Abstract: A device for dispensing and distributing flux-free solder on a substrate comprises an elongated tool, a tool mount, an ultrasonic generator, a wire guide tube, and optionally a heat sink and a housing. The tool can be fixed to the tool mount and has a longitudinal borehole which opens into an opening on the tip of the tool. The wire guide tube extends along a central longitudinal axis through the ultrasonic generator and the tool mount, protrudes into the longitudinal borehole of the tool and reaches up to a position above the tip of the tool. The wire guide tube does not touch the tool. The ultrasonic generator is fixed to the tool mount. Advantageously, a cooling chamber which can actively be cooled is formed between an inner wall of the housing and the ultrasonic generator.

Abstract: An apparatus for dispensing flux-free solder comprises a dispenser head with a stamp to which ultrasound can be applied. Solder is dispensed by: A) moving the dispenser head above a next substrate place, B) lowering the stamp until the working surface of the stamp touches the substrate place or is located at a predetermined height above the substrate place, C) dispensing solder by: C1) advancing the solder wire until the solder wire touches the substrate place, in such a manner that the tip of the solder wire touches the substrate place within a recess of the stamp, C2) further advancing of solder wire to melt a predetermined quantity of solder, and C3) retracting the solder wire, D) moving the dispenser head to distribute the solder on the substrate place, and simultaneously applying ultrasound to the stamp, and E) raising the stamp.

Abstract: An apparatus for dispensing flux-free solder comprises a dispenser head with a stamp to which ultrasound can be applied. Solder is dispensed by: A) moving the dispenser head above a next substrate place, B) lowering the stamp until the working surface of the stamp touches the substrate place or is located at a predetermined height above the substrate place, C) dispensing solder by: C1) advancing the solder wire until the solder wire touches the substrate place, in such a manner that the tip of the solder wire touches the substrate place within a recess of the stamp, C2) further advancing of solder wire to melt a predetermined quantity of solder, and C3) retracting the solder wire, D) moving the dispenser head to distribute the solder on the substrate place, and simultaneously applying ultrasound to the stamp, and E) raising the stamp.

Abstract: A device for dispensing and distributing flux-free solder on a substrate comprises an elongated tool, a tool mount, an ultrasonic generator, a wire guide tube, and optionally a heat sink and a housing. The tool can be fixed to the tool mount and has a longitudinal borehole which opens into an opening on the tip of the tool. The wire guide tube extends along a central longitudinal axis through the ultrasonic generator and the tool mount, protrudes into the longitudinal borehole of the tool and reaches up to a position above the tip of the tool. The wire guide tube does not touch the tool. The ultrasonic generator is fixed to the tool mount. Advantageously, a cooling chamber which can actively be cooled is formed between an inner wall of the housing and the ultrasonic generator.

Abstract: An apparatus for dispensing flux-free solder comprises a dispenser head with a stamp to which ultrasound can be applied. Solder is dispensed by: A) moving the dispenser head above a next substrate place, B) lowering the stamp until the working surface of the stamp touches the substrate place or is located at a predetermined height above the substrate place, C) dispensing solder by: C1) advancing the solder wire until the solder wire touches the substrate place, in such a manner that the tip of the solder wire touches the substrate place within a recess of the stamp, C2) further advancing of solder wire to melt a predetermined quantity of solder, and C3) retracting the solder wire, D) moving the dispenser head to distribute the solder on the substrate place, and simultaneously applying ultrasound to the stamp, and E) raising the stamp.

Abstract: The invention relates to a method for dispensing solder and a method for mounting a semiconductor chip on the dispensed solder. The substrate is heated to a temperature which lies above the melting temperature of the solder and a solder portion is applied. A pin is thereafter immersed in the solder portion until it touches the solder portion and presses against the substrate. The pin is subjected to ultrasonic sound in such a way that ultrasonic waves are generated in the pin, which are directed perpendicularly or angularly in relation to the surface of the substrate, and is then moved along a predetermined path in order to distribute the solder. The treatment with ultrasonic sound locally improves the wettability of the substrate. The temperature of the pin is preferably lower than the melting temperature of the solder.

Abstract: The invention relates to a method for dispensing solder and a method for mounting a semiconductor chip on the dispensed solder. The substrate is heated to a temperature which lies above the melting temperature of the solder and a solder portion is applied. A pin is thereafter immersed in the solder portion until it touches the solder portion and presses against the substrate. The pin is subjected to ultrasonic sound in such a way that ultrasonic waves are generated in the pin, which are directed perpendicularly or angularly in relation to the surface of the substrate, and is then moved along a predetermined path in order to distribute the solder. The treatment with ultrasonic sound locally improves the wettability of the substrate. The temperature of the pin is preferably lower than the melting temperature of the solder.

Abstract: A Ball-Wire Bonder can be used for the production of a wedge-wedge wire connection between first and second connection points when the tearing off of the wire takes place after production of the second wedge connection so that the piece of wire protruding out of the capillary points in the direction of the next wire connection to be made.

Abstract: The clamping device includes a body with two slides which can slide therein. The slides each carry a jaw that can be shifted opposite to the other jaw by an axially movable screw spindle. A central jaw can be fixed in the central region of the body. An abutment part is arranged at an operating end of the body, in the lower region of the slide and of the body facing away from the jaw. The abutment part has a lug which can shift to a limited extent in an end recess of the base part of the body. A spring arrangement is supported at one end on the lug and at the other end in a pocket of the base part. The abutment part includes a finger which engages in a longitudinal groove provided at the underside of the slide and carries a clamping element at its free end facing towards the central jaw, with which device the finger can be jammed in the longitudinal groove.

Abstract: The clamping device with a mechanical force amplifier comprises a threaded spindle (9) which can be screwed into a stationary nut and is connected rotationally fast with a housing (10) enclosing the force amplifier (13-16). A first clamping member (13) is arranged rotationally fast with, but slidable in, the housing (10) and a second clamping member (14) is arranged rotatably in the housing. A plurality of tightening pins (15) are arranged between the clamping members (13, 14). In between the second clamping member (14) and a drive shaft (28) there is arranged a planetary gear (30). Planetary gear (30) has a sun wheel (31) arranged on the drive shaft (28), an annulus is connected to the housing (10) and a carrier formed by the second clamping member (14). A spring-biased detent coupling (38) is provided between the housing (10) and the second clamping member (14).

Abstract: The clamping force adjusting device for a clamp device comprises a hollow housing (1) supported on a movable clamping part of the same, through which housing passes a rotatable and slidable tension rod (5), whose first end can be coupled to a force amplifier and whose second end (5b) carries a tension sleeve (6) fixed thereon. The tension sleeve (6) is supported on Belleville springs (9) through a thrust bearing (8) and an intermediate sleeve (b 10), the Belleville springs being supported directly in the housing (1). An adjusting sleeve (13) screws into a fine thread (14) of the housing (1) and has at its end facing the Belleville springs (9) a radially inwardly directed first stop shoulder (16), which cooperates with a radially outwardly directed second stop shoulder (17) of the intermediate sleeve (10) and/or a spacer ring (18) bearing on the thrust bearing (8).

Abstract: The clamp element includes a rapid feed device combined with a force amplifier. The force amplifier is surrounded by a rotatable feed sleeve, which engages through an external thread in a female thread of a surrounding housing. A first tightening member is fixed and a tightening clamp member is rotatably arranged in the feed sleeve. Two tightening pins are arranged between the two tightening members. The tightening pins are supported on the second tightening member the smallest possible distance from the feed sleeve axis. An actuating and tensioning rod is passed either through a central aperture in the first tightening member (FIGS. 7-11) or through two diametrically opposite, lateral aperture of the first tightening member (FIGS. 1-6).

Abstract: A machine vise with force amplifier comprises a fixed jaw (2) and a movable jaw (3) on a vise body (1, 1a, 1b), the movable jaw being adjustable by means of a threaded spindle (14). The force amplifier (9, 10, 11) is enclosed by a rotatable tightening sleeve (6), which engages by means of an external thread (7) in a female thread (8) of a housing (5) around the sleeve. Within the tightening sleeve (6) there are arranged a first tightening ring (9) fast against rotation and a second tightening ring (10) rotatable to a limited extent. A plurality of tightening pins are provided between the two tightening rings (9, 10). The stationary housing (5) is arranged in the vise body (1, 1a) beneath the fixed jaw (2). The second tightening ring (10) is fixedly connected to the one end (13a) of a pull rod (13) passing through the first tightening ring (9) and the threaded spindle (14), on the other end (13b) of which rod there engage an adjusting sleeve (21) and an operating lever (15).