Abstract: The invention is a method for replacing integrated circuit chips directly attached on printed circuit boards, and a board and a replacement card module that may be used to practice the method. As the first step, the electronic component and the surrounding fan-out wiring area on the board is mechanically removed, e.g., by micro-milling, typically leaving a recess in the board. A card module having a replacement electronic component and associated fan-out wiring is attached in the recess of the board by common bonding agents. The card module is designed so that its fan-out wiring matches the removed fan-out wiring, and hence is adapted for attachment to the board wiring. After attaching the card module, the wiring of the board is electrically connected with the wiring of the card module by wire bonding, tape automated bonding or other appropriate solder techniques.

Abstract: A module containing an electronic package provides a housing for cooling and protecting the electronic package. A top metal shell and a bottom metal shell form a common cavity in which the package is embedded without touching the inner walls of the cavity. A flexible thermally conductive foil is fixed to each of the shells. The foil is adjustable to the surface of the package and is isolated from electrically conductive parts of the package. A cooling liquid fills the gaps between the metal shells and the foils. Flexible isolated circuit means connect the package to the outside of the housing, balancing means balance pressure and volume between the shells, and further means firmly hold together the housing.

Abstract: An electronic package (11) which comprises a substrate (12) having several chips (13) arranged thereon, and a plurality of connector pins (26) fitted in pin plates (21-24) and electrically connected via conductors to the chips (13). Each pin plate is mounted by means of at least one flexible connector element (29) connected to the conductors at a respective peripheral section (16-19) of the substrate (12). The pin plates have a base surface in the form of any discretionary polygon, in such a manner that, when folded, form a plane substantially flush with the plane of the substrate (12) into a position beneath the substrate (12), or vice versa. Thus an electronic package is obtained which is less complex in its manufacture and covers a considerably reduced base surface while offering a comparable performance.