Patents by Inventor Helen Berney
Helen Berney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240125779Abstract: The present disclosure provides a sensing assembly for sensing an analyte. The sensing assembly comprises multiple test electrodes configured to provide signals from multiple independent measurements in response to the analyte. Alternatively or additionally, the multiple test electrodes are configured to produce different transient responses in response to a given concentration of the analyte.Type: ApplicationFiled: January 21, 2022Publication date: April 18, 2024Inventors: Helen BERNEY, Youri Victorvitch PONOMAREV, Joyce WU, Christophe ANTOINE
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Publication number: 20230079001Abstract: A sensor assembly for sensing an analyte in a sample matrix comprises an electrode assembly comprising a set of at least one test electrode and may also comprise one or more control electrodes and/or an applicator assembly. The electrode assembly is configured or configurable to define one or more active test electrodes of the set of one or more test electrodes, and at least one of the electrode assembly and the applicator assembly is or are configured or configurable to adjust a quantity of the analyte provided to the active electrode(s), per unit time, for said interaction based at least in part on an analyte characteristic. Alternatively or additionally, the electrode assembly is configured and arranged in a flow path such that the amounts of sample matrix provided to the test electrode(s) and control electrode(s) of the electrode assembly are substantially equal.Type: ApplicationFiled: September 6, 2022Publication date: March 16, 2023Applicant: Analog Devices International Unlimited CompanyInventors: Christophe ANTOINE, Helen BERNEY, Youri V. PONOMAREV, Joyce WU
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Publication number: 20220146449Abstract: An electrochemical sensor is provided which may be formed using micromachining techniques commonly used in the manufacture of integrated circuits. This is achieved by forming microcapillaries in a silicon substrate and forming an opening in an insulating layer to allow environmental gases to reach through to the top side of the substrate. A porous electrode is printed on the top side of the insulating layer such that the electrode is formed in the opening in the insulating layer. The sensor also comprises at least one additional electrode. The electrolyte is then formed on top of the electrodes. A cap is formed over the electrodes and electrolyte. This arrangement may easily be produced using micromachining techniques.Type: ApplicationFiled: January 26, 2022Publication date: May 12, 2022Inventors: Alfonso Berduque, Helen Berney, William Allan Lane, Raymond J. Speer, Brendan Cawley, Donal McAuliffe, Patrick Martin McGuinness
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Publication number: 20220126300Abstract: The present disclosure relates to a microfabricated thermal platform. The platform is formed over a substrate, which may for example be a silicon wafer, and which may form part of the platform. The substrate is coated in a thermally-insulating material, which may be an organic polymer such, as polyimide or SU8. The thermally-insulating material may have a predetermined thermal conductivity, which is dependent on thickness, geometry and processing. The surface of the thermally-insulating material may include an arrangement of thermal sites, with each site having a reaction plate (or thermal plate) over which chemical reactions may occur. A heating element may be positioned beneath each reaction plate. The thermal platform may have a plurality of such thermal sites arranged over the upper surface of the thermally-insulating material. However, it will be appreciated that in practice, there could be a single thermal site.Type: ApplicationFiled: June 22, 2020Publication date: April 28, 2022Inventors: Christophe Antoine, Helen Berney, Bernard Stenson, Ramji Sitaraman Lakshmana, William Allan Lane, Himanshu Jain, Christina B. McLoughlin, Shane Geary, Michael C.W. Coln, Donal McAuliffe
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Patent number: 11268927Abstract: An electrochemical sensor is provided which may be formed using micromachining techniques commonly used in the manufacture of integrated circuits. This is achieved by forming microcapillaries in a silicon substrate and forming an opening in an insulating layer to allow environmental gases to reach through to the top side of the substrate. A porous electrode is printed on the top side of the insulating layer such that the electrode is formed in the opening in the insulating layer. The sensor also comprises at least one additional electrode. The electrolyte is then formed on top of the electrodes. A cap is formed over the electrodes and electrolyte. This arrangement may easily be produced using micromachining techniques.Type: GrantFiled: August 29, 2017Date of Patent: March 8, 2022Assignee: Analog Devices International Unlimited CompanyInventors: Alfonso Berduque, Helen Berney, William Allan Lane, Raymond J. Speer, Brendan Cawley, Donal McAuliffe, Patrick Martin McGuinness
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Patent number: 10672968Abstract: An embodiment of a thermoelectric device may include a plurality of thermoelectric cells disposed between first and second planes. Each of the thermoelectric cells may include a thermoelectric element formed from a thermoelectric material of a single semiconductor type, the thermoelectric element including a first end, a second end, and a portion extending from the first end to the second end, the portion extending from the first end to the second end including at least two surfaces that face each other; and at least one conductive element electrically connected to and extending away from the second end of the thermoelectric element toward the first end of the thermoelectric element of another thermoelectric cell. Each thermoelectric cell also may further include an insulating element disposed between the at least two surfaces of the thermoelectric element and between portions of the at least one conductive element.Type: GrantFiled: July 21, 2015Date of Patent: June 2, 2020Assignee: Analog Devices GlobalInventors: Patrick M. McGuinness, Helen Berney, Jane Cornett, William Alan Lane, Baoxing Chen
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Patent number: 10620151Abstract: An electrochemical sensor is provided which may be formed using micromachining techniques commonly used in the manufacture of integrated circuits. This is achieved by forming microcapillaries in a silicon substrate and forming an opening in an insulating layer to allow environmental gases to reach through to the top side of the substrate. A porous electrode is printed on the top side of the insulating layer such that the electrode is formed in the opening in the insulating layer. The sensor also comprises at least one additional electrode. The electrolyte is then formed on top of the electrodes. A cap is formed over the electrodes and electrolyte. This arrangement may easily be produced using micromachining techniques.Type: GrantFiled: August 30, 2016Date of Patent: April 14, 2020Assignee: Analog Devices GlobalInventors: Alfonso Berduque, Helen Berney, William Allan Lane, Raymond J. Speer, Brendan Cawley, Donal Mcauliffe, Patrick Martin McGuinness
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Publication number: 20200072783Abstract: An integrated ion-sensitive probe is provided. In an example, an ion-sensitive probe can include a semiconductor substrate and a first passive electrode attached to the semiconductor substrate. The first passive electrode can be configured to contact a solution and to provide a first electrical voltage as function of a concentration of an ion within the solution. In certain examples, a passive reference electrode can be co-located on the semiconductor substrate. In some examples, processing electronics can be integrated on the semiconductor substrate.Type: ApplicationFiled: May 15, 2018Publication date: March 5, 2020Inventors: Helen Berney, Alan O'Donnell, Thomas O'Dwyer, Alfonso Berduque
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Publication number: 20190195825Abstract: An electrochemical sensor is provided which may be formed using micromachining techniques commonly used in the manufacture of integrated circuits. This is achieved by forming microcapillaries in a silicon substrate and forming an opening in an insulating layer to allow environmental gases to reach through to the top side of the substrate. A porous electrode is printed on the top side of the insulating layer such that the electrode is formed in the opening in the insulating layer. The sensor also comprises at least one additional electrode. The electrolyte is then formed on top of the electrodes. A cap is formed over the electrodes and electrolyte. This arrangement may easily be produced using micromachining techniques.Type: ApplicationFiled: August 29, 2017Publication date: June 27, 2019Applicant: ANALOG DEVICES GLOBALInventors: Alfonso Berduque, Helen Berney, William Allan Lane, Raymond J. Speer, Brendan Cawley, Donal McAuliffe, Patrick Martin McGuinness
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Patent number: 10288582Abstract: An integrated ion-sensitive probe is provided. In an example, an ion-sensitive probe can include a semiconductor substrate and a first passive electrode attached to the semiconductor substrate. The first passive electrode can be configured to contact a solution and to provide a first electrical voltage as function of a concentration of an ion within the solution. In certain examples, a passive reference electrode can be co-located on the semiconductor substrate. In some examples, processing electronics can be integrated on the semiconductor substrate.Type: GrantFiled: January 12, 2016Date of Patent: May 14, 2019Assignee: Analog Devices GlobalInventors: Helen Berney, William Allan Lane, Patrick Martin McGuinness, Thomas G. O'Dwyer
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Patent number: 10224474Abstract: An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer that are connected in series while alternating between the p-type and the n-type thermoelectric elements. The integrated circuit may include first and second substrates each having formed thereon a plurality of thermoelectric legs of a respective type of thermoelectric material. The first and second thermoelectric substrates also may have respective conductors, each coupled to a base of an associated thermoelectric leg and forming a mounting pad for coupling to a thermoelectric leg of the counterpart substrate.Type: GrantFiled: November 9, 2015Date of Patent: March 5, 2019Assignee: Analog Devices, Inc.Inventors: Jane Cornett, Baoxing Chen, William Allan Lane, Patrick M. McGuinness, Helen Berney
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Patent number: 9960336Abstract: An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer that are connected in series while alternating between the p-type and the n-type thermoelectric elements. The integrated circuit may include first and second substrates each having formed thereon a plurality of thermoelectric legs of a respective type of thermoelectric material. The first and second thermoelectric substrates also may have respective conductors, each coupled to a base of an associated thermoelectric leg and forming a mounting pad for coupling to a thermoelectric leg of the counterpart substrate.Type: GrantFiled: November 9, 2015Date of Patent: May 1, 2018Assignee: Analog Devices, Inc.Inventors: Jane Cornett, Baoxing Chen, William Allan Lane, Patrick M. McGuinness, Helen Berney
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Publication number: 20180059044Abstract: An electrochemical sensor is provided which may be formed using micromachining techniques commonly used in the manufacture of integrated circuits. This is achieved by forming microcapillaries in a silicon substrate and forming an opening in an insulating layer to allow environmental gases to reach through to the top side of the substrate. A porous electrode is printed on the top side of the insulating layer such that the electrode is formed in the opening in the insulating layer. The sensor also comprises at least one additional electrode. The electrolyte is then formed on top of the electrodes. A cap is formed over the electrodes and electrolyte. This arrangement may easily be produced using micromachining techniques.Type: ApplicationFiled: August 30, 2016Publication date: March 1, 2018Inventors: Alfonso Berduque, Helen Berney, William Allan Lane, Raymond J. Speer, Brendan Cawley, Donal Mcauliffe, Patrick Martin McGuinness
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Publication number: 20170199148Abstract: An integrated ion-sensitive probe is provided. In an example, an ion-sensitive probe can include a semiconductor substrate and a first passive electrode attached to the semiconductor substrate. The first passive electrode can be configured to contact a solution and to provide a first electrical voltage as function of a concentration of an ion within the solution. In certain examples, a passive reference electrode can be co-located on the semiconductor substrate. In some examples, processing electronics can be integrated on the semiconductor substrate.Type: ApplicationFiled: January 12, 2016Publication date: July 13, 2017Inventors: Helen Berney, William Allan Lane, Patrick Martin McGuinness, Thomas G. O'Dwyer
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Publication number: 20170102355Abstract: It may be desirable to sense the concentration of a gas in another gas. This measurement may be important to warn of impending danger. Gas sensors may be made in batches by a manual process, leading to large variations in sensor performance between batches and indeed between sensors in a batch. This means the sensors often need individual calibration before use. The present approach to sensor design can make use of integrated circuit manufacturing techniques to give rise to sensors with well-matched and reproducible characteristics.Type: ApplicationFiled: October 9, 2015Publication date: April 13, 2017Inventors: Patrick M. McGuinness, Seamus P. Whiston, William A. Lane, Thomas G. O'Dwyer, John Jude O'Donnell, Bernard Stenson, Shane Geary, Helen Berney, Raymond J. Speer
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Publication number: 20170025594Abstract: An embodiment of a thermoelectric device may include a plurality of thermoelectric cells disposed between first and second planes. Each of the thermoelectric cells may include a thermoelectric element formed from a thermoelectric material of a single semiconductor type, the thermoelectric element including a first end, a second end, and a portion extending from the first end to the second end, the portion extending from the first end to the second end including at least two surfaces that face each other; and at least one conductive element electrically connected to and extending away from the second end of the thermoelectric element toward the first end of the thermoelectric element of another thermoelectric cell. Each thermoelectric cell also may further include an insulating element disposed between the at least two surfaces of the thermoelectric element and between portions of the at least one conductive element.Type: ApplicationFiled: July 21, 2015Publication date: January 26, 2017Inventors: Patrick M. McGUINNESS, Helen BERNEY, Jane CORNETT, William Alan LANE, Baoxing CHEN
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Publication number: 20160133816Abstract: An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer that are connected in series while alternating between the p-type and the n-type thermoelectric elements. The integrated circuit may include first and second substrates each having formed thereon a plurality of thermoelectric legs of a respective type of thermoelectric material. The first and second thermoelectric substrates also may have respective conductors, each coupled to a base of an associated thermoelectric leg and forming a mounting pad for coupling to a thermoelectric leg of the counterpart substrate.Type: ApplicationFiled: November 9, 2015Publication date: May 12, 2016Inventors: Jane Cornett, Baoxing Chen, William Allan Lane, Patrick M. McGuinness, Helen Berney
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Publication number: 20160064637Abstract: An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer that are connected in series while alternating between the p-type and the n-type thermoelectric elements. The integrated circuit may include first and second substrates each having formed thereon a plurality of thermoelectric legs of a respective type of thermoelectric material. The first and second thermoelectric substrates also may have respective conductors, each coupled to a base of an associated thermoelectric leg and forming a mounting pad for coupling to a thermoelectric leg of the counterpart substrate.Type: ApplicationFiled: November 9, 2015Publication date: March 3, 2016Inventors: Jane Cornett, Baoxing Chen, William Allan Lane, Patrick M. McGuinness, Helen Berney