Patents by Inventor Heinz G. Horbach

Heinz G. Horbach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5519579
    Abstract: The invention is a method for replacing integrated circuit chips directly attached on printed circuit boards, and a board and a replacement card module that may be used to practice the method. As the first step, the electronic component and the surrounding fan-out wiring area on the board is mechanically removed, e.g., by micro-milling, typically leaving a recess in the board. A card module having a replacement electronic component and associated fan-out wiring is attached in the recess of the board by common bonding agents. The card module is designed so that its fan-out wiring matches the removed fan-out wiring, and hence is adapted for attachment to the board wiring. After attaching the card module, the wiring of the board is electrically connected with the wiring of the card module by wire bonding, tape automated bonding or other appropriate solder techniques.
    Type: Grant
    Filed: December 8, 1992
    Date of Patent: May 21, 1996
    Assignee: International Business Machines Corporation
    Inventors: Peter Fink, Heinz G. Horbach
  • Patent number: 5306866
    Abstract: A module containing an electronic package provides a housing for cooling and protecting the electronic package. A top metal shell and a bottom metal shell form a common cavity in which the package is embedded without touching the inner walls of the cavity. A flexible thermally conductive foil is fixed to each of the shells. The foil is adjustable to the surface of the package and is isolated from electrically conductive parts of the package. A cooling liquid fills the gaps between the metal shells and the foils. Flexible isolated circuit means connect the package to the outside of the housing, balancing means balance pressure and volume between the shells, and further means firmly hold together the housing.
    Type: Grant
    Filed: April 13, 1992
    Date of Patent: April 26, 1994
    Assignee: International Business Machines Corporation
    Inventors: Harald W. Gruber, Heinz G. Horbach, Gunther W. Kotzle, Thomas Ludwig, Helmut Schettler
  • Patent number: 4996585
    Abstract: An electronic package (11) which comprises a substrate (12) having several chips (13) arranged thereon, and a plurality of connector pins (26) fitted in pin plates (21-24) and electrically connected via conductors to the chips (13). Each pin plate is mounted by means of at least one flexible connector element (29) connected to the conductors at a respective peripheral section (16-19) of the substrate (12). The pin plates have a base surface in the form of any discretionary polygon, in such a manner that, when folded, form a plane substantially flush with the plane of the substrate (12) into a position beneath the substrate (12), or vice versa. Thus an electronic package is obtained which is less complex in its manufacture and covers a considerably reduced base surface while offering a comparable performance.
    Type: Grant
    Filed: July 18, 1989
    Date of Patent: February 26, 1991
    Assignee: International Business Machines Corporation
    Inventors: Harald Gruber, Kurt Hinrichsmeyer, Heinz G. Horbach, Ewald E. Stadler