Abstract: An ESD protection device for an integrated circuit, which is integrated in a semiconductor substrate of the integrated circuit, has a heavily doped p-region provided with a first connection electrode, a heavily doped n-region provided with a second connection electrode, a lightly doped p-region bordering on the heavily doped p-region, and a lightly doped n-region bordering on the heavily doped n-region and the lightly doped p-region in such a way that the lightly doped regions are arranged at least between the heavily doped regions. The distance which exists between the lightly doped p-region and the heavily doped n-region and which is determined by the lightly doped n-region is dimensioned in such a way that the depletion zone in the lightly doped n-region, which becomes larger as the blocking voltage applied to the connection electrodes increases, reaches the heavily doped n-region before the breakthrough voltage between the lightly doped n-region and the lightly doped p-region has been reached.

Abstract: An ESD protective transistor comprises a heavily doped p-type base region which is arranged in a lightly doped p-well and which is provided with a first terminal. Furthermore, a heavily doped n-type emitter region is arranged in the lightly doped p-well. A heavily doped n-type collector region is separated from the lightly doped p-well through a lightly doped n-type region and is provided with a second terminal. The heavily doped n-type emitter region is not short-circuited with the heavily doped base region viy a common electrode and is of floating design. The doping types of the respective regions may be reversed.

Abstract: For the production of a laminated tube of metal with an outside diameter ranging from 2 to 10 mm, in a first step a metal strip coated on one side (preferably with gold) is placed in a drawing die of a drawing apparatus with fixed internal mandrel, clamped at one end in a movable drawing carriage, and by movement of the drawing carriage is rolled to a tubular insert with a virtually closed gap along the tube axis, the width of the strip corresponding at least approximately to the average circumference of the tubular insert. In a second step the semifinished product shaped as a tubular insert is inserted into an external seamless tube. In a third step the tubes inserted one into the other are clamped each by one end in the drawing carriage of the drawing apparatus and pulled by means of a drawing die with fixed internal mandrel to final dimension (with reduced diameter, the outer tube and the tubular insert being bonded together in a press fit by radial compression.

Abstract: A novel process for the production of heterologous proteins including the use of certain transformed protease deficient yeast strains is provided. The invention concerns also said transformed yeast strains and methods for the production thereof.

Abstract: For the profile kneading of workpiece in strand from (semiproducts) which are transported along a central axis into a working station (profile kneading machine) at least two dies situated opposite one another in pairs for working on the surface of the workpiece are driven by rams at their extremity remote from the axis; the rams are driven radially toward the axis by rolls (cylinders, balls) moving on a circular path relative to outer guiding surfaces of the rams; at the same time at least two pairs of dies, whose radial driving directions are displaced from one another by a given angle (90.degree.), are driven successively by the rolls in a radial direction by means of the guiding surfaces of the rams; the edge length of the dies in each working step is greater than the targeted edge length of the workpiece (semiproduct) that is to be worked.

Abstract: Intermediate material in the form of a metal strip with a contact area is provided with a projection on the bottom surface of its core area, i.e., on the surface to be joined to a contact carrier strip of copper or a copper alloy. The bottom surface of the strip facing the contact carrier strip is plated with a material which consists essentially of silver, and the melting point of the core area of the metal strip is above the melting point of silver. For the production of a semifinished product for electrical contacts, the metal strip is welded by its silver-coated bottom surface to the contact carrier strip, consisting essentially of copper. The silver from the coating on the core area of the metal strip and the copper from the contact carrier strip mix with each other and thus form an alloy which corresponds or is very close to the eutectic alloy with 28 wt. % of copper and the remainder of silver.

Abstract: To manufacture a starting material for electrical contacts, such as relay contacts, a contact sandwich in the form of a metal strip made of a material of good electrical conductivity is bonded to a contact support strip consisting essentially of copper by resistance welding. The bonding surface of the metal strip has wales or ridges running lengthwise, the crests of the ridges being tapered in cross section and being provided with a coating consisting essentially of silver. To produce an electrical contact, the ridges are pressed against a copper contact support and a high heat is produced at the crests of the ridges by a welding circuit. This results in the melting of the silver coating, which is forced between the ridges by the pressure applied through the electrodes of the welding circuit, where it forms a silver-copper alloy with a melting point close to the eutectic.

Abstract: To permit direct bonding of a composite electric contact-and-bonding material to a carrier, such as a reed, magnetic strip, or the like, by thermo-electric heating, the side of the contact-and-bonding material is formed with projections, preferably projecting ridges, ribs, or beads, and a bonding or solder material in wire form is adhered, by rolling on to the valley between the projecting ridges, the bonding or soldering material leaving space free between adjacent ridges or ribs and not filling the entire recess, but projecting outwardly at least as far as the projections or ridges, and preferably slightly therebeyond. The soldering or bonding wire may have round or polygonal, preferably triangular cross section with a pointed tip extending outwardly to provide for concentration of heat upon resistance heating the contact material against the carrier strip.