Patents by Inventor Helfried Zabel

Helfried Zabel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for manufacturing an electronic assembly, electronic assembly manufactured with the method or in the apparatus
    Patent number: 8735218
    Abstract: A method of producing an electronic module with at least one electronic component and one carrier. A structure is provided on the carrier so that the electronic component can take a desired target position relative to the structure. The structure is coated with a liquid meniscus suitable for receiving the electronic component. Multiple electronic components are provided at a delivery point for the electronic components. The carrier, with the structure, is moved nearby and opposite to the delivery point, where the delivery point delivers one of the electronic components without contact, while the structure on the carrier is moving near the delivery point, so that after a phase of free movement the electronic component at least partly touches the material, and the carrier, with the structure, is moved to a downstream processing point, while the electronic component aligns itself to the structure on the liquid meniscus.
    Type: Grant
    Filed: December 1, 2009
    Date of Patent: May 27, 2014
    Assignee: Muehlbauer AG
    Inventors: Michael Max Mueller, Helfried Zabel, Hans-Peter Monser
  • METHOD AND APPARATUS FOR MANUFACTURING AN ELECTRONIC ASSEMBLY, ELECTRONIC ASSEMBLY MANUFACTURED WITH THE METHOD OR IN THE APPARATUS
    Publication number: 20110291302
    Abstract: A method of producing an electronic module with at least one electronic component and one carrier. A structure is provided on the carrier so that the electronic component can take a desired target position relative to the structure. The structure is coated with a liquid meniscus suitable for receiving the electronic component. Multiple electronic components are provided at a delivery point for the electronic components. The carrier, with the structure, is moved nearby and opposite to the delivery point, where the delivery point delivers one of the electronic components without contact, while the structure on the carrier is moving near the delivery point, so that after a phase of free movement the electronic component at least partly touches the material, and the carrier, with the structure, is moved to a downstream processing point, while the electronic component aligns itself to the structure on the liquid meniscus.
    Type: Application
    Filed: December 1, 2009
    Publication date: December 1, 2011
    Applicant: Mühlbauer AG
    Inventors: Michael Max Mueller, Helfried Zabel, Hans-Peter Monser