Patents by Inventor Heinz Schorner

Heinz Schorner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for the cooling of optoelectronic components and use of a flange joint used thereof
    Patent number: 4985805
    Abstract: In a device for the cooling of optoelectronic components (1) with an evacuated cooler housing mounted on a base, in which there are provided at least one holding device for components (1) which is thermally coupled with the cold station of a cooling unit through at least one flexible metal band (19), the housing of the cooling unit is for vibrational decoupling connected with the cooler housing and sealed against atmospheric pressure through ring-shaped rubber-elastic sealing means. The at least one holding device (8), through a flexible metal band (19) thermally coupled to a cold station, of a refrigeration unit, that protrudes into the cooler housing, comprises a retaining plate (17) which is arranged on one end of a thin-walled, essentially prismatic or cylindrical body from a thermally poorly conductive material, specifically epoxy resin panels (9, 10, 11, 12).
    Type: Grant
    Filed: July 21, 1988
    Date of Patent: January 15, 1991
    Assignees: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V., Siemens Aktiengesellschaft
    Inventors: Wolfgang Riedel, Richard Wissler, Otmar Fichter, Klaus Gregorius, Gerhard Mattauch, Heinz Schorner