Patents by Inventor Heiko Rausch

Heiko Rausch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151561
    Abstract: A sensor unit includes at least one sensor and at least two busbars. The busbars have first ends forming an internal electric interface for contacting the sensor and second ends forming an external electric interface for a connection cable or a plug receiving area. An injection-molded plastic housing defines the outer shape of the sensor unit and forms a sensor receiving area with a through-opening, which holds the sensor. The housing partly encases the busbars such that the internal electric interface is at least partly free and accessible near the sensor receiving area and the external electric interface is formed within the housing. The sensor and the internal electric interface are surrounded by a potting compound in a media-tight manner to form a sealed sensor head. The potting compound is formed of a material that can be processed at lower pressures and/or temperatures than the plastic material of the housing.
    Type: Application
    Filed: March 30, 2022
    Publication date: May 9, 2024
    Inventors: Anwar Hegazi, Joerg Siedentopf, Robert Remus, Peter Huendorf, Thomas Breinlinger, Bernd Lutz, Heiko Rausch
  • Publication number: 20070001664
    Abstract: A motion sensor, in particular an rpm sensor for the wheel rotation of a motor vehicle, and a method for producing a motion sensor are proposed, the motion sensor having an integrated circuit (32), connectable via an electrical cable (24), with a measured value transducer and an electronic circuit arrangement for processing the measurement signals. The sensor has a basic component (10), produced by casting or injection molding of thermoplastic, preferably polyamide, by the MID technique, into which basic component a permanent magnet (16) is integrated. A housingless integrated circuit (32) is mounted on the MID component by the flip-chip technique. The arrangement comprising the basic component (10) and the integrated circuit (32) and the permanent magnet (16) as well as the connection end of the cable (24) is sheathed, in a further method step, with an external encapsulation (42) and joined together to form a strong component unit that is well protected against environmental factors.
    Type: Application
    Filed: January 7, 2005
    Publication date: January 4, 2007
    Inventors: Ronald Steinbrink, Hartmut Rohde, Joerg Ruppert, Heiko Rausch, Frieder Sundermeier
  • Patent number: 7134345
    Abstract: A method for manufacturing a pressure sensor having a pressure transducer, a pressure-measuring cell having a pressurizable diaphragm as well as a transducer body. The transducer body is manufactured in one piece by a metal powder injection molding process and a subsequent sintering process. Further, a pressure sensor manufactured by the method.
    Type: Grant
    Filed: November 29, 2004
    Date of Patent: November 14, 2006
    Assignee: Robert Bosch GmbH
    Inventors: Ralf Kaiser, Ralf Goetze, Christian Roesser, Heiko Rausch
  • Publication number: 20050139008
    Abstract: A method for manufacturing a pressure sensor having a pressure transducer, a pressure-measuring cell having a pressurizable diaphragm as well as a transducer body. The transducer body is manufactured in one piece by a metal powder injection molding process and a subsequent sintering process. Further, a pressure sensor manufactured by the method.
    Type: Application
    Filed: November 29, 2004
    Publication date: June 30, 2005
    Inventors: Ralf Kaiser, Ralf Goetze, Christian Roesser, Heiko Rausch