Abstract: A process kit enclosure system includes walls and a retention device structure. The retention device structure includes a retention device post and a retention device fin. The retention device fin in a first position is disposed above and secures a process kit ring supported in the interior volume of the process kit enclosure system. The retention device fin is rotated from the first position to be in a second position to be outside a boundary of the process kit ring. The retention device post is aligned with and inserts into a recess formed by a top cover of the process kit enclosure system responsive to the retention device post being in the first position. The retention device post is misaligned with and blocked from inserting into the recess formed by the top cover responsive to the retention device post of the retention device structure being in the second position.

Abstract: A process kit enclosure system includes surfaces to enclose an interior volume, a first support structure including first fins, a second support structure including second fins, and a front interface to interface the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each of the process kit rings is secured to one of the process kit ring carriers. The process kit enclosure system enables first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system into the wafer processing system and second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system into the process kit enclosure system.

Abstract: A system includes a factory interface, a load port connected to the factory interface, and a system controller. The system controller is to, responsive to detecting that a container is received at the load port, determine a type of parts for storage at the container. One or more mapping patterns associated with the determined type of parts is identified. A detection system of robot arm(s) of the factory interface is moved according to the identified mapping pattern(s) to detect one or more parts stored by the container. A mapping of the container is determined based on the movement of the robot arm(s). The mapping indicates regions of the container that stores detected parts and a position of each of the detected parts. Based on the mapping, the robot arm(s) either remove a detected part form the container or place an additional part in the container.

Abstract: A system includes a factory interface, a load port connected to the factory interface, a container connected to the load port, and a controller connected to a robot arm of the factory interface. The controller determines that the container is configured to store replacement parts for a process chamber of the system and causes the robot arm to move according to a first mapping pattern to identify, using a detection system at a distal end of an end effector of the robot arm, positions in the container. Regions of the container that do not contain replacement parts are determined and the robot arm is moved according to a second mapping pattern to identify a position in the container of a wafer and/or an empty carrier for a replacement part. A mapping of positions of replacement parts and positions of the wafer and/or empty carrier is recorded in a storage medium.

Abstract: A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces. The one or more upper surfaces are configured to support a process kit ring. The one or more lower surfaces are configured to interface with an end effector. The process kit ring adaptor supporting the process kit ring is configured to be transported on the end effector within a processing system.

Abstract: Systems and methods for grip-based transport speeds for objects transported at a manufacturing system is provided. A controller can detect an object placed on an end effector of a robot arm. The controller can apply vacuum pressure to secure the object to the end effector via vacuum grip pads. The controller can obtain a vacuum pressure measurement indicating the amount of vacuum pressure between the object and the end effector and determine whether the obtained vacuum pressure measurement satisfies a vacuum pressure criterion. The controller can determine a transport speed setting for transporting the object using the robot arm based on whether the obtained vacuum pressure measurement satisfies the vacuum pressure criterion. The controller can cause the robot arm to move the object according to the transport speed setting.

Abstract: A system includes a factory interface, a load port connected to the factory interface, a container connected to the load port, and a controller connected to a robot arm of the factory interface. The controller determines that the container is configured to store replacement parts for a process chamber of the system and causes the robot arm to move according to a first mapping pattern to identify, using a detection system at a distal end of an end effector of the robot arm, positions in the container. Regions of the container that do not contain replacement parts are determined and the robot arm is moved according to a second mapping pattern to identify a position in the container of a wafer and/or an empty carrier for a replacement part. A mapping of positions of replacement parts and positions of the wafer and/or empty carrier is recorded in a storage medium.

Abstract: A method for detecting positions of replacement parts, wafers, or empty carriers for a replacement part stored at a replacement parts storage container is provided. A container is received at a at a load port of a factory interface of an electronics processing system. The container is configured to store replacement parts for a process chamber of the electronics processing system. A robot arm is moved according to a first mapping pattern to identify, using a detection system at a distal end of an end effector of the robot arm, positions of one or more replacement parts in the container. Regions of the container that do not contain replacement parts are determined. The robot arm is moved according to a second mapping pattern to identify, within the regions of the container that do not contain replacement parts, using the detection system, a position in the container of at least one of a wafer or an empty carrier for a replacement part.

Abstract: A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces. The one or more upper surfaces are configured to support a process kit ring. The one or more lower surfaces are configured to interface with an end effector. The process kit ring adaptor supporting the process kit ring is configured to be transported on the end effector within a processing system.

Abstract: A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.

Abstract: A method for detecting positions of replacement parts, wafers, or empty carriers for a replacement part stored at a replacement parts storage container is provided. A container is received at a at a load port of a factory interface of an electronics processing system. The container is configured to store replacement parts for a process chamber of the electronics processing system. A robot arm is moved according to a first mapping pattern to identify, using a detection system at a distal end of an end effector of the robot arm, positions of one or more replacement parts in the container. Regions of the container that do not contain replacement parts are determined. The robot arm is moved according to a second mapping pattern to identify, within the regions of the container that do not contain replacement parts, using the detection system, a position in the container of at least one of a wafer or an empty carrier for a replacement part.

Abstract: A process kit enclosure system includes surfaces to enclose an interior volume, a first support structure including first fins, a second support structure including second fins, and a front interface to interface the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each of the process kit rings is secured to one of the process kit ring carriers. The process kit enclosure system enables first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system into the wafer processing system and second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system into the process kit enclosure system.

Abstract: A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.

Abstract: Methods and apparatus for increasing flow uniformity are provided herein. In some embodiments, a slit valve having increased flow uniformity may be provided, the slit valve may include a housing having an opening disposed therethrough, the opening configured to allow a substrate to pass therethrough; a gas inlet formed in the housing; an outer plenum disposed in the housing and coupled to the gas inlet; an inner plenum disposed in the housing and coupled to the outer plenum via a plurality of holes; and a plurality of gas outlets disposed in the housing and fluidly coupling the opening to the inner plenum.

Abstract: A cooling plate includes a channel to transmit a fluid, wherein the channel is disposed within a base and the channel has a first portion and a second portion. The first portion is disposed substantially along a peripheral edge of the base, and the second portion is coupled to the first portion and is disposed further away from the peripheral edge of the base than the first portion. The second portion has a length that is at least about 35% as long as the length of the first portion. The cooling plate also includes a lid disposed over the base and the channel, wherein the lid provides support for a substrate.

Abstract: Methods and apparatus for increasing flow uniformity are provided herein. In some embodiments, a slit valve having increased flow uniformity may be provided, the slit valve may include a housing having an opening disposed therethrough, the opening configured to allow a substrate to pass therethrough; a gas inlet formed in the housing; an outer plenum disposed in the housing and coupled to the gas inlet; an inner plenum disposed in the housing and coupled to the outer plenum via a plurality of holes; and a plurality of gas outlets disposed in the housing and fluidly coupling the opening to the inner plenum.

Abstract: Methods and apparatus for increasing flow uniformity are provided herein. In some embodiments, a slit valve having increased flow uniformity may be provided, the slit valve may include a housing having an opening disposed therethrough, the opening configured to allow a substrate to pass therethrough; a gas inlet formed in the housing; an outer plenum disposed in the housing and coupled to the gas inlet; an inner plenum disposed in the housing and coupled to the outer plenum via a plurality of holes; and a plurality of gas outlets disposed in the housing and fluidly coupling the opening to the inner plenum.

Abstract: A cooling plate includes a channel to transmit a fluid, wherein the channel is disposed within a base and the channel has a first portion and a second portion. The first portion is disposed substantially along a peripheral edge of the base, and the second portion is coupled to the first portion and is disposed further away from the peripheral edge of the base than the first portion. The second portion has a length that is at least about 35% as long as the length of the first portion. The cooling plate also includes a lid disposed over the base and the channel, wherein the lid provides support for a substrate.