Patents by Inventor Heiqiang Zhang

Heiqiang Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIGHT CURABLE (METH)ACRYLATE RESIN COMPOSITION FOR THERMOPLASTIC ELASTOMERS BONDING
    Publication number: 20210371551
    Abstract: The present invention provides a light curable (meth)acrylate resin composition for thermoplastic elastomer bonding. The light curable (meth)acrylate resin composition of the present invention comprises: a (meth)acrylic monomer, a polyolefin (meth)acrylate oligomer having a viscosity of 200 000 to 2 500 000 mPa*s at 25° C., and a photoinitiator. The present invention also provides a cured product of the light curable (meth)acrylate resin composition and a use of the composition.
    Type: Application
    Filed: August 6, 2021
    Publication date: December 2, 2021
    Inventors: Heiqiang Zhang, Chongjian Song, Zuohe Wang, Chongyang Sun