Patents by Inventor Helen Lai Wa Chan

Helen Lai Wa Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7819013
    Abstract: An apparatus and method for detecting the oscillation amplitude of a bonding tool includes a sensing unit disposed adjacent to and at a distance from the bonding tool. The sensing unit includes a pair of electrodes, a piezoelectric sensing layer located between the pair of electrodes, and a membrane associated with the piezoelectric sensing layer. The piezoelectric sensing layer becomes sensitive to ultrasonic vibrations and generates electrical voltage signals after being activated by a poling process. An optional pre-amplifier is used to amplify the signals generated from the sensing unit, and an oscilloscope is used to further process the signals.
    Type: Grant
    Filed: July 5, 2006
    Date of Patent: October 26, 2010
    Assignee: The Hong Kong Polytechnic University
    Inventors: Helen Lai Wa Chan, Tin Yan Lam, Chen Chao, Kin Wing Kwok
  • Patent number: 7462960
    Abstract: An ultrasonic transducer driver has a giant magnetostrictive element, a fastener for holding the giant magnetostrictive element under mechanical pressure, a first field generator for providing a magnetic bias field, a second field generator for providing a magnetic drive field and a magnetic circuit for channelling the magnetic fields in the magnetostrictive element. An ultrasonic transducer for a bonding apparatus has a horn having a bonding tool at its smaller end and a mounting barrel adjoined onto it. The driver coupled to the larger end of the horn.
    Type: Grant
    Filed: January 5, 2004
    Date of Patent: December 9, 2008
    Assignee: The Hong Kong Polytechnic University
    Inventors: Siu Wing Or, Chung Sheung Yung, Helen Lai Wa Chan-Wong
  • Publication number: 20080128527
    Abstract: A liquid dispensing apparatus, including a hollow horn having a central cylindrical cavity and a piezoelectric ring having a central opening. The piezoelectric ring is coupled to the hollow horn such that the central opening is in communication with one end of the central cylindrical cavity. A mesh screen is provided at the other end of the central cylindrical cavity. Liquid is delivered to an inner surface of the mesh screen through the central opening of the piezoelectric ring and the central cylindrical cavity of the hollow horn, and is dispensed from an outer surface of the mesh screen in the form of fine liquid droplets.
    Type: Application
    Filed: December 5, 2006
    Publication date: June 5, 2008
    Applicant: THE HONG KONG POLYTECHNIC UNIVERSITY
    Inventors: Helen Lai Wa Chan, Wencheng Xu, Kwok Ho Lam, Kin Wing Kwok
  • Publication number: 20080006674
    Abstract: An apparatus and method for detecting the oscillation amplitude of a bonding tool includes a sensing unit disposed adjacent to and at a distance from the bonding tool. The sensing unit includes a pair of electrodes, a piezoelectric sensing layer located between the pair of electrodes, and a membrane associated with the piezoelectric sensing layer. The piezoelectric sensing layer becomes sensitive to ultrasonic vibrations and generates electrical voltage signals after being activated by a poling process. An optional pre-amplifier is used to amplify the signals generated from the sensing unit, and an oscilloscope is used to further process the signals.
    Type: Application
    Filed: July 5, 2006
    Publication date: January 10, 2008
    Inventors: Helen Lai Wa Chan, Tin Yan Lam, Chen Chao, Kin Wing Kwok
  • Patent number: 7298060
    Abstract: The operational frequency of existing magnetoelectric materials having metallic or ceramic magnetostrictive materials and ceramic piezoelectric materials may be limited to a few kilohertz due to the presence of eddy-current losses in the metallic magnetostrictive phase. Further, these materials may be difficult to machine and fabricate due to their brittleness. Additionally, it may be difficult to tailor and optimize the properties (i.e., magnetoelectric voltage coefficient ?E, etc.) of the devices. This invention provides a magnetoelectric element including at least one set of alternating piezoelectric layers and magnetostrictive composite layers. The magnetostrictive composite layer includes at least one magnetostrictive material dispersed in first concentrated zones within a first polymer matrix, wherein all of the concentrated zones are orientated along a first direction. It is found that the conversion efficiency (i.e., ?E) varies in accordance with applied magnetic control field Hcontrol.
    Type: Grant
    Filed: February 21, 2007
    Date of Patent: November 20, 2007
    Assignee: The Hong Kong Polytechnic University
    Inventors: Siu Wing Or, Helen Lai Wa Chan-Wong
  • Patent number: 7199495
    Abstract: The operational frequency of existing magnetoelectric materials having metallic or ceramic magnetostrictive materials and ceramic piezoelectric materials may be limited to a few kilohertz due to the presence of eddy-current losses in the metallic magnetostrictive phase. Further, these materials may be difficult to machine and fabricate due to their brittleness. Additionally, it may be difficult to tailor and optimize the properties (i.e., magnetoelectric voltage coefficient ?E, etc.) of the devices. This invention provides a magnetoelectric element including at least one set of alternative piezoelectric layer and magnetostrictive composite layer. The magnetostrictive composite layer includes at least one magnetostrictive material dispersed in first concentrated zones within a first polymer matrix, wherein all of said concentrated zones are orientated along a first direction. It is found that the conversion efficiency (i.e., ?E) varies in accordance with applied magnetic control field Hcontrol.
    Type: Grant
    Filed: April 1, 2004
    Date of Patent: April 3, 2007
    Assignee: The Hong Kong Polytechnic University
    Inventors: Siu Wing Or, Helen Lai Wa Chan-Wong
  • Patent number: 6871770
    Abstract: A transducer for a wire bonding apparatus is formed of two separate parts sandwiching therebetween a plurality of piezoelectric elements. One of the two parts is the amplifying horn, and by selecting appropriate sizes and shapes for the two parts, vibrational energy can be concentrated at the distal end of the amplifying horn where the bonding tool is located.
    Type: Grant
    Filed: April 18, 2003
    Date of Patent: March 29, 2005
    Assignee: ASM Assembly Automation Limited
    Inventors: Hing Leung Li, Kelvin Ming Wai Ng, Helen Lai Wa Chan, Peter Chou Kee Liu
  • Publication number: 20040035912
    Abstract: A transducer for a wire bonding apparatus is formed of two separate parts sandwiching therebetween a plurality of piezoelectric elements. One of the two parts is the amplifying horn, and by selecting appropriate sizes and shapes for the two parts, vibrational energy can be concentrated at the distal end of the amplifying horn where the bonding tool is located.
    Type: Application
    Filed: April 18, 2003
    Publication date: February 26, 2004
    Inventors: Hing Leung LI, Kelvin Ming Wai NG, Helen Lai Wa CHAN, Peter Chou Kee LIU
  • Publication number: 20030062395
    Abstract: A transducer for a wire bonding apparatus is formed of two separate parts sandwiching therebetween a plurality of piezoelectric elements. One of the two parts is the amplifying horn, and by selecting appropriate sizes and shapes for the two parts, vibrational energy can be concentrated at the distal end of the amplifying horn where the bonding tool is located.
    Type: Application
    Filed: October 1, 2001
    Publication date: April 3, 2003
    Inventors: Hing Leung Li, Kelvin Ming Wai NG, Helen Lai Wa Chan, Peter Chou Kee Liu
  • Patent number: 6286747
    Abstract: A bonding tool has a driver of piezoelectric elements in a stack. A sensor is positioned and held in the stack and includes a piezoelectric element sandwiched between electrodes and insulating wafers. Voltage developed between the electrodes is monitored and used to determine a bonding parameter, including the amplitude and duration of each ultrasonic burst.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: September 11, 2001
    Assignee: Hong Kong Polytechnic University
    Inventors: Helen Lai Wa Chan, Siu Wing Or, Chung Loong Choy
  • Patent number: 6190497
    Abstract: A bonding tool for applying pressure and ultrasonic energy simultaneously to join miniature components together includes an ultrasonic driver having four composite wafers separated by electrodes. Such bonding tools are known that use wafers made of wholly of ceramic material. By using wafers having four sector parts of ceramic material separated by layers of polymer as shown, bonding tools are provided with broader bandwidth operation and reduced spurious resonance modes.
    Type: Grant
    Filed: April 23, 1999
    Date of Patent: February 20, 2001
    Assignee: The Hong Kong Polytechnic University
    Inventors: Helen Lai Wa Chan, Siu Wing Or, Kei Chun Cheng, Chung Loong Choy