Patents by Inventor Heiko Estel

Heiko Estel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
    Publication number: 20150147839
    Abstract: A method for manufacturing a semiconductor device may include: forming a metal layer structure over a semiconductor workpiece; forming a first layer over the metal layer structure, the first layer including a first material; forming at least one opening in the first layer and the metal layer structure; depositing a second layer to fill the at least one opening and at least partially cover a surface of the first layer facing away from the metal layer structure, the second layer including a second material that is different from the first material; removing the second layer from at least the surface of the first layer facing away from the metal layer structure; and removing the first layer.
    Type: Application
    Filed: November 26, 2013
    Publication date: May 28, 2015
    Applicant: Infineon Technologies Dresden GmbH
    Inventors: Alessia Scire, Alfred Vater, Mirko Vogt, Momtchil Stavrev, Tarja Hauck, Bee Kim Hong, Heiko Estel