Patents by Inventor Heinrich Fragner
Heinrich Fragner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230393255Abstract: Method of locating a point P located on the earth's surface using bistatic radar with at least one transmitter and at least one receiver, wherein the point P has relative motion to the transmitter and/or receiver, the method comprising: a) emitting a measurement signal modulated onto a carrier wave from the transmitter to the surface, b) receiving the measurement signal reflected from the surface during a measurement period ?t in the receiver, c) during the measurement period ?t determining the runtime of the measurement signal along the signal path from the receiver via point P to the receiver, d) during the measurement period ?t determining the path length of the measurement signal along the signal path, e) compensating the runtime of the measurement signal changing due to the relative movement of the point P to the transmitter and/or receiver during the measurement period ?t using the path length changing during the measurement period ?t, f) calculating the distance of the point P from the transmitter aType: ApplicationFiled: September 20, 2022Publication date: December 7, 2023Inventor: Heinrich FRAGNER
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Patent number: 8278635Abstract: In a particle multi-beam structuring apparatus for forming a pattern on a target's surface using a beam of electrically charged particles, during exposure steps the particle beam is produced, directed through a pattern definition means producing a patterned particle beam composed of multiple beamlets, and projected by an optical column including a controllable deflection means onto the target surface to form, at a nominal location on the target, a beam image comprising the image of defining structures in the pattern definition means. The beam image's nominal location relative to the target is changed between exposure steps. The actual location of the beam image is varied within each exposure step around the nominal location, through a set of locations realizing a distribution of locations within the image plane around a mean location coinciding with the nominal location, thus introducing an additional blur which is homogenous over the entire beam image.Type: GrantFiled: February 19, 2010Date of Patent: October 2, 2012Assignee: IMS Nanofabrication AGInventors: Elmar Platzgummer, Heinrich Fragner, Stefan Cernusca
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Patent number: 8258488Abstract: An improved aperture arrangement in a device for defining a pattern on a target, for use in a particle-beam exposure apparatus, by being irradiated with a beam of electrically charged particles and allowing passage of the beam only through a plurality of apertures. The device includes an aperture array having a plurality of apertures of identical shape defining the shape and relative position of beamlets permeating the apertures. A blanking device switches off the passage of selected beamlets permeating the apertures and defined by them. The apertures are arranged on the aperture array according to an arrangement deviating from a regular arrangement by small deviations, adjusting for distortions caused by the particle-beam exposure apparatus, and the size of the apertures of the aperture array differs across the aperture array in order to allow for an adjustment of the current radiated on the target through the apertures and the corresponding openings.Type: GrantFiled: August 5, 2009Date of Patent: September 4, 2012Assignee: IMS Nanofabrication AGInventors: Elmar Platzgummer, Heinrich Fragner, Stefan Cernusca
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Patent number: 8222621Abstract: In a maskless particle multibeam processing apparatus, a particle beam is projected through a pattern definition system producing a regular array of beamlets according to a desired pattern, which is projected onto a target which moves at continuous speed along a scanning direction with respect to the pattern definition system. During a sequence of uniformly timed exposure steps the beam image is moved along with the target along the scanning direction, and between exposure steps the location of the beam image is changed with respect to the target. During each exposure step the target covers a distance greater than the mutual distance of neighboring image elements on the target.Type: GrantFiled: November 16, 2009Date of Patent: July 17, 2012Assignee: IMS Nanofabrication AGInventors: Heinrich Fragner, Elmar Platzgummer, Robert Nowak, Adrian Bürli
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Patent number: 8198601Abstract: The disclosure relates to a method for producing a multi-beam deflector array device with a plurality of openings for use in a particle-beam exposure apparatus, in particular a projection lithography system, said method starting from a CMOS wafer and comprising the steps of generating at least one pair of parallel trenches on the first side of the wafer blank at the edges of an area where the circuitry layer below is non-functional, the trenches reaching into the layer of bulk material; passivating the sidewalls and bottom of the trenches; depositing a conducting filling material into the trenches, thus creating columns of filling material serving as electrodes; attaching metallic contact means to the top of the electrodes; structuring of an opening between the electrodes, said opening stretching across abovementioned area so that the columns are arranged opposite of each other on the sidewalls of the opening.Type: GrantFiled: January 25, 2010Date of Patent: June 12, 2012Assignee: IMS Nanofabrication AGInventors: Elmar Platzgummer, Heinrich Fragner
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Patent number: 8057972Abstract: The invention relates to a method for forming a pattern on a substrate surface of a target by means of a beam of electrically charged particles in a number of exposure steps, where the beam is split into a patterned beam and there is a relative motion between the substrate and the pattern definition means. This results in an effective overall motion of the patterned particle beam over the substrate surface and exposition of image elements on the substrate surface in each exposure step, wherein the image elements on the target are exposed to the beamlets multiply, namely several times during a number of exposure steps according to a specific sequence. The sequence of exposure steps of the image elements is arranged in a non-linear manner according to a specific rule from one exposure step to the subsequent exposure step in order to reduce the current variations in the optical column of the multi-beam exposure apparatus during the exposure of the pattern.Type: GrantFiled: November 16, 2009Date of Patent: November 15, 2011Assignee: IMS Nanofabrication AGInventors: Heinrich Fragner, Elmar Platzgummer, Adrian Bürli
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Publication number: 20100224790Abstract: In a particle multi-beam structuring apparatus for forming a pattern on a target's surface using a beam of electrically charged particles, during exposure steps the particle beam is produced, directed through a pattern definition means producing a patterned particle beam composed of multiple beamlets, and projected by an optical column including a controllable deflection means onto the target surface to form, at a nominal location on the target, a beam image comprising the image of defining structures in the pattern definition means. The beam image's nominal location relative to the target is changed between exposure steps. The actual location of the beam image is varied within each exposure step around the nominal location, through a set of locations realizing a distribution of locations within the image plane around a mean location coinciding with the nominal location, thus introducing an additional blur which is homogenous over the entire beam image.Type: ApplicationFiled: February 19, 2010Publication date: September 9, 2010Applicant: IMS Nanofabrication AGInventors: Elmar Platzgummer, Heinrich Fragner, Stefan Cernusca
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Patent number: 7777201Abstract: For maskless irradiating a target with a beam of energetic electrically charged particles using a pattern definition means with a plurality of apertures and imaging the apertures in the pattern definition means onto a target which moves (v) relative to the pattern definition means laterally to the axis, the location of the image is moved along with the target, for a pixel exposure period within which a distance of relative movement of the target is covered which is at least a multiple of the width (w) of the aperture images as measured on the target, and after said pixel exposure period the location of the beam image is changed, which change of location generally compensates the overall movement of the location of the beam image.Type: GrantFiled: March 19, 2008Date of Patent: August 17, 2010Assignee: IMS Nanofabrication AGInventors: Heinrich Fragner, Elmar Platzgummer
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Publication number: 20100187434Abstract: The disclosure relates to a method for producing a multi-beam deflector array device with a plurality of openings for use in a particle-beam exposure apparatus, in particular a projection lithography system, said method starting from a CMOS wafer and comprising the steps of generating at least one pair of parallel trenches on the first side of the wafer blank at the edges of an area where the circuitry layer below is non-functional, the trenches reaching into the layer of bulk material; passivating the sidewalls and bottom of the trenches; depositing a conducting filling material into the trenches, thus creating columns of filling material serving as electrodes; attaching metallic contact means to the top of the electrodes; structuring of an opening between the electrodes, said opening stretching across abovementioned area so that the columns are arranged opposite of each other on the sidewalls of the opening.Type: ApplicationFiled: January 25, 2010Publication date: July 29, 2010Applicant: IMS NANOFABRICATION AGInventors: Elmar Platzgummer, Heinrich Fragner
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Publication number: 20100127185Abstract: In a maskless particle multibeam processing apparatus, a particle beam is projected through a pattern definition system producing a regular array of beamlets according to a desired pattern, which is projected onto a target which moves at continuous speed along a scanning direction with respect to the pattern definition system. During a sequence of uniformly timed exposure steps the beam image is moved along with the target along the scanning direction, and between exposure steps the location of the beam image is changed with respect to the target. During each exposure step the target covers a distance greater than the mutual distance of neighboring image elements on the target.Type: ApplicationFiled: November 16, 2009Publication date: May 27, 2010Applicant: IMS Nanofabrication AGInventors: Heinrich Fragner, Elmar Platzgummer, Robert Nowak, Adrian Bürli
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Publication number: 20100124722Abstract: The invention relates to a method for forming a pattern on a substrate surface of a target by means of a beam of electrically charged particles in a number of exposure steps, where the beam is split into a patterned beam and there is a relative motion between the substrate and the pattern definition means. This results in an effective overall motion of the patterned particle beam over the substrate surface and exposition of image elements on the substrate surface in each exposure step, wherein the image elements on the target are exposed to the beamlets multiply, namely several times during a number of exposure steps according to a specific sequence. The sequence of exposure steps of the image elements is arranged in a non-linear manner according to a specific rule from one exposure step to the subsequent exposure step in order to reduce the current variations in the optical column of the multi-beam exposure apparatus during the exposure of the pattern.Type: ApplicationFiled: November 16, 2009Publication date: May 20, 2010Applicant: IMS Nanofabrication AGInventors: Heinrich Fragner, Elmar Platzgummer, Adrian Burli
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Publication number: 20100038554Abstract: An improved aperture arrangement in a device for defining a pattern on a target, for use in a particle-beam exposure apparatus, by being irradiated with a beam of electrically charged particles and allowing passage of the beam only through a plurality of apertures. The device includes an aperture array having a plurality of apertures of identical shape defining the shape and relative position of beamlets permeating the apertures. A blanking device switches off the passage of selected beamlets permeating the apertures and defined by them. The apertures are arranged on the aperture array according to an arrangement deviating from a regular arrangement by small deviations, adjusting for distortions caused by the particle-beam exposure apparatus, and the size of the apertures of the aperture array differs across the aperture array in order to allow for an adjustment of the current radiated on the target through the apertures and the corresponding openings.Type: ApplicationFiled: August 5, 2009Publication date: February 18, 2010Applicant: IMS Nanofabrication AGInventors: Elmar Platzgummer, Heinrich Fragner, Stefan Cernusca
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Publication number: 20080237460Abstract: For maskless irradiating a target with a beam of energetic electrically charged particles using a pattern definition means with a plurality of apertures and imaging the apertures in the pattern definition means onto a target which moves (v) relative to the pattern definition means laterally to the axis, the location of the image is moved along with the target, for a pixel exposure period within which a distance of relative movement of the target is covered which is at least a multiple of the width (w) of the aperture images as measured on the target, and after said pixel exposure period the location of the beam image is changed, which change of location generally compensates the overall movement of the location of the beam image.Type: ApplicationFiled: March 19, 2008Publication date: October 2, 2008Applicant: IMS NANOFABRICATION AGInventors: Heinrich Fragner, Elmar Platzgummer