Abstract: A three-dimensionally integrated electronic assembly includes a substrate that includes active circuitry formed therein. At least one electronic component (e.g., an integrated circuit chip, active component, passive component, active assembly, and/or passive assembly) is mounted on the substrate. At least one redistribution connection is disposed between the substrate and at least one electronic component. Each electronic component is electrically coupled to the substrate and/or another electronic component mounted on the substrate by means of the redistribution connection.

Abstract: An electronic device includes a first semiconductor device and a second semiconductor device mounted over the first semiconductor device. An encapsulation material surrounds the first and second semiconductor devices so that the first and second semiconductor devices are embedded within a molded package. A plug connector extends from the molded package and is electrically coupled to at least one of the first and second semiconductor devices.

Abstract: A storage circuit apparatus includes a support material, a semiconductor chip on which at least one shadow RAM is integrated, a capacitor element and a circuit housing. The storage circuit shadow RAM apparatus is able to perform a STORE operation to secure the RAM content in the non-volatile shadow memory practically independently of the time curve in “power down,” without external accessory circuitry. The capacitor element, consisting at least of electrodes and dielectric, is integrated in the circuit housing, and furnishes the energy required for the STORE operation in power-down.