Abstract: A method of joining a metal-ceramic substrate having metalization on at least one side to a metal body by using a metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm, and the metal alloy contains aluminum and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as a cooling body.

Abstract: A method of joining a metal-ceramic substrate having metallization on at least one side to a metal body by using metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm and the metal alloy contains aluminum and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as a cooling body.

Abstract: The invention relates to a method for the manufacture of double-sided metallized ceramic substrates according to the direct-bonding process. The method enables a ceramic substrate to be bonded to a metal plate or foil on the upper side and the underside in only one process sequence. The composite to be bonded is located on a specially designed carrier structured on the upper side with a plurality of contact points. After the bonding process the composite of metal plates and ceramic substrate can be detached from the carrier free of any residue.

Abstract: A method of joining a metal-ceramic substrate having metallization on at least one side to a metal body by using metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm and the metal alloy contains aluminium and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as cooling body.

Abstract: The invention relates to a method for the manufacture of double-sided metallized ceramic substrates according to the direct-bonding process. The method enables a ceramic substrate to be bonded to a metal plate or foil on the upper side and the underside in only one process sequence. The composite to be bonded is located on a specially designed carrier structured on the upper side with a plurality of contact points. After the bonding process the composite of metal plates and ceramic substrate can be detached from the carrier free of any residue.

Abstract: The invention relates to a device for producing and withdrawing stacks of plastic bags, especially bags for automatic machines, in coordination with a gradually moving pin stack chain (4) from which the bag packages (6) are removed in a simplified and accelerated manner with the aid of a robot (16) that has a multifunctional hand (17) and automatically executes all essential manipulations and/or movements required for the formation and piling of the bag stacks and finally delivers them to an unloading station (62).

Abstract: A device for positioning several units that can be moved adjacent to and at a constant distance from one another, each unit having a distance-traveled detector associated with its drive mechanism and the device as a whole having central controls that emit a reference value. To provide a positioning device that will operate effectively with a minimum of control lines between each unit and the central controls, each unit has a separate computer to control its drive mechanism, each computer is equipped, as are the central controls, which also have an overall computer, to emit a series of coded blocks of information for each unit, and each of the computers associated with the units is equipped to intercept, process, and forward the blocks of information and to actualize the information pertaining to the position of its own unit.

Abstract: A system for setting the sheet length on a cross-cutter for webs of material includes a computer which delivers to the positioning element of a speed changing mechanism, the positioning signal for one speed corresponding to the desired sheet length and to a controlled group for the positioning element of an irregular motion mechanism and to a control loop for the positioning element of a continuously variable speed transmission. The desired values correspond to the desired sheet length and the control loop for the continuously variable speed mechanism receives as a actual value, the sheet length and specifies to the positioning element, the positioning time on the basis of the deviation of the actual value from the desired value and of the speed selected. Another comparison of actual value with desired value is made only at the completion of each positioning operation.

Abstract: A safety system for the drive of a cross cutter for a web of material, having an electrical or mechanical synchronizing system between the drives of the feed and cutting mechanism which is adjustable for the size of the piece to be cut and which consists of an adjustable asymmetrical mechanism and has speed control associated with the drive of the feed mechanism to limit the speed of the feed means on the basis of a signal corresponding to the setting of the asymmetrical mechanism. A function generator generates a signal to be applied to the speed control which is directly dependent thereon to define the speed value for the drive of the feed mechanism and wherein the function generator is responsive to the asymmetrical mechanism for size-related, maximum permissible web velocity.