Patents by Inventor Heinz Pape

Heinz Pape has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7602614
    Abstract: An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: October 13, 2009
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Wolfram Eurskens, Rudolf Kerler, Heinz Pape, Peter Strobel, Stephan Stoeckl
  • Patent number: 7489023
    Abstract: A semiconductor device includes a semiconductor chip, where the semiconductor chip includes signal contact areas and supply contact areas. The signal contact areas are arranged on edge regions of the active top side of the semiconductor chip and are electrically connected to external signal exterior connections of the semiconductor device by connecting elements. The active top side of the semiconductor chip includes at least two supply collective electrodes made of annularly patterned metal foils which are arranged within the signal contact areas and are affixed in an electrically insulating manner on the top side. The supply collective electrodes are electrically connected to the supply contact areas of the semiconductor chip by internal connecting elements.
    Type: Grant
    Filed: February 27, 2006
    Date of Patent: February 10, 2009
    Assignee: Infineon Technologies AG
    Inventor: Heinz Pape
  • Patent number: 7276785
    Abstract: The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.
    Type: Grant
    Filed: September 7, 2004
    Date of Patent: October 2, 2007
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Wolfram Eurskens, Gerold Gruendler, Rudolf Kerler, Heinz Pape, Peter Strobel
  • Publication number: 20060250781
    Abstract: An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.
    Type: Application
    Filed: June 4, 2004
    Publication date: November 9, 2006
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Michael Bauer, Wolfram Eurskens, Rudolf Kerter, Heinz Pape, Peter Strobe, Stephan Stoeckl
  • Publication number: 20060197234
    Abstract: A semiconductor device includes a semiconductor chip, where the semiconductor chip includes signal contact areas and supply contact areas. The signal contact areas are arranged on edge regions of the active top side of the semiconductor chip and are electrically connected to external signal exterior connections of the semiconductor device by connecting elements. The active top side of the semiconductor chip includes at least two supply collective electrodes made of annularly patterned metal foils which are arranged within the signal contact areas and are affixed in an electrically insulating manner on the top side. The supply collective electrodes are electrically connected to the supply contact areas of the semiconductor chip by internal connecting elements.
    Type: Application
    Filed: February 27, 2006
    Publication date: September 7, 2006
    Inventor: Heinz Pape
  • Publication number: 20050052830
    Abstract: The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.
    Type: Application
    Filed: September 7, 2004
    Publication date: March 10, 2005
    Inventors: Michael Bauer, Wolfram Eurskens, Gerold Gruendler, Rudolf Kerler, Heinz Pape, Peter Strobel
  • Patent number: 6215171
    Abstract: An IC module has one or more integrated circuits and a package surrounding them. The IC module is distinguished by one or more additional electronic components being accommodated inside the package, in the immediate vicinity of the integrated circuit.
    Type: Grant
    Filed: January 4, 2000
    Date of Patent: April 10, 2001
    Assignee: Infineon Technologies AG
    Inventor: Heinz Pape
  • Patent number: 5982028
    Abstract: One embodiment of a semiconductor device includes a semiconductor chip having long sides. A system carrier is connected to the semiconductor chip and has an island. The island has an opening formed centrally therein over a large area. The opening is wider than the semiconductor chip on two of the long sides of the semiconductor chip. Another embodiment of a semiconductor device includes a semiconductor chip having corner regions. A system carrier is connected to the semiconductor chip and has an island with an opening formed therein. The semiconductor chip is joined to the island only in the corner regions.
    Type: Grant
    Filed: February 28, 1996
    Date of Patent: November 9, 1999
    Assignee: Siemens Aktiengesellschaft
    Inventors: Heinz Pape, Frank Hubrich
  • Patent number: 5054032
    Abstract: A gas laser housing having a housing and a metal cap attached thereto, includes a mirror mount attached to the metal cap. The mirror mount is provided with an annular region of reduced diameter affixed to the metal cap to absorb mechanical stresses and thereby prevents stress crack corrosion at the circumference of the housing tube.
    Type: Grant
    Filed: May 24, 1990
    Date of Patent: October 1, 1991
    Assignee: Siemens Aktiengesellschaft
    Inventors: Hans Krueger, Wolfgang Welsch, Michael Schulz, Heinz Pape
  • Patent number: 4394068
    Abstract: An electro-optical display device has a fluorescently activated plate disposed in front of a passive display in the line of sight of a viewer. The entire surface of the fluorescently activated plate is uncovered and is available for collecting ambient light to provide an image of increased intensity and allowing the device to be utilized in environments having low optical radiation levels. The fluorescently activated plate has exit windows thereon for retransmitting the light as controlled by the switchable regions of the passive display in a designated pattern to a viewer.
    Type: Grant
    Filed: February 14, 1980
    Date of Patent: July 19, 1983
    Assignee: Siemens Aktiengesellschaft
    Inventors: Heinz Pape, Ferdinand Quella, Hans Krueger
  • Patent number: 4382272
    Abstract: A colored lamp is emitting colored light of a given range of wavelengths and particularly useful for interior and exterior lighting, for luminous advertising, for street lighting, for signal lights and for decorations characterized by a source of light and an arrangement for absorbing a light wave spectrum which has a shorter wavelength than the given range and for emitting light with a longer wavelength due to photo-luminescence with the arrangements including at least one body provided with a luminescent substance for absorbing the light and emitting the luminescent light. The body may be formed by a container of liquid, a bundle of optical fibers or a solid member which acts as a light concentrator in such a manner that the incident light is collected and conducted by means of a photo-luminescent scattering and subsequent total reflection at the boundary surfaces of the body, with the luminescent light being emitted in specific output locations.
    Type: Grant
    Filed: October 28, 1980
    Date of Patent: May 3, 1983
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ferdinand Quella, Heinz Pape
  • Patent number: 4377750
    Abstract: A passive display device particularly useful for signs and reflectors and not requiring any light source characterized by a device for entrapping light and then emitting entrapped light at given positions at an increased intensity. The device for entrapping light includes at least one transparent fluorescent member having an index or refraction greater than 1 and containing fluorescent particles which collect impinging light by fluorescent scattering with subsequent reflection on the boundary surface of the member and the device has output coupling zones which are disposed on one of the members such as the fluorescent member in a desired pattern for uncoupling light from the device in a desired pattern. The device may include phosphorescent particles, which will emit light during periods of darkness and which may be either scattered through a member or applied at the uncoupling zones so that the light being uncoupled is a phosphorescent light.
    Type: Grant
    Filed: September 4, 1980
    Date of Patent: March 22, 1983
    Assignee: Siemens Aktiengesellschaft
    Inventors: Heinz Pape, Ferdinand Quella
  • Patent number: 4340817
    Abstract: A signal element without a lamp for use with signal buttons, toggle switches, control knobs, slide switches and the like which has a moveable member received in the housing member for movement between at least two positions to cause actuation of the part of the element characterized by a fluorescent member consisting of a body of material having an index of refraction >1 and containing fluorescent particles for fluorescently collecting and scattering incident light to create fluorescent light and means for uncoupling concentrated fluorescent light from the fluorescent member to a point of the element in response to a selected position of the moveable member in the housing member. The moveable member may be a push button, a pivotable rocking member or a slide and the fluorescent member may be carried by the moveable member or may be part of the housing, which receives the moveable member.
    Type: Grant
    Filed: June 19, 1980
    Date of Patent: July 20, 1982
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ferdinand Quella, Heinz Pape
  • Patent number: 4298802
    Abstract: A method and a device for collecting light characterized by a body which acts as a light trap, contains at least two different groups of fluorescent particles with each group having an absorption range and light emitting range which are different from the other groups, and has at least one light decoupling window to emit the fluorescent light therefrom.
    Type: Grant
    Filed: February 28, 1980
    Date of Patent: November 3, 1981
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ferdinand Quella, Heinz Pape