Abstract: The invention relates to a method for producing a sample on an object using a material processing device. The invention further relates to a computer program product and a material processing device for carrying out the method.

Abstract: A sample holder system for holding a microscopic sample in a microscope system comprises a first and a second rotation element, which are rotatably connected to one another. The side surfaces of the two rotation elements in each case enclose an angle ?, with the result that the rotation elements have a wedge-shaped cross section. The second rotation element is configured to receive a sample, while the first rotation element can be rotatably connected to a holder receiving surface. The rotation elements are each rotatable by an angle ? about a rotation axis. The inclination of the third side surface on which the sample can be received is settable by combining all of the involved angles ? and ?.

Abstract: A charged particle beam system includes a charged particle source, an extraction electrode, a suppressor electrode, a first variable voltage supply for biasing the extraction electrode with an extraction voltage and a second variable voltage supply for biasing the suppressor electrode with a suppressor voltage.

Abstract: A method for processing an object, with material being removed from the object, includes directing a particle beam on the object so that a location of incidence of the particle beam on the object carries out a movement along a principal scanning path and a movement along a sub-scanning direction oriented transverse to the principal scanning path. The movement of the location of incidence of the particle beam along the sub-scanning direction is controlled on the basis of a reference signal and a detection signal. The method also includes modulating the directing of the particle beam in accordance with the reference signal, and detecting secondary particles and producing the detection signal, which represents an intensity of the detected secondary particles. Controlling the movement of the location of incidence of the particle beam along the sub-scanning direction is implemented using the principle of homodyne detection.

Abstract: A method for processing an object, with material being removed from the object, includes directing a particle beam on the object so that a location of incidence of the particle beam on the object carries out a movement along a principal scanning path and a movement along a sub-scanning direction oriented transverse to the principal scanning path. The movement of the location of incidence of the particle beam along the sub-scanning direction is controlled on the basis of a reference signal and a detection signal. The method also includes modulating the directing of the particle beam in accordance with the reference signal, and detecting secondary particles and producing the detection signal, which represents an intensity of the detected secondary particles. Controlling the movement of the location of incidence of the particle beam along the sub-scanning direction is implemented using the principle of homodyne detection.

Abstract: A charged particle beam system includes a charged particle source, an extraction electrode, a suppressor electrode, a first variable voltage supply for biasing the extraction electrode with an extraction voltage and a second variable voltage supply for biasing the suppressor electrode with a suppressor voltage.

Abstract: Methods and apparatus are disclosed for the preparation of microscopic samples using light pulses. Material volumes greater than 100 ?m3 are removed. The methods include inspecting an object with a scanning electron microscope (SEM) or a focused ion beam (FIB). The inspection includes recording an image of the object. The methods also includes delineating within the object a region to be investigated, and delineating a laser-machining path based on the image of the object so that a sample can be prepared out of the object. The methods further include using laser-machining along the delineated laser-machining path to remove a volume that is to be ablated, and inspecting the object with the scanning electron microscope (SEM) or a focused ion beam (FIB).

Abstract: A method for adjusting an operating parameter of a particle beam device and a sample holder, which is suitable in particular for performing the method are provided. An adjustment of an operating parameter of a particle beam device is possible without transfer of the sample holder out of the particle beam device. A reference sample is placed in a first sample receptacle, so that in ongoing operation of the particle beam device, the sample holder need only be positioned in such a way that the reference sample is bombarded and measured with the aid of a particle beam generated in the particle beam device.

Abstract: Methods and apparatus are disclosed for the preparation of microscopic samples using light pulses. Material volumes greater than 100 ?m3 are removed. The methods include inspecting an object with a scanning electron microscope (SEM) or a focused ion beam (FIB). The inspection includes recording an image of the object. The methods also includes delineating within the object a region to be investigated, and delineating a laser-machining path based on the image of the object so that a sample can be prepared out of the object. The methods further include using laser-machining along the delineated laser-machining path to remove a volume that is to be ablated, and inspecting the object with the scanning electron microscope (SEM) or a focused ion beam (FIB).

Abstract: A method for adjusting an operating parameter of a particle beam device and a sample holder, which is suitable in particular for performing the method are provided. An adjustment of an operating parameter of a particle beam device is possible without transfer of the sample holder out of the particle beam device. A reference sample is placed in a first sample receptacle, so that in ongoing operation of the particle beam device, the sample holder need only be positioned in such a way that the reference sample is bombarded and measured with the aid of a particle beam generated in the particle beam device.

Abstract: In a method and an apparatus for determining the thickness of a thin layer coated on a surface, a section is prepared and a digital image of the section is obtained. An intensity profile in the thickness direction of the layer is extracted from the digital image and is analyzed on the basis of predefined characteristics of the intensity profile to precisely determine the layer thickness. This technique is particularly advantageous in determining the layer thickness when said layer is formed on a curved surface.