Patents by Inventor Heinz Blunier

Heinz Blunier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170118856
    Abstract: A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.
    Type: Application
    Filed: January 4, 2017
    Publication date: April 27, 2017
    Applicant: MB-Microtec AG
    Inventors: Heinz BLUNIER, Hannes KIND, Sandro M.O.L. SCHNEIDER
  • Patent number: 9572273
    Abstract: A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: February 14, 2017
    Assignee: MB-Microtec AG
    Inventors: Heinz Blunier, Hannes Kind, Sandro M. O. L. Schneider
  • Publication number: 20150208539
    Abstract: A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.
    Type: Application
    Filed: August 27, 2013
    Publication date: July 23, 2015
    Applicant: MB-Microtec AG
    Inventors: Heinz Blunier, Hannes Kind, Sandro M.O.L. Schneider