Patents by Inventor Heins K. Pedersen

Heins K. Pedersen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7713771
    Abstract: A differential pressure sensor includes a micro-electromechanical sensor die fabricated as a plurality of sensor die sites on a semiconductor wafer, and then singularized, the sensor die having a top face surface including die electrical output pads exposed to a first test fluid source and a bottom side surface exposed to a second test fluid source. The differential pressure further has a sensor die support member having a die support member fluid access port with a support member port perimeter; wherein one of the top face surface or the bottom side surface is sealed fully around the support member port perimeter by a wafer scale seal formed on the plurality of sensor die sites before die singulation. Wafer scale seals may be formed by a photofabrication process, screen printing, stamp printing, or pressure transfer printing. Some embodiments may include a photofabricated seal formed by a photosensitive polydimethylsiloxane material, by a filled photofabricated mold, and by photopatterned glass frit.
    Type: Grant
    Filed: September 1, 2006
    Date of Patent: May 11, 2010
    Assignee: Grundfos a/s
    Inventors: Gert Friis Eriksen, Karsten Dyrbye, Heins K. Pedersen, Robert M. Mehalso, Stephen F. Pond
  • Publication number: 20080054383
    Abstract: A differential pressure sensor includes a micro-electromechanical sensor die fabricated as a plurality of sensor die sites on a semiconductor wafer, and then singularized, the sensor die having a top face surface including die electrical output pads exposed to a first test fluid source and a bottom side surface exposed to a second test fluid source. The differential pressure further has a sensor die support member having a die support member fluid access port with a support member port perimeter; wherein one of the top face surface or the bottom side surface is sealed fully around the support member port perimeter by a wafer scale seal formed on the plurality of sensor die sites before die singulation. Wafer scale seals may be formed by a photofabrication process, screen printing, stamp printing, or pressure transfer printing. Some embodiments may include a photofabricated seal formed by a photosensitive polydimethylsiloxane material, by a filled photofabricated mold, and by photopatterned glass frit.
    Type: Application
    Filed: September 1, 2006
    Publication date: March 6, 2008
    Applicant: GRUNDFOS A/S
    Inventors: Gert Friis ERIKSEN, Karsten DYRBYE, Heins K. PEDERSEN, Robert M. MEHALSO, Stephen F. POND