Patents by Inventor Heike ROSSLAU

Heike ROSSLAU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8872341
    Abstract: One or more embodiments relate to a method of forming a semiconductor device, comprising: forming a structure, the structure including at least a first element and a second element; and forming a passivation layer over the structure, the passivation layer including at least the first element and the second element, the first element and the second element of the passivation layer coming from the structure.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: October 28, 2014
    Assignee: Infineon Technologies AG
    Inventors: Gerald Dallmann, Heike Rosslau, Norbert Urbansky, Scott Wallace
  • Publication number: 20120074573
    Abstract: One or more embodiments relate to a method of forming a semiconductor device, comprising: forming a structure, the structure including at least a first element and a second element; and forming a passivation layer over the structure, the passivation layer including at least the first element and the second element, the first element and the second element of the passivation layer coming from the structure.
    Type: Application
    Filed: September 29, 2010
    Publication date: March 29, 2012
    Inventors: Gerald DALLMANN, Heike ROSSLAU, Norbert URBANSKY, Scott WALLACE