Patents by Inventor Heiko Wildner

Heiko Wildner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substance with an antimicrobial effect
    Patent number: 9162013
    Abstract: A method reducing microbial growth uses an inorganic substance consisting of MoO2 and/or MoO3 which causes the formation of hydrogen cations when in contact with an aqueous medium to achieve an antimicrobial effect. The substance is present as a layer or a component of a layer, and is present in combination with one or more materials as a composite material. The composite material has a polymer matrix, and the substance is incorporated at 3 to 50% by weight into the composite material.
    Type: Grant
    Filed: November 13, 2007
    Date of Patent: October 20, 2015
    Assignee: PLANSEE SE
    Inventors: Joseph Peter Guggenbichler, Nico Eberhardt, Hans-Peter Martinz, Heiko Wildner
  • SUBSTANCE WITH AN ANTIMICROBIAL EFFECT
    Publication number: 20100057199
    Abstract: The invention describes the use of an inorganic substance which forms hydrogen cations when in contact with an aqueous medium, which trigger an antimicrobial effect, the substance containing molybdenum and/or tungsten.
    Type: Application
    Filed: November 13, 2007
    Publication date: March 4, 2010
    Applicant: Plansee Se
    Inventors: Joseph Peter Guggenbichler, Nico Eberhardt, Hans-Peter Martinz, Heiko Wildner
  • Package with a substrate of high thermal conductivity
    Patent number: 6998180
    Abstract: A package is configured as a composite component with a substrate, at least one semiconductor component, and an enclosure, which are joined to one another. The heat-dissipating substrate is a single-layer or multilayer substrate with a thermal conductivity, transversely with respect to a joining surface to which the semiconductor component is joined, of greater than 170 W/m. The substrate may be a layered structure and/or a structure of graduated material composition, and it has an asymmetrical thermal expansion characteristic. By suitable selection the layers or the material graduation, it is possible to reduce and limit the shear distortion of the composite component formed of the substrate, the semiconductor component, and the enclosure.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: February 14, 2006
    Assignee: Plansee Aktiengesellschaft
    Inventors: Arndt Lüdtke, Heiko Wildner
  • Package with a substrate of high thermal conductivity
    Publication number: 20030224554
    Abstract: A package is configured as a composite component with a substrate, at least one semiconductor component, and an enclosure, which are joined to one another. The heat-dissipating substrate is a single-layer or multilayer substrate with a thermal conductivity, transversely with respect to a joining surface to which the semiconductor component is joined, of greater than 170 W/m. The substrate may be a layered structure and/or a structure of graduated material composition, and it has an asymmetrical thermal expansion characteristic. By suitable selection the layers or the material graduation, it is possible to reduce and limit the shear distortion of the composite component formed of the substrate, the semiconductor component, and the enclosure.
    Type: Application
    Filed: March 24, 2003
    Publication date: December 4, 2003
    Inventors: Arndt Ludtke, Heiko Wildner