Patents by Inventor Heinz Pape
Heinz Pape has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7602614Abstract: An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.Type: GrantFiled: June 4, 2004Date of Patent: October 13, 2009Assignee: Infineon Technologies AGInventors: Michael Bauer, Wolfram Eurskens, Rudolf Kerler, Heinz Pape, Peter Strobel, Stephan Stoeckl
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Patent number: 7489023Abstract: A semiconductor device includes a semiconductor chip, where the semiconductor chip includes signal contact areas and supply contact areas. The signal contact areas are arranged on edge regions of the active top side of the semiconductor chip and are electrically connected to external signal exterior connections of the semiconductor device by connecting elements. The active top side of the semiconductor chip includes at least two supply collective electrodes made of annularly patterned metal foils which are arranged within the signal contact areas and are affixed in an electrically insulating manner on the top side. The supply collective electrodes are electrically connected to the supply contact areas of the semiconductor chip by internal connecting elements.Type: GrantFiled: February 27, 2006Date of Patent: February 10, 2009Assignee: Infineon Technologies AGInventor: Heinz Pape
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Patent number: 7276785Abstract: The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.Type: GrantFiled: September 7, 2004Date of Patent: October 2, 2007Assignee: Infineon Technologies AGInventors: Michael Bauer, Wolfram Eurskens, Gerold Gruendler, Rudolf Kerler, Heinz Pape, Peter Strobel
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Publication number: 20060250781Abstract: An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.Type: ApplicationFiled: June 4, 2004Publication date: November 9, 2006Applicant: INFINEON TECHNOLOGIES AGInventors: Michael Bauer, Wolfram Eurskens, Rudolf Kerter, Heinz Pape, Peter Strobe, Stephan Stoeckl
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Publication number: 20060197234Abstract: A semiconductor device includes a semiconductor chip, where the semiconductor chip includes signal contact areas and supply contact areas. The signal contact areas are arranged on edge regions of the active top side of the semiconductor chip and are electrically connected to external signal exterior connections of the semiconductor device by connecting elements. The active top side of the semiconductor chip includes at least two supply collective electrodes made of annularly patterned metal foils which are arranged within the signal contact areas and are affixed in an electrically insulating manner on the top side. The supply collective electrodes are electrically connected to the supply contact areas of the semiconductor chip by internal connecting elements.Type: ApplicationFiled: February 27, 2006Publication date: September 7, 2006Inventor: Heinz Pape
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Publication number: 20050052830Abstract: The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.Type: ApplicationFiled: September 7, 2004Publication date: March 10, 2005Inventors: Michael Bauer, Wolfram Eurskens, Gerold Gruendler, Rudolf Kerler, Heinz Pape, Peter Strobel
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Patent number: 6215171Abstract: An IC module has one or more integrated circuits and a package surrounding them. The IC module is distinguished by one or more additional electronic components being accommodated inside the package, in the immediate vicinity of the integrated circuit.Type: GrantFiled: January 4, 2000Date of Patent: April 10, 2001Assignee: Infineon Technologies AGInventor: Heinz Pape
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Patent number: 5982028Abstract: One embodiment of a semiconductor device includes a semiconductor chip having long sides. A system carrier is connected to the semiconductor chip and has an island. The island has an opening formed centrally therein over a large area. The opening is wider than the semiconductor chip on two of the long sides of the semiconductor chip. Another embodiment of a semiconductor device includes a semiconductor chip having corner regions. A system carrier is connected to the semiconductor chip and has an island with an opening formed therein. The semiconductor chip is joined to the island only in the corner regions.Type: GrantFiled: February 28, 1996Date of Patent: November 9, 1999Assignee: Siemens AktiengesellschaftInventors: Heinz Pape, Frank Hubrich
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Patent number: 5054032Abstract: A gas laser housing having a housing and a metal cap attached thereto, includes a mirror mount attached to the metal cap. The mirror mount is provided with an annular region of reduced diameter affixed to the metal cap to absorb mechanical stresses and thereby prevents stress crack corrosion at the circumference of the housing tube.Type: GrantFiled: May 24, 1990Date of Patent: October 1, 1991Assignee: Siemens AktiengesellschaftInventors: Hans Krueger, Wolfgang Welsch, Michael Schulz, Heinz Pape
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Patent number: 4394068Abstract: An electro-optical display device has a fluorescently activated plate disposed in front of a passive display in the line of sight of a viewer. The entire surface of the fluorescently activated plate is uncovered and is available for collecting ambient light to provide an image of increased intensity and allowing the device to be utilized in environments having low optical radiation levels. The fluorescently activated plate has exit windows thereon for retransmitting the light as controlled by the switchable regions of the passive display in a designated pattern to a viewer.Type: GrantFiled: February 14, 1980Date of Patent: July 19, 1983Assignee: Siemens AktiengesellschaftInventors: Heinz Pape, Ferdinand Quella, Hans Krueger
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Patent number: 4382272Abstract: A colored lamp is emitting colored light of a given range of wavelengths and particularly useful for interior and exterior lighting, for luminous advertising, for street lighting, for signal lights and for decorations characterized by a source of light and an arrangement for absorbing a light wave spectrum which has a shorter wavelength than the given range and for emitting light with a longer wavelength due to photo-luminescence with the arrangements including at least one body provided with a luminescent substance for absorbing the light and emitting the luminescent light. The body may be formed by a container of liquid, a bundle of optical fibers or a solid member which acts as a light concentrator in such a manner that the incident light is collected and conducted by means of a photo-luminescent scattering and subsequent total reflection at the boundary surfaces of the body, with the luminescent light being emitted in specific output locations.Type: GrantFiled: October 28, 1980Date of Patent: May 3, 1983Assignee: Siemens AktiengesellschaftInventors: Ferdinand Quella, Heinz Pape
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Patent number: 4377750Abstract: A passive display device particularly useful for signs and reflectors and not requiring any light source characterized by a device for entrapping light and then emitting entrapped light at given positions at an increased intensity. The device for entrapping light includes at least one transparent fluorescent member having an index or refraction greater than 1 and containing fluorescent particles which collect impinging light by fluorescent scattering with subsequent reflection on the boundary surface of the member and the device has output coupling zones which are disposed on one of the members such as the fluorescent member in a desired pattern for uncoupling light from the device in a desired pattern. The device may include phosphorescent particles, which will emit light during periods of darkness and which may be either scattered through a member or applied at the uncoupling zones so that the light being uncoupled is a phosphorescent light.Type: GrantFiled: September 4, 1980Date of Patent: March 22, 1983Assignee: Siemens AktiengesellschaftInventors: Heinz Pape, Ferdinand Quella
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Patent number: 4340817Abstract: A signal element without a lamp for use with signal buttons, toggle switches, control knobs, slide switches and the like which has a moveable member received in the housing member for movement between at least two positions to cause actuation of the part of the element characterized by a fluorescent member consisting of a body of material having an index of refraction >1 and containing fluorescent particles for fluorescently collecting and scattering incident light to create fluorescent light and means for uncoupling concentrated fluorescent light from the fluorescent member to a point of the element in response to a selected position of the moveable member in the housing member. The moveable member may be a push button, a pivotable rocking member or a slide and the fluorescent member may be carried by the moveable member or may be part of the housing, which receives the moveable member.Type: GrantFiled: June 19, 1980Date of Patent: July 20, 1982Assignee: Siemens AktiengesellschaftInventors: Ferdinand Quella, Heinz Pape
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Patent number: 4298802Abstract: A method and a device for collecting light characterized by a body which acts as a light trap, contains at least two different groups of fluorescent particles with each group having an absorption range and light emitting range which are different from the other groups, and has at least one light decoupling window to emit the fluorescent light therefrom.Type: GrantFiled: February 28, 1980Date of Patent: November 3, 1981Assignee: Siemens AktiengesellschaftInventors: Ferdinand Quella, Heinz Pape