Patents by Inventor Heinz Ru

Heinz Ru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pin grid array package
    Patent number: 5045639
    Abstract: A pin grid array package having a substrate formed from a ceramics containing a 90% or higher alumina composition. The substrate has an palladium-silver layer on an upper surface thereof with a silver layer further provided on the Pd-Ag layer and a gold bonding pad on a outer periphery of a cavity of the substrate so as to provide electrical connection between pins and chip. The Ag layer is covered with a dielectric layer to prevent contamination from moisture.
    Type: Grant
    Filed: August 21, 1990
    Date of Patent: September 3, 1991
    Assignee: Tong Hsing Electronic Industries Ltd.
    Inventors: Henry Liu, Heinz Ru