Abstract: In a wafer baking automatic machine, a baking chamber is subdivided by separating wall into an inwardly located heating zone containing a heating burner and baking clamps of an endless chain, and a flushing zone containing guiding rails and guiding rollers of the baking clamps movable on the guiding rails, an air supply conduit opens into the heating zone and the flushing zone, and air passages are provided between baking plates of the clamps and side parts of the clamps. Flushing air is supplied into the baking chamber and discharge gas is withdrawn from the latter, wherein the flushing air is admixed prior to its supply into the baking chamber with at least a part of the discharge gas.