Patents by Inventor Heike Eisfeld

Heike Eisfeld has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180194964
    Abstract: The present invention relates to aqueous polyurethane dispersions prepared with no catalyst or very low loading of organic catalyst that can be used as cold sealable adhesives, are surfactant and solvent free and have low VOC emissions, are environmentally friendly, and provide for homogeneous and aging-resistant adhesives that can be used for cosmetic, pharmaceutical and food packaging applications. Also encompassed are processes for their production, compositions containing them and their use as adhesives.
    Type: Application
    Filed: March 7, 2018
    Publication date: July 12, 2018
    Inventors: Ligang ZHAO, Nélinda GIMENO GORMAZ, Aurora PEREZ BRIONES, Brian W. STEPHENSON, Heike EISFELD, Sara WAGNER
  • Patent number: 8921467
    Abstract: An aqueous adhesive dispersion containing 25 to 70 wt % acrylate block copolymers and/or styrene block copolymers that have a molecular weight of more than 15,000 g/mol and at least two different glass transition temperatures, one glass temperature (Tg) being above 50° C., the other glass transition temperature below +10° C., as well as additionally further additives, the dispersion containing less than 0.5 wt % organic solvent.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: December 30, 2014
    Assignee: Henkel AG & Co. KGAA
    Inventors: Oliver Sommer, Dirk Kasper, Heike Eisfeld, Peter Ziskofen, Thomas Moeller
  • Patent number: 6818093
    Abstract: The invention relates to a low-viscosity hotmelt adhesive containing A) at least one hydrocarbon resin solid at 20° C. with a softening temperature of 70 to 140° C., B) at least one oil with an average molecular weight of >500 and preferably C) a styrene block copolymer. The new hotmelt adhesive is distinguished by a melt viscosity of essentially only 500 to 3200 mPas at 150° C. for a softening temperature of 60 to 115° C. It is preferably used in the field of hygiene for bonding films, nonwovens and/or shaped articles of cellulose derivatives, being distinguished by particular resistance to dermatologically compatible coatings.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: November 16, 2004
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventors: Eduard Franciscus Taal, Ruediger Voss, Heike Eisfeld