Patents by Inventor Helen Chu

Helen Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5633868
    Abstract: A method and apparatus for managing a virtual circuit network is disclosed that enables hand-off management. An illustrative embodiment establishes a virtual ciruit by receiving, at a radio port, a virtual circuit identifier from a wireless terminal and attaching the virtual circuit identifier to an OA&M cell. The radio port then transmits, over a pre-established unidirectional virtual ciruit, the OA&M cell to a radio port manager.
    Type: Grant
    Filed: October 17, 1994
    Date of Patent: May 27, 1997
    Assignee: Lucent Technologies Inc.
    Inventors: John H. Baldwin, Helen Chu, Bharat T. Doshi, Subrahmanyam Dravida, Sanjiv Nanda, Philip A. Treventi
  • Patent number: 5539744
    Abstract: A telecommunications architecture using ATM based technology is disclosed that supports wireless communications. Some embodiments of the present invention may provide a mechanism for hand-off, which has fewer costs and restrictions than other hand-off schemes the in the prior art. In one embodiment a plurality of virtual circuit identifiers is created such that each is unambiquously associated with the others. The virtual circuit identifiers are then transmitted to a wireless terminal, via a first radio port. Subsequently, the wireless terminal transmits one of the virtual circuit identifiers to second radio port.
    Type: Grant
    Filed: February 28, 1995
    Date of Patent: July 23, 1996
    Assignee: AT&T Corp.
    Inventors: Helen Chu, Bharat T. Doshi, Subrahmanyam Dravida, Sanjiv Nanda, Anil S. Sawkar, Kazem A. Sohraby
  • Patent number: 5443512
    Abstract: An orthopaedic implant device is formed from, or defined by, a combination of different materials. These devices include a body metal component and a porous metal surface layer for intimate contact with bone and a polymer in the form of a casing that includes adhesive characteristics for attachment to the body metal component and the porous metal layer. The preferred polymer casing is polyaryletherketone.
    Type: Grant
    Filed: August 24, 1993
    Date of Patent: August 22, 1995
    Assignee: Zimmer, Inc.
    Inventors: Jack E. Parr, Roy D. Crowninshield, Thirumalai N. C. Devanathan, Helen Chu