Patents by Inventor Heinz Hacker

Heinz Hacker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5618858
    Abstract: A polymer material for manufacturing arcing chambers for low-voltage switchgear is characterized by a thermoplastic polymer matrix of polyamide or polyolefin which contains a cellulose material sheathed by cured melamine-formaldehyde resin.
    Type: Grant
    Filed: January 5, 1996
    Date of Patent: April 8, 1997
    Assignee: Siemens Aktiengesellschaft
    Inventors: Hans-Georg Hauschildt, Wilfried Haas, Heinz Hacker
  • Patent number: 5218074
    Abstract: The invention provides epoxy resins having the following structure: ##STR1## The cross-linked epoxy resins have non-linear optical properties. The group "Z" constitutes a nonlinear optical chromophone having stilbene, azo, azomethine or propargyl moieties as linking units.
    Type: Grant
    Filed: September 17, 1991
    Date of Patent: June 8, 1993
    Assignees: Siemens Aktiengesellschaft, Siemens Aktiengesellschaft
    Inventors: Jens Nordmann, Heinz Hacker
  • Patent number: 5187237
    Abstract: The epoxy resins according to the invention demonstrate the following structure: ##STR1## The cross-linked epoxy resins exhibit non-linear optical properties.
    Type: Grant
    Filed: September 17, 1991
    Date of Patent: February 16, 1993
    Assignee: Siemens Aktiengesellschaft
    Inventors: Jens Nordmann, Heinz Hacker
  • Patent number: 4812490
    Abstract: Molding compounds for encapsulating semiconductor components comprise filler-containing polyepoxy resins and a 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxohexahydrotriazine with a C.sub.1 to C.sub.4 alkyl radical as a hardener. The molding compounds are storage-stable and moldings manufactured therefrom meet the requirements for these materials.
    Type: Grant
    Filed: December 14, 1987
    Date of Patent: March 14, 1989
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Kleeberg, Heinz Hacker, Jurgen Huber, Dieter Wilhelm, Heinz K. Laupenmuhlen
  • Patent number: 4783345
    Abstract: Prepregs can be prepared by impregnating reinforcement materials such as glass, carbon or plastic (in the form of fibers or nonwoven or woven materials) with a solution of a polyepoxy resin and a polyamine as a hardener and subsequent drying. For the manufacture of storage-stable prepregs based on polyepoxy resins, 1,3,5-tris(3-amino-4-alkylphenyl-2,4,6-trioxo-hexahydrotriazine with a C.sub.1 - to C.sub.4 alkyl radical is used as the hardener. The new method leads to storage-stable prepregs and assures that composite materials, especially circuit boards, manufactured therefrom meet the requirements for these materials.
    Type: Grant
    Filed: December 14, 1987
    Date of Patent: November 8, 1988
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Kleeberg, Heinz Hacker, Jurgen Huber, Dieter Wilhelm
  • Patent number: 4780360
    Abstract: Electrically insulating composite materials formed from (1) epoxy resins and (2) polymeric fiber reinforcement which have high strength are formed if the cross-linking of the epoxy resin is accomplished by anionic polymerization using tertiary amines of the formula ##STR1## as catalyst.
    Type: Grant
    Filed: August 20, 1986
    Date of Patent: October 25, 1988
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Kleeberg, Klaus-Robert Hauschildt, Heinz Hacker
  • Patent number: 4590256
    Abstract: The invention relates to reaction resins formed from anionically polymerizable di- or tri-functional epoxy compounds which are suitable for impregnating and/or casting large-volume parts. Such reaction resins therefore contain tertiary amine polymerization catalysts of the general formula ##STR1## in a concentration of 0.5 to 10 mass parts, relative to 100 mass parts epoxy compound.
    Type: Grant
    Filed: September 13, 1985
    Date of Patent: May 20, 1986
    Assignee: Siemens Aktiengesellschaft
    Inventors: Heinz Hacker, Walter Ihlein, Heinz-Klaus Laupenmuhlen, Willi Mertens
  • Patent number: 4578452
    Abstract: This application relates to methods for the manufacture of leakage current-proof epoxy-resin molded materials from epoxy resin mixture based on di- or polycarboxylic-acid glycidyl esters, di- or polyfunctional cycloaliphatic olefinic epoxides and dicarboxylic-acid anhydrides, carried out in such a manner that molded materials with good mechanical properties are obtained also for parts of large volume. For this purpose, the invention provides that, by means of the experimentally determined time necessary to reach the maximum temperature during the cross-linking of the epoxy resin mixture under quasi adiabatic conditions, the rate of cross-linking of the epoxy resin mixture is adjusted, by the addition of a diol or polyol, to at least as long as the time necessary to reach the maximum temperature during cross-linking of the glycidyl ester/dicarboxylic acid anhydride components.
    Type: Grant
    Filed: July 20, 1984
    Date of Patent: March 25, 1986
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Kleeberg, Klaus-Robert Hauschildt, Heinz Hacker, Klaus Kretzschmar
  • Patent number: 4528358
    Abstract: Molding materials, laminates, stratified material and cover or protective layers which are of high electrical and mechanical quality are formed from polymerisable epoxy compounds if the corss-linking of the epoxy resins is accomplished by anionic polymerisation, using mixed catalysts of tertiary amines of the formula: ##STR1## and an imidazoles of the formula: ##STR2## as a polymerisation catalysts.
    Type: Grant
    Filed: July 30, 1984
    Date of Patent: July 9, 1985
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Kleeberg, Klaus-Robert Hauschildt, Heinz Hacker, Klaus Kretzschmar
  • Patent number: 4311726
    Abstract: The invention relates to a method for manufacturing a hihg-tensile strength optical waveguide with a plastic layer of the epoxy-acrylate type located on the lightguide fiber, wherein a radiation-hardenable prepolymer is applied to the lightguide fiber immediately after the fiber-drawing process. The invention provides for the use in such a method of a preopolymer, which can be hardened by actinic radiation, of at least one acylated hydroxy ester of acrylic and/or methacrylic acid and an epoxide with n.ltoreq.3 epoxide groups per molecule. The optical waveguides manufactured by the method according the present invention are suitable particularly for purposes of optical information transmission.
    Type: Grant
    Filed: May 30, 1980
    Date of Patent: January 19, 1982
    Assignee: Siemens Aktiengesellschaft
    Inventors: Heinz Hacker, Hubert Aulich, Josef Grabmaier, Nikolaos Douklias
  • Patent number: 4243723
    Abstract: The invention relates to agents for the surface treatment of flat insulating materials having a base of aromatic polyamides, and to a method for improving the surface characteristics of such flat insulating materials. According to the invention, such agents have the structure ##STR1## where at least one of the radicals R.sub.1 to R.sub.3 has a reactive group which can be incorporated into an impregnating resin system. Advantageously at least one of the radicals R.sub.1 to R.sub.3 has a reactive hydrogen atom or has an ethylenic or acetylenic unsaturated grouping.
    Type: Grant
    Filed: July 25, 1977
    Date of Patent: January 6, 1981
    Assignee: Siemens Aktiengesellschaft
    Inventors: Heinz Hacker, Ernst Helwig
  • Patent number: 4213672
    Abstract: A light waveguide with a high tensile strength including a light conducting or optical fiber being coated with a plastic coating to improve the tensile strength characterized by the plastic coating being a plastic lacquer applied directly on the surface of the light conducting fiber, being a high temperature stable material selected from a group consisting of polyurethanes, epoxides, polyesters, polyesterimides, polyimides, and polyvinyl dimethoxymethane, which material has a softening temperature of at least 150.degree. C. The coating has a thickness of at least 2 .mu.m and is uniformly concentrically applied over the entire length of the light conducting fiber without any surface defects. The light waveguide may include an outer covering which is either tightly applied or loosely applied onto the light conducting fiber and its coating. To improve movement of the light conducting fiber and its coating in the covering, a slide layer may be interposed between the outer covering and the plastic lacquer coating.
    Type: Grant
    Filed: June 22, 1978
    Date of Patent: July 22, 1980
    Assignee: Siemens Aktiengesellschaft
    Inventors: Hubert Aulich, Nikolaos Douklias, Heinz Hacker, Guenter Zeidler
  • Patent number: 4072804
    Abstract: The invention provides epoxy resin casting compounds based on polyepoxides, polycarboxylic acids and/or polycarboxylic acid anhydrides with directly or latently present carboxyl functions, which can be converted by polyaddition and/or polymerization into insoluble and unmeltable cross-linked polymers. According to the invention, the carboxyl functions are replaced, at least partially, by maleic acid monoallyl ester and a polymerization-initiating radical former, the maleic acid monoallyl ester component being present in the reaction mixture in free form and/or in the form of adducts to the polyepoxide. The epoxy resin casting compounds constitute systems which can be processed in a wide temperature range and are cross-linked rapidly at elevated temperature.
    Type: Grant
    Filed: September 26, 1975
    Date of Patent: February 7, 1978
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Kleeberg, Heinz Hacker, Klaus-Robert Hauschildt
  • Patent number: 4002797
    Abstract: Lubricants for lacquered wires are provided comprising compounds of the type A-C-B, which compounds at room temperature have an ointment or soap-like consistency, wherein A is a chemical grouping containing reactive groups which permit chemical incorporation in a polymerizable impregnating resin system, B is a saturated or unsaturated aliphatic hydrocarbon radical, and C is a binding member in the form of a carbon, nitrogen, oxygen, or sulfur grouping.The lubricant is advantageously a 2,4-dienoxy-6-aminoalkyl (-ene)-s-triazine, particularly 2,4-dienoxy-6-aminostearyl-s-triazine. Such triazines are also useful according to another embodiment of the invention as lubricants for wire with enamel insulation.
    Type: Grant
    Filed: February 26, 1975
    Date of Patent: January 11, 1977
    Assignee: Siemens Aktiengesellschaft
    Inventors: Heinz Hacker, Ernst Helwig