Patents by Inventor Helen L. Yeh

Helen L. Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of applying flex tape protective coating onto a flex product
    Patent number: 5546655
    Abstract: A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.
    Type: Grant
    Filed: October 25, 1994
    Date of Patent: August 20, 1996
    Assignee: International Business Machines Corporation
    Inventors: Claudius Feger, Teresita O. Graham, Kurt R. Grebe, Alphonso P. Lanzetta, John J. Liutkus, Linda C. Matthew, Michael J. Palmer, Nelson R. Tanner, Ho-Ming Tong, Charles H. Wilson, Helen L. Yeh
  • Flex tape protective coating
    Patent number: 5360946
    Abstract: The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.
    Type: Grant
    Filed: September 17, 1991
    Date of Patent: November 1, 1994
    Assignee: International Business Machines Corporation
    Inventors: Claudius Feger, Teresita O. Graham, Kurt R. Grebe, Alphonso P. Lanzetta, John J. Liutkus, Linda C. Matthew, Michael J. Palmer, Nelson R. Tanner, Ho-Ming Tong, Charles H. Wilson, Helen L. Yeh
  • Palladium enhanced soldering and bonding of semiconductor device contacts
    Patent number: 5225711
    Abstract: The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion.
    Type: Grant
    Filed: March 11, 1991
    Date of Patent: July 6, 1993
    Assignee: International Business Machines Corporation
    Inventors: Chin-An Chang, Nicholas G. Koopman, Judith M. Roldan, Steven Strickman, Kamalesh K. Srivastava, Helen L. Yeh
  • Palladium enhanced fluxless soldering and bonding of semiconductor device contacts
    Patent number: 5048744
    Abstract: The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion.
    Type: Grant
    Filed: May 14, 1990
    Date of Patent: September 17, 1991
    Assignee: International Business Machines Corporation
    Inventors: Chin-An Chang, Nicholas G. Koopman, Judith M. Roldan, Steven Strickman, Kamalesh K. Srivastava, Helen L. Yeh
  • In-line process monitors for thin film wiring
    Patent number: 4933635
    Abstract: A thin film region 14 of a multichip carrier 10 is provided with at least one fabrication process or tooling monitor for monitoring the quality of the fabrication process during the sequential formation of the layers of the region 14. The process monitor is formed with a desired layer or layers of the thin film region, such as by a photolithographic process. A centrally disposed active wiring region 30 of a layer is surrounded by peripherally disposed fabrication monitor sites 32. The sites 32 can be located such that they do not occupy or interfere with the surface area required for the wiring region 30 while still being disposed near enough to the wiring region such that the electrical and physical characteristics of the thin film is substantially the same. Four different types of thin film fabrication process monitors are disclosed, including a line/via monitor, a dielectric monitor, a laser assisted repair monitor and a laser assisted engineering change monitor.
    Type: Grant
    Filed: December 22, 1988
    Date of Patent: June 12, 1990
    Assignee: International Business Machines Corporation
    Inventors: Alina Deutsch, Modest M. Oprysko, John J. Ritsko, Laura B. Rothman, Helen L. Yeh, Atilio Zupicich
  • Reduction atmosphere workpiece joining
    Patent number: 4632295
    Abstract: A workpiece is joined to a substrate by employing solder and applying diol and/or polyol and/or ether derivative thereof to the substrate. The workpiece is placed in contact with the diol and/or polyol and the resulting assembly is heated in a reducing atmosphere.
    Type: Grant
    Filed: August 12, 1985
    Date of Patent: December 30, 1986
    Assignee: International Business Machines Corporation
    Inventors: Vlasta A. Brusic, Peter J. Elmgren, Charles J. Owen, David W. Sissenstein, Jr., Helen L. Yeh