Patents by Inventor Heidi Linch Reynolds

Heidi Linch Reynolds has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9039302
    Abstract: An interposer comprising: (a) a planar substrate having top and bottom surfaces, said bottom surface defining at least one ferrule alignment structure, and one or more fiber bores extending from said bottom surface to said top surface, each fiber bore being in a certain position relative to said ferrule alignment structure and adapted to receive a fiber; (b) one or more lenses on or near said top surface, each lens aligned with one of said fiber bores; (c) at least one ferrule having an end face and comprising one or more fibers protruding from said end face, and at least one alignment feature cooperating with said ferrule alignment structure to position said ferrule precisely on said bottom surface such that said fibers are disposed in said fiber bores and are optically coupled with said lenses; and (d) at least one optical component having one or more optical interfaces and being mounted on said top surface such that each of said optical interfaces is aligned with one of said fiber bores and is optically co
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: May 26, 2015
    Assignee: Tyco Electronics Corporation
    Inventors: Terry Patrick Bowen, Heidi Linch Reynolds
  • Patent number: 7223609
    Abstract: Arrays are provided for multiplexed evanescent scanning by allowing for high-contrast Surface Plasmon Resonance images thereof. The arrays target features are typically biopolymeric in nature, though they may be any sort of chemical or ligand. The type of scanning is such that there is no need for probe labeling. As no labeling is required, a broader range of applications than otherwise possible is facilitated. In the subject arrays, target features are set upon a noble metal film deposited on a substrate. Interfeature areas are adapted to trap, divert and/or bleed-away light so that light directed through the substrate will not be reflected by those areas and interfere with evanescent scanning of the reflective areas upon which intended target features are provided. Geometric and materials-based light attenuating features are contemplated. Arrays as described, hardware and software as required for reading such arrays, and associated methodology are covered.
    Type: Grant
    Filed: August 14, 2003
    Date of Patent: May 29, 2007
    Assignee: Agilent Technologies, Inc.
    Inventors: David Anvar, Heidi Linch Reynolds