Abstract: The present invention relates to a surface mounting crystal oscillator in which an IC chip, a crystal element, and a circuit component are connected together by wire bonding and are housed within a main container having a concave section. The main container has a pair of opposing inner wall step portions along both sides in the longitudinal direction, and this pair of inner wall step portions are also each divided into an upper step portion and a lower-step portion of different heights along the longitudinal direction. At least one of the upper step portions of the pair of inner wall step portions supports one end portion in the lengthwise direction of the crystal element so that the lengthwise direction of the crystal element is aligned in the widthwise direction of the main container. The circuit component is disposed on an inner base surface of the main container below the crystal element.

Abstract: The present invention relates to a surface mounting crystal oscillator in which an IC chip, a crystal element, and a circuit component are connected together by wire bonding and are housed within a main container having a concave section. The main container has a pair of opposing inner wall step portions along both sides in the longitudinal direction, and this pair of inner wall step portions are also each divided into an upper step portion and a lower-step portion of different heights along the longitudinal direction. At least one of the upper step portions of the pair of inner wall step portions supports one end portion in the lengthwise direction of the crystal element so that the lengthwise direction of the crystal element is aligned in the widthwise direction of the main container. The circuit component is disposed on an inner base surface of the main container below the crystal element.

Abstract: A surface acoustic wave element 11 having an inter digital electrode 12 formed on one surface of a piezo-electric substrate is arranged in a recess of a package 13 with the one surface being faced to a bottom surface of the recess of the package 13. An elastic conductive pad 35 having pads electrically connected to the electrode of the surface acoustic wave element 11 and electrodes of the package 13 is provided between the one surface of the surface acoustic wave element 11 and the package 13. The conductive pad 35 includes wiring means 35a, with which it is possible to connect the surface acoustic wave element 11 to the package 13 even when the position of the surface acoustic wave element in which the interdigital electrode is formed is deviated from the position of the electrodes of the package 13. The package 13 includes a cap 30 for pressing down the surface acoustic wave element 11.