Patents by Inventor Heike Huscher

Heike Huscher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silicon-based sub-mount for an opto-electronic device
    Patent number: 8309973
    Abstract: A package for an optoelectronic device (e.g., a light emitting device such as a LED) includes a sub-mount including a silicon substrate having a thickness in the range of 350 ?m-700 ?m. The optoelectronic device is mounted on a die attach pad on the front-side surface of the substrate. Feed-through metallization in one or more via structures electrically couples the die attach pad to a contact pad on the back-side surface of the substrate.
    Type: Grant
    Filed: February 12, 2009
    Date of Patent: November 13, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jochen Kuhmann, Heike Huscher
  • Silicon-Based Sub-Mount for an Opto-Electronic Device
    Publication number: 20100200888
    Abstract: A package for an optoelectronic device (e.g., a light emitting device such as a LED) includes a sub-mount including a silicon substrate having a thickness in the range of 350 ?m-700 ?m. The optoelectronic device is mounted on a die attach pad on the front-side surface of the substrate. Feed-through metallization in one or more via structures electrically couples the die attach pad to a contact pad on the back-side surface of the substrate.
    Type: Application
    Filed: February 12, 2009
    Publication date: August 12, 2010
    Applicant: Hymite A/S
    Inventors: Jochen Kuhmann, Heike Huscher