Abstract: An adapter element (10) for connecting a component (4), such as a laser diode, to a heat sink (7), comprising: a first metal layer (11), which in a mounted state faces the component (4), and a second metal layer (12), which in the mounted state faces the heat sink (7), and an intermediate layer (13) comprising ceramic arranged between the first metal layer (11) and the second metal layer (12), wherein the first metal layer (11) and/or the second metal layer (12) is thicker than 40 ?m, preferably thicker than 70 ?m and more preferably thicker than 100 ?m.

Abstract: A method for manufacturing a cooling element (1) for an electrical or electronic component, in particular a semiconductor element, the manufactured cooling element (1) having a cooling fluid channel system through which a cooling fluid can be passed during operation, comprising providing at least a first metal layer (11) realizing at least one recess (21, 22) in the at least one first metal layer (11), and forming at least a partial section of the cooling fluid channel system by means of the at least one recess (21, 22), wherein at least a first part (21) of the at least one recess (21, 22) in the at least first metal layer (11) is realized by erosion, in particular spark erosion.

Abstract: An adapter element (10) for connecting a component (4), such as a laser diode, to a heat sink (7), comprising: a first metal layer (11), which in a mounted state faces the component (4), and a second metal layer (12), which in the mounted state faces the heat sink (7), and an intermediate layer (13) comprising ceramic arranged between the first metal layer (11) and the second metal layer (12), wherein the first metal layer (11) and/or the second metal layer (12) is thicker than 40 ?m, preferably thicker than 70 ?m and more preferably thicker than 100 ?m.

Abstract: A package for holding metal-ceramic substrates, the package includes a tray manufactured from a flat material with at least one holder adapted to a format of the metal-ceramic substrates for holding the metal-ceramic substrates, an interior of the at least one holder of the tray being defined by a bottom and circumferentially by an edge and by at least one covering completely accommodating the tray, and the tray is sealed vacuum-tight by the covering and the covering has an interior accommodating the tray, and the tray is impinged with a vacuum so that the metal-ceramic substrates are fixed in the at least one holder by clamping on an edge-side of the tray by forces (F) exerted on the edge resulting from the ambient pressure.

Abstract: A packaging for substrates, in particular for metal-ceramic substrates, having a tray-like packaging part formed from a sheet material, for example a plastic sheet material by deep drawing. The packaging has at least one seat formed by an indentation in an upper base section of the packaging part for a plurality of substrates collected together into a substrate stack or part stack.

Abstract: Packaging for substrates, particularly for metal/ceramic substrates, having a tray-like packaging portion, produced from a flat material, for example from a plastic flat material, by deep-drawing, having at least one receptacle, formed by a depression in an upper base section of the packaging portion, for a plurality of substrates that are combined to form at least one substrate stack (5).

Abstract: A package for holding metal-ceramic substrates, the package includes a tray manufactured from a flat material with at least one holder adapted to a format of the metal-ceramic substrates for holding the metal-ceramic substrates, an interior of the at least one holder of the tray being defined by a bottom and circumferentially by an edge and by at least one covering completely accommodating the tray, and the tray is sealed vacuum-tight by the covering and the covering has an interior accommodating the tray, and the tray is impinged with a vacuum so that the metal-ceramic substrates are fixed in the at least one holder by clamping on an edge-side of the tray by forces (F) exerted on the edge resulting from the ambient pressure.