Abstract: A production facility is provided for automatic assembly and testing of electronic card modules. Heretofore it has only been possible to manufacture card modules in batches without a quick conversion to another type of production, as required, being economically possible. This disadvantage is avoided by the present invention in that all required operating elements (component parts, tools, automatic assembly and testing units) are controlled in direct access with set-up time approaching zero for the production line via an extensive computer hierarchy in which the assembly and test line are available. A master computer administers the cell computers assigned to the individual processing stations which, in turn, control the machine computers. The conveying system has its own control available.

Abstract: A device for electroplating portions of a continuously moving, cathodically connecting workpiece as it is moved past a plurality of anodically connected spray nozzles characterized by the spray nozzles comprising precious metal and being positioned one after another in a row along the direction of movement of the workpiece with each of the nozzles having an individual stream of electrolytes emerging unimpeded therefrom. The continuously moving workpiece is positioned so that selected portions thereof are moved along the row of nozzles to be contacted by the stream of electrolyte emerging from the individual nozzles for a free and unimpeded electroplating of the portions contacted by the streams.

Abstract: Electrical circuit boards are cooled immediately after passing through a soldering work station wherein heat-sensitive electrical components are mechanical soldered into such circuit boards so as to minimize dangerous temperature peaks without disrupting the soldering process. The cooling device is positioned closely adjacent to the soldering work station and comprises a housing having a C-shaped passageway along the center thereof for receiving an elongated transport means carrying freshly-soldered circuit boards in a given direction from the solder soldering work station. Air flow means are provided at opposite wall portions of the passageway for directing a stream of cooling air against opposite sides of the circuit boards carried by the transport means and approximately at right angles to the travel directions of such boards.