Patents by Inventor Heiko Specht

Heiko Specht has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170018337
    Abstract: One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes forming a holding element for holding the electrical bushing in the implantable medical device, the holding element including a through-opening. An insulation element of aluminum oxide is formed within the through-opening. At least one elongated conduction element is formed extending through insulation element. The at least one elongated conduction element includes an aluminum oxide in a metallic matrix. The insulation element and the at least one elongated conduction element are jointly fired thereby forming a hermetic seal therebetween without welding or soldering.
    Type: Application
    Filed: September 28, 2016
    Publication date: January 19, 2017
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jens TROETZSCHEL, Heiko SPECHT
  • Patent number: 9480168
    Abstract: One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes generating an insulation element green compact for an insulation element from an insulating composition of materials. The insulation element green compact is partially sintered. At least one cermet-containing conduction element green compact for a conduction element is formed. The at least one conduction element green compact is introduced into the insulation element green compact. The insulation element green compact and the at least one conduction element green compact are fired to obtain an insulation element with at least one conduction element.
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: October 25, 2016
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jens Troetzschel, Heiko Specht
  • Publication number: 20150270025
    Abstract: An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, at least in part. The at least one conducting element includes at least one cermet. The cermet of the conducting element and the base body include one or more of the same ceramic compound.
    Type: Application
    Filed: June 3, 2015
    Publication date: September 24, 2015
    Applicant: Heraeus Precious Metals GmbH & Co. KG
    Inventors: Heiko Specht, Jeremy Glynn
  • Patent number: 9090975
    Abstract: One aspect is a method for the production of a three-dimensional structure of successive layers producing a multitude of successive layers wherein, with the exception of a first layer, each of the successive layers is arranged on a preceding layer. Each of the successive layers includes at least two materials wherein one material is a sacrificial material and one material is a structure material. Each of the successive layers defines a successive cross-section through the three-dimensional structure. Producing each of the layers includes depositing the sacrificial material by means of an electrochemical process and depositing the structure material by means of physical gas phase deposition. After a multitude of successive layers has been produced, the three-dimensional structure is uncovered by removing at least a part of the sacrificial material. The sacrificial material is at least one of a group consisting of nickel, silver, palladium, and gold.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: July 28, 2015
    Assignee: Heraeus Precious Metals GmbH & Co. KG
    Inventors: Heiko Specht, Andreas Reisinger, Ulrich Hausch, Frank Krueger, Jens Troetzschel
  • Patent number: 9072908
    Abstract: One aspect relates to a method for connecting a housing of an active implantable medical device to a head part, whereby an uncured joining agent that is arranged, at least in part, between the housing and the head part is transitioned into a cured joining agent to attain a firmly bonded connection. In one embodiment, the uncured joining agent includes monomers of a (meth)acrylic acid alkyl ester, and the cured joining agent includes at least one polymer of the (meth)acrylic acid alkyl ester.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: July 7, 2015
    Assignee: Heraeus Precious Metals GmbH & Co. KG
    Inventors: Heiko Specht, Andreas Reisinger, Klaus Ruppert, Alfred Hohmann
  • Publication number: 20150151115
    Abstract: One aspect relates to a medical implant, for example, implantable stimulation electrode, having a tight substrate and a porous contact region. One aspect also relates to a lead of a cardiac pacemaker having an implantable stimulation electrode and to a method for manufacturing a medical implant, for example, an implantable stimulation electrode. A medical implant according to one aspect is characterized in that the implant includes a sintered body with graduated porosity.
    Type: Application
    Filed: February 10, 2015
    Publication date: June 4, 2015
    Applicant: HERAEUS PRECIOUS METALS GMBH & CO. KG
    Inventors: Heiko Specht, Andreas Reisinger, Goran Pavlovic
  • Patent number: 9032614
    Abstract: One aspect relates to an electrical bushing for use in a housing of an implantable medical device. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The electrical bushing includes a holding element to hold the electrical bushing in or on the housing. The conducting element is set-up to establish, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body. The at least one conducting element includes at least one cermet. The holding element is made, to at least 80% by weight with respect to the holding element, from a material selected from the group consisting of a metal from any of the subgroups IV, V, VI, VIII, IX, and X of the periodic system.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: May 19, 2015
    Assignee: Heraeus Precious Metals GmbH & Co. KG
    Inventor: Heiko Specht
  • Patent number: 8951464
    Abstract: One aspect relates to a medical implant, for example, implantable stimulation electrode, having a tight substrate and a porous contact region. One aspect also relates to a lead of a cardiac pacemaker having an implantable stimulation electrode and to a method for manufacturing a medical implant, for example, an implantable stimulation electrode. A medical implant according to one aspect is characterized in that the implant includes a sintered body with graduated porosity.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: February 10, 2015
    Assignee: Heraeus Precious Metals GmbH & Co. KG
    Inventors: Heiko Specht, Andreas Reisinger, Goran Pavlovic
  • Patent number: 8929987
    Abstract: One aspect relates to an electrical bushing for an implantable medical device, having an annulus-like holding element for holding the electrical bushing in the implantable medical device, whereby the holding element includes a through-opening, at least one elongated conducting wire extends through the through-opening, and an insulation element for forming a hermetic seal between the holding element and the conducting wire is arranged in the through-opening. One aspect provides for a cermet-containing bearing element to be arranged between the insulation element and the conducting wire.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: January 6, 2015
    Assignee: Heraeus Precious Metals GmbH & Co. KG
    Inventors: Jens Troetzschel, Heiko Specht
  • Publication number: 20140343648
    Abstract: One aspect relates to a contacting arrangement for use in a housing of a medically implantable apparatus. Said contacting arrangement includes an electrical feedthrough device that includes at least one electrically insulating main feedthrough member and at least one electrical conducting element. The conducting element is designed to establish at least one electrically conducting connection between an interior of the housing and an exterior through the main feedthrough member. The conducting element is hermetically sealed with respect to the main feedthrough member. The at least one conducting element comprises at least one cermet. The contacting arrangement further includes an electrical filter structure which is arranged on a face of the feedthrough device. Furthermore, said filter structure is connected to the conducting element by means of at least one electrical surface connection.
    Type: Application
    Filed: November 13, 2012
    Publication date: November 20, 2014
    Inventors: Heiko Specht, Andreas Reisinger, Goran Pavlovic, Christina Modes, Frieder Gora, Frederik Roth
  • Publication number: 20140328004
    Abstract: One aspect is a capacitor, having a multitude of parallel insulator layers in one stack direction, made of an electrically non-conducting material, a multitude of conductor layers alternatingly stacked with the insulator layers in the direction of the stack made from a conductive material and at least one contact body. A least some of the conductor layers are connected to one another in a conductive manner via the contact body. The contact body extends through breaks form several insulator layers, where at least the insulator layers are made of a sintered material. The contact body to be manufactured at least partially from a sintered material, which is introduced into the breaks in the insulator layers in an unsintered, malleable state.
    Type: Application
    Filed: November 13, 2012
    Publication date: November 6, 2014
    Inventors: Heiko Specht, Jacob Markham, Goran Pavlovic, Ulrich Hausch
  • Patent number: 8778262
    Abstract: One aspect is an alloy consisting of niobium, zirconium, tantalum, and tungsten. The alloy is formed with a melt metallurgical route such that all four metals solidify as a homogeneous alloy having no inclusions more than 10 ?m in size.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: July 15, 2014
    Assignee: Heraeus Precious Metals GmbH & Co. KG
    Inventors: Herwig Schiefer, Christoph Vogt, Heiko Specht, Jens Troetzschel
  • Patent number: 8755887
    Abstract: One aspect relates to an electrical bushing for an implantable medical device, having an annulus-like holding element for holding the electrical bushing in the implantable medical device, whereby the holding element includes a through-opening, at least one elongated conduction element extends through the through-opening, and an insulation element for forming a hermetic seal between the holding element and the conduction element is arranged in the through-opening. One aspect provides for the at least one conduction element to include a cermet.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: June 17, 2014
    Assignee: Heraeus Precious Metals GmbH & Co. KG
    Inventors: Jens Troetzschel, Heiko Specht
  • Publication number: 20140144014
    Abstract: One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes generating an insulation element green compact for an insulation element from an insulating composition of materials. The insulation element green compact is partially sintered. At least one cermet-containing conduction element green compact for a conduction element is formed. The at least one conduction element green compact is introduced into the insulation element green compact. The insulation element green compact and the at least one conduction element green compact are fired to obtain an insulation element with at least one conduction element.
    Type: Application
    Filed: February 3, 2014
    Publication date: May 29, 2014
    Applicant: Heraeus Precious Metals GmbH & Co. KG
    Inventors: Jens Troetzschel, Heiko Specht
  • Patent number: 8636825
    Abstract: One aspect relates to a method for producing an alloy characterized by grinding tantalum to form a tantalum powder and grinding tungsten to form a tungsten powder; mixing the tantalum powder and the tungsten powder to form a blended powder. The weight fraction of tungsten powder in the blended powder is larger than in the desired alloy. A blended body is produced from the blended powder by a powder metallurgical route. A pre-alloy is produced by a first melting of the blended body and at least a fraction of at least one further metal by a melt metallurgical route. The alloy is produced by a second melting of the pre-alloy and the remaining fraction of at least one metal by a melt metallurgical route.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: January 28, 2014
    Assignee: W. C. Heraeus GmbH
    Inventors: Herwig Schiefer, Christoph Vogt, Heiko Specht, Jens Troetzschel, Egbert Stiedl
  • Patent number: 8597872
    Abstract: A method is provided for production of a medical marker (4) made of an X-ray-opaque material, including the following steps: a) photolithographic application of a mask (31) on a substrate (1); b) deposition of the X-ray-opaque material (40) of the marker (4) on the substrate (1); c) removal of the mask (31); and d) elimination of the substrate (1).
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: December 3, 2013
    Assignee: Heraeus Precious Metals GmbH & Co. KG
    Inventors: Heiko Specht, Frank Krüger
  • Patent number: 8594808
    Abstract: One aspect relates to a stimulation electrode including an electrically conducting base body. The base body encompasses tantalum and is at least partially covered with a porous tantalum oxide layer, which is anodically applied by means of high voltage pulses. Provision is made according to an embodiment for a metallic protective layer to cover the porous tantalum oxide layer so as to prevent a hydrogen embrittlement.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: November 26, 2013
    Assignee: W. C. Heraeus GmbH
    Inventors: Heiko Specht, Frank Krüger, Ulrich Hausch, Andreas Reisinger
  • Publication number: 20130299038
    Abstract: A method of forming a wire includes providing a first wire section comprising a first material and providing a second wire section comprising a second material different from the first material. A joining section is formed having a first end and a second end such that the first end of the joining section comprising a material that is compatible with the first material and such that the second end of the joining section comprising a material that is compatible with the second material. The first wire section is welded to the first end of the joining section and the second wire section is welded to the second end of the joining section. Forming the joining section includes forming the joining section via a process selected from a group comprising electrodeposition, three-dimensional printing, direct typing process, LIGA, lithography and stacking processes.
    Type: Application
    Filed: July 12, 2013
    Publication date: November 14, 2013
    Inventors: Heiko Specht, Andreas Reisinger, Goran Pavlovic, Jacob Markham, Kelly Stichter, Laurent Bataillard
  • Patent number: 8487210
    Abstract: A wire includes a first wire section is of a first material and a second wire section is of a second material different from the first material. A joining section is adjacent both the first and second wire sections, the joining section comprising a first end and a second end. The first end of the joining section is of a material that is compatible with the first material of the first wire section and the second end of the joining section is of a material that is compatible with the second material of the second wire section.
    Type: Grant
    Filed: June 11, 2010
    Date of Patent: July 16, 2013
    Assignee: W. C. Hereaus GmbH
    Inventors: Heiko Specht, Andreas Reisinger, Goran Pavlovic, Jacob Markham, Kelly Stichter, Laurent Bataillard
  • Patent number: 8414679
    Abstract: One aspect is a method for producing an alloy, whereby the alloy includes at least a first metal and a second metal, whereby firstly a powder metallurgical route and subsequently a melt metallurgical route is used sequentially in order to generate the alloy from the, at least, first metal and the second metal. The method includes grinding the first metal into a first metal powder, grinding the second metal into a second metal powder, mixing the first metal powder and the second metal powder to produce a blended powder, generating a blended body from the blended powder by the powder metallurgical route, and generating the alloy by melting the blended body by the melt metallurgical route.
    Type: Grant
    Filed: August 6, 2010
    Date of Patent: April 9, 2013
    Assignee: W. C. Heraeus GmbH
    Inventors: Herwig Schiefer, Christoph Vogt, Heiko Specht, Jens Troetzschel