Abstract: An integrated circuit package includes a rectangular base, and a continuous sidewall which extends upwardly from the periphery of the base. Microelectronic circuit components are mounted on the base in a cavity defined within the sidewall. A domed lid includes a resilient central domed portion which arches above the cavity. A peripheral edge portion of the lid extends downwardly into the cavity by a small distance, adjacent to the inner surface of the sidewall. A lip extends outwardly from the edge portion and is sealingly welded at its periphery to the upper surface of the sidewall. The joint between the lip and edge portion is resilient and acts as a hinge, such that when a force or pressure is applied to the domed portion, the edge portion rotates about the hinge into abutment with the inner surface of the sidewall. This transfers a major component of the applied force to the sidewall, and resists deflection of the domed portion into the cavity.

Abstract: An electrical circuit component is temporarily fixed to a temporary substrate. Electrical contacts on the component are interconnected with corresponding contacts on the test substrate by lead wires or ribbons using a bonding wedge that forms the lead wires into a gull-wing shape with central portions thereof formed adjacent to edge portions of the component. The component is subjected to a test procedure while fixed to the temporary substrate via signals applied to the contacts thereof. The lead wires are then severed near their connection to the temporary substrate, and the component with the remaining lead wire portions attached is removed from the test substrate. The lead wires are sufficiently stiff and/or are adhered to the edge portions of the component with an adhesive so as retain their shapes after removal of the component from the temporary substrate.