Abstract: A method for manufacturing of a hybrid component carrier includes providing a first layer structure having at least one electrically insulating layer and at least one electrically conductive layer and forming a second layer structure on the first layer structure wherein the second layer structure has at least a first layer and a second layer. The first layer structure has a first density of electrically conductive elements. The second layer structure has a second density of electrically conductive elements. The second density of electrically conductive elements is greater than the first density of electrically conductive elements. The forming of the second layer structure on the first layer structure includes forming the first layer of the second layer structure on the first layer structure and subsequently forming the second layer of the second layer structure on the first layer of the second layer structure.

Abstract: A hybrid component carrier is manufactured by providing a first layer structure having at least one electrically insulating layer and at least one electrically conductive layer; and forming a second layer structure on the first layer structure where the second layer structure includes at least a first layer and a second layer. The first layer structure has a first density of electrically conductive elements. The second layer structure has a second density of electrically conductive elements that is greater than the first density of electrically conductive elements. The forming of the second layer structure on the first layer structure includes forming the first layer of the second layer structure on the first layer structure; and subsequently forming the second layer of the second layer structure on the first layer of the second layer structure.

Abstract: A method of manufacturing a batch of component carriers is disclosed. The method includes providing a plurality of separate wafer structures, each comprising a plurality of electronic components, simultaneously laminating the wafer structures with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and singularizing a structure resulting from the laminating into the plurality of component carriers, each comprising at least one of the electronic components, a part of the at least one electrically conductive layer structure and a part of the at least one electrically insulating layer structure.

Abstract: A component carrier and a method for manufacturing a component carrier are described. The component carrier has a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures. At least a part of the component carrier is formed as a three-dimensionally printed structure.

Abstract: A method of manufacturing an electronic device includes providing a component carrier having a laminate of at least one electrically conductive layer structure and at least one electrically insulating layer structure, providing a mounting base for mounting an electronic component on and/or in the component carrier, and integrally forming a wall structure with the component carrier prior to mounting an electronic component on the mounting base, the integrally formed wall structure at least partially surrounding the mounting base for mounting the electronic component on the mounting base and protected by the wall structure.

Abstract: A hybrid component carrier is manufactured by providing a first layer structure having at least one electrically insulating layer and at least one electrically conductive layer; and forming a second layer structure on the first layer structure where the second layer structure includes at least a first layer and a second layer. The first layer structure has a first density of electrically conductive elements. The second layer structure has a second density of electrically conductive elements that is greater than the first density of electrically conductive elements. The forming of the second layer structure on the first layer structure includes forming the first layer of the second layer structure on the first layer structure; and subsequently forming the second layer of the second layer structure on the first layer of the second layer structure.

Abstract: An inductor component includes a plurality of stacked layer structures made of component carrier material with electrically conductive plate structures, and a plurality of electrically conductive interconnect structures connecting the electrically conductive plate structures to thereby form an inductance with multiple windings.