, Yoshikatsu Ichimura, Nancy M. Mar, Daniel J. Miller, Michael J. Nystrom, Heidi L. Reynolds, Gary R. Trott
  • Compliant and hermetic solder seal
    Publication number: 20030198428
    Abstract: A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 &mgr;m and preferably about 5 &mgr;m) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.
    Type: Application
    Filed: April 17, 2002
    Publication date: October 23, 2003
    Inventors: Giles Humpston, Yoshikatsu Ichimura, Nancy M. Mar, Daniel J. Miller, Michael J. Nystrom, Heidi L. Reynolds, Gary R. Trott