Abstract: Improved polyamide molding compositions are characterized in that(a) the polyamide essentially contains the polycondensation product of adipic acid, terephthalic acid and hexamethylenediamine,(b) the molding compositions are reinforced with glass fibers and(c) a mixture of copper-, halogen- and phosphorus-containing compounds is present as stabilizer.

Abstract: Flame-resistant, thermoplastic polyamide moulding materials which contain 0.01-4% by weight of polyphenylene oxides as flameproofing agent and which are prepared by mixing the components in the melt.

Abstract: Organic polymers, for example thermoplastics, thermosetting resins, elastomers or lacquers with increased electrical conductivity, characterized by a content of sulphur-containing pyropolymers which have been obtained by pyrolysis of sulphur-containing condensation products of aromatic compounds, which optionally contain hereto-cyclic rings with O, S or N as hetero-atoms and, sulphur or sulphur releasing compounds.

Abstract: Flameproof thermoplastic polyamide moulding materials which contain 2 to 20% by weight, based on the polyamide, of at least one non-halogenated cyclic aromatic inside compound.

Abstract: Process for the preparation of copolyamides from adipic acid, terephthalic acid and hexamethylene diamine containing 25-48% by weight of units of hexamethylene terephthalamide, by precondensing the monomers at a temperature of at least 250.degree. C. and a pressure of at least 35 bar and completing the polycondensation in the usual manner.

Abstract: Thermoplastically processable polyamide moulding compositions which are equipped with inorganic reinforcing materials and contain 3 to 40% by weight, relative to the amount of polyamide, of bisphenols of the formula (I) ##STR1## where R stands for CH.sub.3, CH.sub.3 O, C.sub.2 H.sub.5 group,m and n independently of each other denote whole numbers from 0 to 4 andX denotes a chemical bond, a C.sub.1 -C.sub.7 -alkylene or C.sub.5 -C.sub.6 -cycloalkylene radical, O, S, SO, SO.sub.2, CO or O--(CH.sub.2).sub.p --O-- with p=2 to 10and with the proviso that the sum of the aliphatic C atoms of all the radicals bonded to the phenol rings is <6.

Abstract: Process for the preparation of polyamides from 1,4-diaminobutane and adipic acid, wherein a 40 to 70% strength aqueous solution of the monomers is heated at 280.degree.-320.degree. C., preferably 290.degree.-310.degree. C., for a period of 5 to 30 minutes under a pressure of less than 8 bar, to give a precondensate having a relative viscosity of 1.05 to 2.0, and solid phase after-condensation at 180.degree.-260.degree. C.

Abstract: A process for the production of copolyamides from aromatic dicarboxylic acids, adipic acid, and hexamethylene diamine having from 30 to 51.5% by weight of units of the hexamethylene adipic acid amide, the monomers being precondensed at at least 250.degree. C. and under a pressure of at least 35 bars and the polycondensation being conducted in a conventional manner to completion.

Abstract: Pulverulent red phosphorus stabilized with zinc fluoride and the use thereof as flame-retarding agent to thermoplastic moulding compositions.

Abstract: Thermoplastical processible polyamides are rendered hydrophobic by addition of particular aromatic amines, optionally in combination with selected phenolic compounds.