Abstract: A process for the manufacture of printed multilayer circuits by coating carrier films, which possess metal layers, with a light-sensitive material containing a compound with epoxide groups and with groups which can be cured by electromagnetic rays, by exposing the light-sensitive material through a transparent film which shows the negative image of the conductor traces to be produced, by developing with an organic solvent, by etching the metal layer and pressing the laminates together to form a multi-layer circuit. The parts of the light-sensitive layer which have been pre-cured by exposure to light are subjected to a thermal after-treatment using a curing agent for epoxide groups, whereby these parts are post-cured. These parts are not removed from the carriers films.