Abstract: Processes and composition for soldering aluminum-containing workpieces wherein the solder contains components which lower the surface tension and the viscosity of the molten solder, and which lower the interfacial tension between the solder and the aluminum-containing workpieces. Useful components are bismuth, strotium, barium and antimony. The solder may be used with or without flux.

Abstract: Processes and compositions for soldering aluminum-containing workpieces wherein the solder contains components which lower the surface tension and the viscosity of the molten solder, and which lower the interfacial tension between the solder and the aluminum-containing workpieces. Useful components are bismuth, strontium, barium and antimony. The solder may be used with or without flux.

Abstract: An aluminum-silicon base brazing alloy contains between 4 and 20 percent by weight of silicon and between 0.0001 and 1.0 percent by weight, preferably between 0.005 and 0.1 percent by weight, of at least one of the elements sodium, potassium and lithium. Optionally, the brazing alloy may further include between 0.01 and 10 percent by weight, preferably between 0.05 and 2 percent by weight, of at least one of the elements bismuth, strontium, barium and antimony as well as between 0.00001 and 1.0 percent by weight, preferably between 0.0002 and 0.1 percent by weight, of beryllium. The remainder of the alloy consists essentially of aluminum and impurities conditioned by production of the brazing alloy. The alloy is used for the fluxless brazing of aluminum-containing articles in substantially non-oxidizing atmospheres.

Abstract: Processes and compositions for soldering aluminum-containing workpieces wherein the solder contains components which lower the surface tension and the viscosity of the molten solder, and which lower the interfacial tension between the solder and the aluminum-containing workpieces. Useful components are bismuth, strontium, barium and antimony. The solder may be used with or without flux.

Abstract: A furnace for flux-free soldering of aluminum-containing workpieces in a controlled atmosphere has a furnace chamber through which workpieces to be soldered are made to travel. The furnace chamber itself is a gas-tight metallic muffle which is thermally insulated from the outer part of the furnace and has an inlet for the workpieces and an outlet for them. A first lock chamber is interposed between the furnace chamber and the inlet, and a second lock chamber is interposed between the outlet and the furnace chamber. Arrangements are provided for admitting vacuum and protective gas into the lock chambers, and protective gas into the muffle and a heating arrangement is provided for heating the controlled atmosphere in the muffle.