Patents by Inventor Heinz-Jurgen Dziurla

Heinz-Jurgen Dziurla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5093035
    Abstract: The invention relates to conductive blends made from polyarylenesulphides, preferably polyphenylenesulphides (PPS) with graphite and conductive carbon black.
    Type: Grant
    Filed: February 6, 1989
    Date of Patent: March 3, 1992
    Assignee: Bayer Aktiengesellschaft
    Inventors: Heinz-Jurgen Dziurla, Klaus Kraft, Klaus Reinking, Wolfgang Wehnert
  • Patent number: 4876033
    Abstract: This invention relates to carbon-containing moulded bodies based on thermoplastic polycarbonates and thermoplastic polyalkylene terephtalates with an addition of carbon black and graphite and to a process for the production of these moulded bodies.
    Type: Grant
    Filed: April 25, 1988
    Date of Patent: October 24, 1989
    Assignee: Bayer Aktiengesellschaft
    Inventors: Heinz-Jurgen Dziurla, Dieter Freitag, Werner Waldenrath, Claus Burkhardt, Bernhard Schulte
  • Patent number: 4859263
    Abstract: A method for manufacturing printed electrical circuits which comprise a substrate and copper foil applied thereto by hot embossing in a predetermined circuit pattern, said method comprising(a) providing a laminate which comprises the sequence of a printed circuit substrate, a heat activated adhesive layer, a copper foil and a carrier film which is electrically conductive,(b) passing an electrical current between two electrodes and through the carrier film wherein one electrode has sufficiently large film contact area whereby substantially no resistance heating results from the current density and the other electrode serves as an embossing tool and is of sufficiently small film contact area whereby sufficient resistance heating results from the current density to activate the adhesive layer to bond the copper foil to the substrate in the pattern of said other electrode, and(c) removing from the laminate the carrier film and such copper foil overlying areas where the adhesive was not heat activated thereby leav
    Type: Grant
    Filed: March 17, 1988
    Date of Patent: August 22, 1989
    Assignee: Bayer Aktiengesellschaft AG
    Inventors: Heinz-Jurgen Dziurla, Hans-Leo Weber, Dieter Freitag, Werner Waldenrath